Soft, multilayered electronics for wearable devices and methods to produce the same

Patent metadata

Field	Value
Publication number	US-10645803-B2
Application number	US-201816129717-A
Country	US
Kind code	B2
Filing date	Sep 12, 2018
Priority date	Sep 12, 2017
Publication date	May 5, 2020
Grant date	May 5, 2020

Abstract

Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

First claim

What is claimed is:

1. A method of fabricating a wearable electronic device comprising:
affixing a material to a first substrate;
patterning the material with a laser cutter;
removing excess material from the first substrate to create a first layer;
creating at least one additional layer on an additional substrate,
wherein a force of adhesion between the first substrate and the first layer is not equal to a force of adhesion between the additional substrate adhesion and the at least one additional layer;

contacting the first layer and the at least one additional layer,
wherein the first layer releases from the first substrate or the at least one additional layer releases from the additional substrate upon contact; and

integrating an IC component.

2. The method of claim 1 , wherein at least one of the first substrate and the additional substrate comprises polydimethylsiloxane.

3. The method of claim 2 , further comprising:
adjusting the modulus of elasticity of at least one of the first substrate and the additional substrate to affect its adhesion.

4. The method of claim 1 , further comprising:
patterning at least one of the first substrate and the additional substrate to affect its adhesion.

5. The method of claim 1 , wherein the material is an acrylic tape.

6. The method of claim 1 , wherein joining the first layer and the at least one additional layer comprises:
aligning the first substrate of the first layer and the additional substrate of the at least one additional layer with a locating mechanism.

7. The method of claim 6 , wherein the locating mechanism comprises a slot on each of the first substrate and the additional substrate and a pin.

8. A soft multilayer electronic device comprising:
a first layer of material patterned in a laser cutter and affixed to a first substrate;
at least one additional layer of material patterned in the laser cutter, wherein the at least one additional layer of material is affixed to the first layer via adhesion,
wherein the at least one additional layer is transferred from a second sub state,
wherein the second substrate has a lower adhesion energy than the first substrate.

9. The soft multilayer device of claim 8 , wherein the first layer of material is a dielectric tape and the at least one additional layer is a conductive tape.

Assignees

• Univ Carnegie Mellon

Inventors

• Majidi Carmel
• Bartlett Michael D
• Markvicka Eric J

Classifications

• A61B5/6825

  Hand · CPC title

• H05K3/0032

  of organic insulating material · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• A61B2562/164

  the sensor is mounted in or on a conformable substrate or carrier · CPC title

• H05K1/0283 Primary

  Stretchable printed circuits · CPC title