Method of producing untethered, stretchable, and wearable electronic devices

Patent metadata

Field	Value
Publication number	US-11729904-B2
Application number	US-202016866153-A
Country	US
Kind code	B2
Filing date	May 4, 2020
Priority date	Sep 12, 2017
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

An efficient fabrication technique, including an optional design step, is used to create highly customizable wearable electronics. The method of fabrication utilizes rapid laser machining and adhesion-controlled soft materials. The method produces well-aligned, multi-layered materials created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. The design step can be used to create a 3D device that conforms to different-shaped body parts. These techniques are applied using commercially available materials. These methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

First claim

What is claimed is:

1. A method of fabricating a stretchable wearable electronic device comprising:
patterning a material affixed to a first substrate with a laser cutter to create a first layer;
creating at least one additional layer on a second substrate;
joining the first layer and the at least one additional layer through contact adhesion,
wherein the contact adhesion is greater than a force of adhesion between at least one of the first layer and the first substrate and the at least one additional layer and the second substrate;

releasing at least one of the first layer from the first substrate and the at least one additional layer from the second substrate;
integrating an IC component with the first layer and at least one additional layer to form a base; and
affixing the base to a stretchable substrate through a contact adhesion between the base and the stretchable substrate.

2. The method of claim 1 , wherein the stretchable substrate is reusable.

3. The method of claim 1 , wherein the stretchable substrate comprises a fabric.

4. The method of claim 1 , wherein at least one of the first substrate and the second substrate comprises polydimethylsiloxane.

5. The method of claim 4 , further comprising:
adjusting a modulus of elasticity of at least one of the first substrate and the second substrate to affect adhesion.

6. The method of claim 1 , further comprising:
patterning at least one of the first substrate and the second substrate to affect adhesion.

7. The method of claim 1 , wherein the material is an acrylic tape.

8. The method of claim 1 , wherein joining the first layer and the at least one additional layer comprises:
aligning the first substrate of the first layer and the second substrate of the at least one additional layer with a locating mechanism.

9. The method of claim 8 , wherein the locating mechanism comprises a slot on each of the first substrate and the second substrate and a pin.

10. The method of claim 1 , wherein the first layer comprises a heat-sensitive film.

11. A method of fabricating a stretchable wearable electronic device comprising:
identifying a target region on a three-dimensional scan of a user's body for placement of the wearable electronic device;
developing an origami model of a surface in the target region;
using the origami model to construct a pattern;
based on the pattern, cutting a material affixed to a first substrate with a laser cutter to create a first layer;
creating at least one additional layer on a second substrate;
joining the first layer and the at least one additional layer through contact adhesion,
integrating an IC component with the first layer and the at least one additional layer to form a base; and
affixing the base to a stretchable substrate through a contact adhesion between the base and the stretchable substrate.

12. The method of claim 11 , wherein the contact adhesion between the first layer and the at least one additional layer is greater than a force of adhesion between at least one of the first layer and the first substrate and the at least one additional layer and the second substrate.

13. The method of claim 11 , wherein the stretchable substrate is reusable.

Assignees

• Univ Carnegie Mellon

Inventors

• Markvicka Eric J
• Bartlett Michael D
• Majidi Carmel
• Yao Lining
• Wang Guanyun
• Lee Yi-Chin
• Laput Gierad

Classifications

• H05K1/0283 Primary

  Stretchable printed circuits · CPC title

• H05K1/038

  Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/0026

  by laser ablation · CPC title

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title