Methods for a web-based CMP system

Patent metadata

Field	Value
Publication number	US-11717936-B2
Application number	US-201916552901-A
Country	US
Kind code	B2
Filing date	Aug 27, 2019
Priority date	Sep 14, 2018
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

First claim

The invention claimed is:

1. A substrate processing method, comprising:
winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon, the polishing system having a platform body having a platen disposed in a surface thereof, and a plurality of web guides fixedly attached to opposite ends of the platform body, wherein each of the web guides have a respective opening formed therethrough;
measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll;
determining a tensioning torque to apply to a supply roll using the polishing article advancement length measurement; and
tensioning the polishing article by applying the tensioning torque to the supply roll around which a first portion of the polishing article is wound.

2. The method of claim 1 , wherein the polishing system comprises:
a take-up roll assembly comprising the first spindle, the take-up roll disposed on the first spindle, a first actuator coupled to the first spindle, and the encoder wheel; and
a supply roll assembly comprising a second spindle, the supply roll disposed on the second spindle, and a second actuator coupled to the second spindle,
wherein the polishing article extends between the take-up roll and the supply roll in a machine direction, and
wherein the polishing article advancement length is measured in the machine direction.

3. The method of claim 2 , wherein determining the tensioning torque comprises:
measuring an angular displacement of the take-up roll used to wind the used portion of the polishing article, having the polishing article advancement length, onto the take-up roll; and
calculating a supply roll radius based on the polishing article advancement length and a corresponding angular displacement of the take-up roll.

4. The method of claim 2 , wherein the tensioning torque is determined using the polishing article advancement length and a corresponding angular displacement of the supply roll.

5. The method of claim 2 , wherein the polishing system further comprises:
a platen interface membrane disposed on the platen,
wherein a portion of the polishing article that extends between the take-up roll and the supply roll is positioned on the platen interface membrane during substrate processing.

6. The method of claim 5 , further comprising urging a to be polished surface of a substrate against the polishing article in the presence of a polishing fluid.

7. The method of claim 5 , further comprising flowing a first fluid into a region disposed between the polishing article and the platen interface membrane.

8. The method of claim 5 , wherein the platen interface membrane further comprises a releasable bonding layer that is fixedly secured to the platen, and on which a portion of the portion of the polishing article that extends between the take-up roll and the supply roll is positioned during the substrate processing.

9. The method of claim 8 , wherein the releasable bonding layer comprises silicone, a natural rubber, or synthetic rubber.

10. The method of claim 8 , wherein the platen interface membrane further comprises a subpad material layer that is disposed between the releasable bonding layer and the platen.

11. The method of claim 10 , wherein the subpad material layer comprises a fibrous mat that comprises polypropylene, polyethylene, or polyester.

12. The method of claim 5 , wherein the platen interface membrane comprises a subpad material layer that is that is fixedly secured to the platen and disposed between the portion of the polishing article and the platen during substrate processing.

13. The method of claim 12 , wherein the subpad material layer comprises a fibrous mat that comprises polypropylene, polyethylene, or polyester.

14. The method of claim 1 , further comprising flowing a second fluid through the respective openings into regions disposed between web guides and the polishing article disposed thereon.

15. The method of claim 1 , wherein the polishing article comprises a non-porous thermoplastic material.

16. The method of claim 15 , the polishing article comprises polyethylene (PE), polypropylene (PP), polystyrene, polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), polyvinyl alcohol (PVA), polyamides (e.g., nylon), polytetrafluoroethylene (PTFE), polyamides, or polyurethane.

Assignees

• Applied Materials Inc

Inventors

• Sklyar Dmitry
• Oh Jeonghoon
• Alonzo Gerald J
• Domin Jonathan
• Zuniga Steven M
• Gurusamy Jay

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title

• B24B49/04 Primary

  involving measurement of the workpiece at the place of grinding during grinding operation · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• B24B57/04

  for feeding of solid grinding, polishing or lapping agents · CPC title