Graded interface in Bragg reflector

US11720013B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11720013-B2
Application numberUS-202217708593-A
CountryUS
Kind codeB2
Filing dateMar 30, 2022
Priority dateApr 19, 2019
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.

First claim

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What is claimed is: 1. A method of manufacturing a Bragg reflector comprising alternating layers of first reflective material layer A and second reflective material layer B, the method comprising: depositing a uniform first reflective material layer A on a substrate; forming a first graded interfacial layer on the uniform first reflective material layer A, wherein the first graded interfacial layer comprises a thickness and a density gradient that changes across the thickness; depositing a uniform second reflective material layer B on the first graded interfacial layer; and forming a second graded interfacial layer on the uniform second reflective material layer B, wherein the second graded interfacial layer comprises a thickness and a density gradient that changes across the thickness, wherein the Bragg reflector is formed in a physical vapor deposition (PVD) chamber comprising a first material target A and a second material target B, wherein the PVD chamber comprises a rotating shield with a pair of shield holes comprising a first shield hole and a second shield hole. 2. The method of claim 1 , wherein the first graded interfacial layer and the second graded interfacial layer each comprises the first material A and the second material B and a composition gradient that changes across the thickness. 3. The method of claim 2 , wherein the first reflective material layer A comprises one of molybdenum (Mo) or silicon (Si), and the second reflective material layer B comprises the other of molybdenum (Mo) or silicon (Si). 4. The method of claim 2 , wherein the first graded interfacial layer and the second graded interfacial layer independently comprise MoSi x . 5. The method of claim 2 , wherein depositing the uniform first reflective material layer A and depositing the uniform second reflective material layer B comprises using a constant deposition power and a constant gas pressure. 6. The method of claim 2 , wherein forming the first graded interfacial layer and forming the second graded interfacial layer comprises reducing deposition power gradually and simultaneously increasing gas pressure. 7. A method of manufacturing a Bragg reflector, the method comprising: depositing a uniform first reflective material layer A on a substrate; forming a first graded interfacial layer on the first reflective material layer A, wherein the first graded interfacial layer comprises a gradient composition; depositing a uniform second reflective material layer B on the first graded interfacial layer; and forming a second graded interfacial layer on the second reflective material layer B, wherein the second graded interfacial layer comprises a gradient composition, wherein the first graded interfacial layer and the second graded interfacial layer each comprises the first material A and the second material B. 8. The method of claim 7 , wherein the Bragg reflector is formed in a physical vapor deposition (PVD) chamber comprising a first material target A and a second material target B, wherein the PVD chamber comprises a rotating shield with a pair of shield hole comprising a first shield hole and a second shield hole. 9. The method of claim 8 , wherein the uniform first reflective material layer A is deposited by exposing the first material target A through the first shield hole and sputtering the first material target A, the uniform second reflective material layer B is formed by exposing the second material target B through the second shield hole, and the first graded interfacial layer and the second graded interfacial layer are formed by exposing the first material target A through the first shield hole and the second material target B through the second shield hole and co-sputtering the first material target A and the second material target B. 10. The method of claim 9 , wherein the uniform first reflective material layer A comprises one of molybdenum (Mo) or silicon (Si), the uniform second reflective material layer B comprises the other of molybdenum (Mo) or silicon (Si), and the first graded interfacial layer and the second graded interfacial layer each comprises MoSi x . 11. The method of claim 9 , wherein depositing the uniform first reflective material layer A comprises applying a constant deposition power to a first material target A and a constant gas pressure and depositing the uniform second reflective material layer B comprises using a constant deposition power applied on a second material target B and a constant gas pressure. 12. The method of claim 9 , wherein forming the first graded interfacial layer comprises reducing deposition power applied to the first material target A and simultaneously gradually increasing deposition power applied to the second material target B. 13. The method of claim 12 , wherein forming the second graded interfacial layer comprises gradually reducing deposition power applied to the second material target B and simultaneously gradually increasing the deposition power applied to the first material target A. 14. The method of claim 8 , wherein the graded interfacial layers have a first region rich in material A adjacent to the first layer and a second region rich in material B adjacent to the second layer. 15. The method of claim 10 , wherein where x is a number from 0 to 2, and the material A comprises Si and the material B comprises Mo. 16. The EUV mask blank of claim 15 , wherein the graded interfacial layers have a first region rich in Mo adjacent to the first layer and a second region rich in Si adjacent to the second layer.

Assignees

Inventors

Classifications

  • Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements · CPC title

  • Details of optical elements · CPC title

  • Reflectors · CPC title

  • G03F1/24Primary

    Reflection masks; Preparation thereof · CPC title

  • Ultraviolet [UV] mirrors (apparatus for microlithography exposure G03F7/70; X-ray multilayer structures G21K1/06) · CPC title

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What does patent US11720013B2 cover?
A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification G03F1/24. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).