Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites
US-2018166763-A1 · Jun 14, 2018 · US
US11715869B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11715869-B2 |
| Application number | US-202117364325-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 30, 2021 |
| Priority date | Sep 8, 2017 |
| Publication date | Aug 1, 2023 |
| Grant date | Aug 1, 2023 |
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Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.
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What is claimed is: 1. A composite material for use as a radiofrequency component comprising: a low temperature fireable outer material, the low temperature fireable outer material having a garnet or scheelite structure and having the composition Bi 1-2x A 2x V 1-x M x O 4 , A being Li, Na, K, or combinations thereof, M being Mo, W, or combinations thereof, and x being between about 0 and about 0.45; and a high dielectric inner material located within the outer material, the high dielectric inner material having a dielectric constant above 30, the low temperature fireable outer material and the high dielectric inner material being configured to be co-fired together at temperature between 650-900° C. 2. The composite material of claim 1 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 3. A radio frequency circulator or isolator including the composite material of claim 1 . 4. The composite material of claim 1 wherein the low temperature fireable outer material and the high dielectric inner material are configured to be co-fired together at temperature without the use of adhesive or glue. 5. The composite material of claim 1 wherein x is between 0 and 0.45. 6. The composite material of claim 1 wherein the low temperature fireable outer material has a sintering temperature above 700° C. 7. A method of forming a composite material for use as an isolator or circulator in a radiofrequency device, the method comprising: providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure and having the composition Bi 1-2x A 2x V 1-x M x O 4 , A being Li, Na, K, or combinations thereof, M being Mo, W, or combinations thereof, and x being between about 0 and about 0.45; entering a high dielectric inner material within an aperture in the low temperature fireable outer material, the high dielectric inner material having a dielectric constant above 30; and co-firing the low temperature fireable outer material and the high dielectric inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric inner material without the use of adhesive or glue. 8. The method of claim 7 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 9. The method of claim 7 further comprising forming a radio frequency circulator or isolator including the composite material formed by the co-firing. 10. The method of claim 7 wherein the co-firing is performed without the use of adhesive or glue. 11. The method of claim 7 wherein x is between 0 and 0.45. 12. The method of claim 7 wherein the low temperature fireable outer material has a sintering temperature above about 700° C. 13. A composite material for use as a radiofrequency component comprising: a low temperature fireable outer material, the low temperature fireable outer material having a garnet or scheelite structure and having the composition C 2 BiD 2 V 3 O 12 , C being Li, Na, K, or combinations thereof, and D being Mg, Zn, Co, Ni, Cu, or combinations thereof; and a high dielectric inner material located within the outer material, the high dielectric inner material having a dielectric constant above 30, the low temperature fireable outer material and the high dielectric inner material being configured to be co-fired together at temperature between 650-900° C. without the use of adhesive or glue. 14. The composite material of claim 13 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 15. A radio frequency circulator or isolator including the composite material of claim 13 . 16. The composite material of claim 13 wherein the low temperature fireable outer material and the high dielectric inner material are configured to be co-fired together at temperature without the use of adhesive or glue. 17. A method of forming a composite material for use as an isolator or circulator in a radiofrequency device, the method comprising: providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure and having the composition C 2 BiD 2 V 3 O 12 , C being Li, Na, K, or combinations thereof and D being Mg, Zn, Co, Ni, Cu, or combinations thereof; entering a high dielectric inner material within an aperture in the low temperature fireable outer material, the high dielectric inner material having a dielectric constant above 30; and co-firing the low temperature fireable outer material and the high dielectric inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric inner material without the use of adhesive or glue. 18. The method of claim 17 wherein the low temperature fireable outer material has a dielectric constant between 20 and 80. 19. The method of claim 17 further comprising forming a radio frequency circulator or isolator including the composite material formed by the co-firing. 20. The method of claim 17 wherein the co-firing is performed without the use of adhesive or glue.
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