Fabric-based items with electrical component arrays

Patent metadata

Field	Value
Publication number	US-11710703-B2
Application number	US-202117472223-A
Country	US
Kind code	B2
Filing date	Sep 10, 2021
Priority date	Aug 20, 2015
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.

First claim

What is claimed is:

1. An apparatus comprising:
a fabric substrate that includes conductive yarn and contact pads formed from the conductive yarn; and
electrical components mounted on the fabric substrate, wherein the electrical components are electrically coupled to the contact pads and wherein each of the electrical components comprises an interposer to which multiple light-emitting diode semiconductor dies are mounted.

2. The apparatus defined in claim 1 , further comprising solder with which the contact pads of the fabric substrate are soldered to solder pads in the electrical components.

3. The apparatus defined in claim 1 , further comprising:
a flexible printed circuit having an array of openings, wherein the electrical components are attached to the flexible printed circuit and the flexible printed circuit is attached to the fabric substrate.

4. The apparatus defined in claim 1 , further comprising a bead of translucent polymer covering each of the electrical components.

5. The apparatus defined in claim 4 , further comprising:
a clear polymer layer, wherein the beads of translucent polymer are embedded within the clear polymer layer.

6. The apparatus defined in claim 1 , further comprising:
a flexible printed circuit having an array of openings and metal traces that form solder pads, wherein the electrical components have solder pads that are soldered to the solder pads on the flexible printed circuit.

7. The apparatus defined in claim 1 , wherein the conductive yarn is exposed on a surface of the fabric substrate.

8. The apparatus defined in claim 1 , wherein each one of the light-emitting diode semiconductor dies has a footprint of less than 100 microns×100 microns.

9. The apparatus defined in claim 1 , wherein an integrated circuit is mounted on a given interposer in addition to the multiple light-emitting diode semiconductor dies.

10. The apparatus defined in claim 1 , wherein a sensor is mounted on a given interposer in addition to the multiple light-emitting diode semiconductor dies.

11. The apparatus defined in claim 1 , wherein an actuator is mounted on a given interposer in addition to the multiple light-emitting diode semiconductor dies.

Assignees

• Apple Inc

Inventors

• Sunshine Daniel D
• Drzaic Paul S
• Podhajny Daniel A
• Kindlon David M
• Kim Hoon Sik
• Crews Kathryn P
• Hsu Yung-Yu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title