Sonobuoy volumetric array deployment module

Patent metadata

Field	Value
Publication number	US-11694668-B2
Application number	US-202016884637-A
Country	US
Kind code	B2
Filing date	May 27, 2020
Priority date	May 27, 2020
Publication date	Jul 4, 2023
Grant date	Jul 4, 2023

Abstract

A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.

First claim

What is claimed is:

1. A deployment module for a sensor array having a plurality of sensors and a cable connecting the plurality of sensors, the deployment module comprising:
a deployment body formed of a shape memory alloy that is expandable to hold the cable and retain a shape of the sensor array after deployment; and
a support shell configured to support the sensor array and the expandable deployment body in a stowage state before deployment, the support shell having spaced walls configured to retain the cable separately from the plurality of sensors;
wherein the spaced walls are formed in a helical pattern and define discrete slots that each accommodate a segment of the cable corresponding to one of the plurality of sensors.

2. The deployment module according to claim 1 , wherein the deployment body is formed of a superelastic material having stored spring energy when in the stowage state.

3. The deployment module according to claim 2 , wherein the deployment body is spinnable to release the spring energy whereby the deployment body expands from a compacted shape to an expanded shape.

4. The deployment module according to claim 1 , wherein the deployment body includes a central hub and a plurality of springs that each have a fixed end secured to the central hub.

5. The deployment module according to claim 4 , wherein the deployment body includes a plurality of arms that are secured to opposite ends of the plurality of springs relative to the central hub and are configured to engage the cable.

6. The deployment module according to claim 5 , wherein the plurality of arms includes clamping portions to engage the cable.

7. The deployment module according to claim 4 , wherein the central hub has a plurality of blades, wherein the fixed end of each of the plurality of springs is held between two adjacent blades of the plurality of blades.

8. The deployment module according to claim 1 further comprising a plurality of deployment bodies and a plurality of support shells, wherein the plurality of support shells and the plurality of deployment bodies are axially stacked.

9. The deployment module according to claim 8 , wherein each of the plurality of support shells has a same diameter that is between 10 and 13 centimeters and a same height that is between 2 and 6 centimeters.

10. The deployment module according to claim 8 further comprising a central electro-mechanical cable that supports each of the plurality of deployment bodies.

11. The deployment module according to claim 1 in combination with the sensor array, wherein each of the plurality of sensors includes a flexible piezo element, a clamshell body that surrounds the piezo element, and a plastic membrane sealed onto the clamshell body over the piezo element.

12. The deployment module of claim 1 , wherein the shape memory alloy is a superelastic shape memory alloy.

13. The deployment module according to claim 1 , wherein the support shell further comprises recessed windows.

14. A deployment module for a sensor array having a plurality of sensors and a cable connecting the plurality of sensors, the deployment module comprising:
a deployment body formed of a shape memory alloy that is expandable to hold the cable and retain a shape of the sensor array after deployment; and
a support shell configured to support the sensor array and the expandable deployment body in a stowage state before deployment, the support shell having spaced walls configured to retain the cable separately from the plurality of sensors;
wherein the deployment body includes a central hub and a plurality of springs that each have a fixed end secured to the central hub;
wherein the central hub has a plurality of blades; and
wherein the fixed end of each of the plurality of springs is held between two adjacent blades of the plurality of blades.

15. The deployment module according to claim 14 , wherein the deployment body includes a plurality of arms that are secured to opposite ends of the plurality of springs relative to the central hub and are configured to engage the cable.

16. The deployment module according to claim 15 , wherein the plurality of arms includes clamping portions to engage the cable.

Assignees

• Raytheon Co

Inventors

• Carlsten Curtis B
• Koehler Frederick B
• Gaudette Jason E
• Willey Peter M

Classifications

• H04B11/00

  Transmission systems employing ultrasonic, sonic or infrasonic waves · CPC title

• B63B22/003 Primary

  adapted for being launched from an aircraft or water vehicle;, e.g. with brakes deployed in the water · CPC title

• G10K11/006 Primary

  Transducer mounting in underwater equipment, e.g. sonobuoys · CPC title

• B63B2022/006

  specially adapted for measuring or watch purposes · CPC title

• G10K11/008

  Arrays of transducers (seismic streamers, see G01V1/20) · CPC title