Substrate processing apparatus and method of processing substrate

Patent metadata

Field	Value
Publication number	US-11723259-B2
Application number	US-202117336657-A
Country	US
Kind code	B2
Filing date	Jun 2, 2021
Priority date	Jun 10, 2020
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

A method of processing a substrate includes loading the substrate to which a processing liquid is adhered, inside a processing container, removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed, supplying a second organic solvent to the water-repellent substrate, and drying the substrate by volatilizing the second organic solvent adhering to the substrate.

First claim

What is claimed is:

1. A method of processing a substrate, comprising:
loading the substrate to which a processing liquid is adhered, inside a processing container;
removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate;
subsequently, removing the first organic solvent adhering to the substrate by supplying a third organic solvent different from the first organic solvent to the substrate; subsequently, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed;
subsequently, removing an unreacted water repellent from the substrate by supplying the third organic solvent to the substrate;
subsequently, supplying a second organic solvent to the water-repellent substrate; and
drying the substrate by volatilizing the second organic solvent adhering to the substrate,
wherein the first organic solvent has an OH group and the third organic solvent does not have the OH group, and
wherein the second organic solvent has an OH group.

2. The method of claim 1 , wherein when the water repellent is supplied to the substrate, a mixture of the water repellent and the first organic solvent is supplied to the substrate.

3. The method of claim 2 , wherein supplying the second organic solvent to the substrate includes removing an unreacted water repellent from the substrate.

4. The method of claim 2 , wherein the first organic solvent and the second organic solvent are isopropyl alcohol (IPA).

5. The method of claim 1 , wherein supplying the second organic solvent to the substrate includes removing an unreacted water repellent from the substrate.

6. The method of claim 5 , wherein the first organic solvent and the second organic solvent are isopropyl alcohol (IPA).

7. The method of claim 1 , wherein when the water repellent is supplied to the substrate, a mixture of the water repellent and the third organic solvent is supplied to the substrate.

8. The method of claim 1 , wherein supplying the second organic solvent to the substrate includes replacing the third organic solvent adhering to the substrate with the second organic solvent, and
wherein the second organic solvent has a lower boiling point than the third organic solvent.

9. The method of claim 1 , wherein the first organic solvent and the second organic solvent are isopropyl alcohol (IPA), and
wherein the third organic solvent is propylene glycol monomethyl ether acetate (PGMEA).

10. The method of claim 1 , wherein the first organic solvent, the second organic solvent, and the water repellent are sprayed onto the substrate in a form of mist or shower.

11. The method of claim 1 , wherein the water repellent has a Si—N bond.

12. The method of claim 1 , wherein the processing liquid contains water.

Assignees

• Tokyo Electron Ltd

Inventors

• Hiroshiro Koukichi
• Nonaka Jun
• Koyama Kazuya
• Nakamori Mitsunori

Classifications

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title