Low temperature co-fireable dielectric materials

US11715869B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11715869-B2
Application numberUS-202117364325-A
CountryUS
Kind codeB2
Filing dateJun 30, 2021
Priority dateSep 8, 2017
Publication dateAug 1, 2023
Grant dateAug 1, 2023

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite material for use as a radiofrequency component comprising: a low temperature fireable outer material, the low temperature fireable outer material having a garnet or scheelite structure and having the composition Bi 1-2x A 2x V 1-x M x O 4 , A being Li, Na, K, or combinations thereof, M being Mo, W, or combinations thereof, and x being between about 0 and about 0.45; and a high dielectric inner material located within the outer material, the high dielectric inner material having a dielectric constant above 30, the low temperature fireable outer material and the high dielectric inner material being configured to be co-fired together at temperature between 650-900° C. 2. The composite material of claim 1 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 3. A radio frequency circulator or isolator including the composite material of claim 1 . 4. The composite material of claim 1 wherein the low temperature fireable outer material and the high dielectric inner material are configured to be co-fired together at temperature without the use of adhesive or glue. 5. The composite material of claim 1 wherein x is between 0 and 0.45. 6. The composite material of claim 1 wherein the low temperature fireable outer material has a sintering temperature above 700° C. 7. A method of forming a composite material for use as an isolator or circulator in a radiofrequency device, the method comprising: providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure and having the composition Bi 1-2x A 2x V 1-x M x O 4 , A being Li, Na, K, or combinations thereof, M being Mo, W, or combinations thereof, and x being between about 0 and about 0.45; entering a high dielectric inner material within an aperture in the low temperature fireable outer material, the high dielectric inner material having a dielectric constant above 30; and co-firing the low temperature fireable outer material and the high dielectric inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric inner material without the use of adhesive or glue. 8. The method of claim 7 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 9. The method of claim 7 further comprising forming a radio frequency circulator or isolator including the composite material formed by the co-firing. 10. The method of claim 7 wherein the co-firing is performed without the use of adhesive or glue. 11. The method of claim 7 wherein x is between 0 and 0.45. 12. The method of claim 7 wherein the low temperature fireable outer material has a sintering temperature above about 700° C. 13. A composite material for use as a radiofrequency component comprising: a low temperature fireable outer material, the low temperature fireable outer material having a garnet or scheelite structure and having the composition C 2 BiD 2 V 3 O 12 , C being Li, Na, K, or combinations thereof, and D being Mg, Zn, Co, Ni, Cu, or combinations thereof; and a high dielectric inner material located within the outer material, the high dielectric inner material having a dielectric constant above 30, the low temperature fireable outer material and the high dielectric inner material being configured to be co-fired together at temperature between 650-900° C. without the use of adhesive or glue. 14. The composite material of claim 13 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 15. A radio frequency circulator or isolator including the composite material of claim 13 . 16. The composite material of claim 13 wherein the low temperature fireable outer material and the high dielectric inner material are configured to be co-fired together at temperature without the use of adhesive or glue. 17. A method of forming a composite material for use as an isolator or circulator in a radiofrequency device, the method comprising: providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure and having the composition C 2 BiD 2 V 3 O 12 , C being Li, Na, K, or combinations thereof and D being Mg, Zn, Co, Ni, Cu, or combinations thereof; entering a high dielectric inner material within an aperture in the low temperature fireable outer material, the high dielectric inner material having a dielectric constant above 30; and co-firing the low temperature fireable outer material and the high dielectric inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric inner material without the use of adhesive or glue. 18. The method of claim 17 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 19. The method of claim 17 further comprising forming a radio frequency circulator or isolator including the composite material formed by the co-firing. 20. The method of claim 17 wherein the co-firing is performed without the use of adhesive or glue.

Assignees

Inventors

Classifications

  • using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies · CPC title

  • H01P1/36Primary

    Isolators · CPC title

  • B32B18/00Primary

    Layered products essentially comprising ceramics, e.g. refractory products · CPC title

  • Compositions containing one or more ferrites of the group comprising manganese or zinc and one or more ferrites of the group comprising nickel, copper or cobalt · CPC title

  • Other ferrites containing rare earth metals, e.g. rare earth ferrite garnets · CPC title

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What does patent US11715869B2 cover?
Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesi…
Who is the assignee on this patent?
Skyworks Solutions Inc
What technology area does this patent fall under?
Primary CPC classification H01P1/36. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 01 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).