High-temperature superconducting striated tape combinations

Patent metadata

Field	Value
Publication number	US-11711983-B2
Application number	US-202217975465-A
Country	US
Kind code	B2
Filing date	Oct 27, 2022
Priority date	Dec 14, 2017
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

First claim

What we claim is:

1. A high-temperature superconducting striated tape combination of the process comprising the steps of:
placing a first striated high-temperature superconducting tape with a patterned side facing up and with indexed holes onto an alignment jig using indexing pins as a guide;
placing a solder release tape with preforms and with indexed holes and wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape on the alignment jig;
pressing the solder release tape with preforms wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape;
separating the release tape from the solder preforms;
allowing the solder preforms to remain bonded to the first striated high-temperature superconducting tape;
providing a laser-patterned double sided adhesive with windows and with a first liner and a second liner and with indexed holes;
removing the first liner of the double sided adhesive;
aligning the laser-patterned double sided adhesive over the indexing pins of the alignment jig with adhesive side facing the first striated high-temperature superconducting tape;
placing the laser-patterned double sided adhesive onto the first striated high-temperature superconducting tape;
wherein the windows of the laser-patterned double sided adhesive are aligned with the solder preforms;
removing the second liner from the laser-patterned double sided adhesive;
aligning indexing holes of a second striated high-temperature superconducting tape with patterned side facing the first striated high-temperature superconducting tape over the indexing pins of the alignment jig;
placing the second striated high-temperature superconducting tape onto the laser-patterned double sided adhesive;
applying pressure and/or heat to the first striated high-temperature superconducting tape and to the laser-patterned double sided adhesive and to the second striated high-temperature superconducting tape; and
bonding the first striated high-temperature superconducting tape and the laser-patterned double sided adhesive and the second striated high-temperature superconducting tape.

2. The high-temperature superconducting striated tape combination of claim 1
wherein the alignment jig is a device or structure that aligns and assembles separate components on a 2-D planar or 3-D curved surface with precision.

3. The high-temperature superconducting striated tape combination of claim 2
wherein the indexed hole matches a complementary index in the alignment jig.

4. The high-temperature superconducting striated tape combination of claim 1
wherein the tape, double sided adhesive, and solder preforms are aligned and bonded with less than 50 microns spatial tolerance.

5. The high-temperature superconducting striated tape combination of claim 1
wherein mechanical adhesion between the first striated high-temperature superconducting tape and the second striated high-temperature superconducting tape is provided by the double-sided adhesive.

6. The high-temperature superconducting striated tape combination of claim 1
wherein electrical isolation or resistance between the first striated high-temperature superconducting tape and the second striated high-temperature superconducting tape is provided by the double-sided adhesive.

7. The high-temperature superconducting striated tape combination of claim 1
wherein the double-sided adhesive operates from a temperature minimum of −185° C. to a temperature maximum of at least 260° C.

8. The high-temperature superconducting striated tape combination of claim 1
wherein the step of bonding the first striated high-temperature superconducting tape and the laser-patterned double sided adhesive and the second striated high-temperature superconducting tape occurs when the solder melts.

9. The high-temperature superconducting striated tape combination of claim 1
wherein electrical continuity or conduction between electronic circuitry located on the first striated high-temperature superconducting tape and electronic circuitry located on the second striated high-temperature superconducting tape is provided by solder preforms.

10. The high-temperature superconducting striated tape combination of claim 1
wherein the laser patterned double sided adhesive is laser-cut with a pattern of through-hole windows that matches the pattern of solder preforms.

11. The high-temperature superconducting striated tape combination of claim 1
wherein the method comprises a reel-to-reel system.

12. The high-temperature superconducting striated tape combination of claim 1
wherein the temperature is at about 200° F.

13. The high-temperature superconducting striated tape combination of claim 1
wherein the pressure is at about 250 PSI for <10 seconds.

Assignees

• Us Gov Sec Navy

Inventors

• Prestigiacomo Joseph C
• Auyeung Raymond C Y
• Osofsky Michael S

Classifications

• H10P72/7408

  the auxiliary support including alignment aids · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/53

  using optical controlling means · CPC title