Shape memory alloy subsurface array deployment mechanism

Patent metadata

Field	Value
Publication number	US-11047370-B1
Application number	US-202016884755-A
Country	US
Kind code	B1
Filing date	May 27, 2020
Priority date	May 27, 2020
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

A deployment body for a sensor array includes at least one superelastic spring formed of a shape memory alloy (SMA) material that enables activation of the deployment body. The SMA spring is configured to expand from a stowed position in which the SMA spring is wound around a central hub of the deployment body to a deployed position in which the SMA spring is extended in a radially outward direction relative to the central hub. A stiffness of the SMA spring enables the SMA spring to hold cables of the sensor array and maintain a deployed shape of the sensor array, which may be a volumetric array. Using the SMA material is advantageous in that the material is tuned to maintain superelasticity based on at least one of an intended operating temperature and a desired expansion ratio of stowed to deployed diameter of the deployment body.

First claim

What is claimed is:

1. A deployment body engageable with a sensor array for deploying the sensor array, the deployment body comprising:
a central hub; and
at least one spring connected between the central hub and the sensor array, the at least one spring being expandable from a stowed position in which the at least one spring is wound around the central hub and a deployed position in which the at least one spring is expanded radially outwardly from the central hub to maintain a deployed shape of the sensor array,
wherein the at least one spring is formed of a shape memory alloy material that enables passive activation of the at least one spring in which the at least one spring expands from the stowed position toward the deployed position.

2. The deployment body according to claim 1 , wherein the at least one spring has stored strain energy when in the stowed position, and wherein the stored strain energy is released during the passive activation of the at least one spring.

3. The deployment body according to claim 1 , wherein the shape memory alloy material is configured for the passive activation when the shape memory alloy material is heated.

4. The deployment body according to claim 3 , wherein the shape memory alloy material is configured for the passive activation in response to a current being applied to the shape memory alloy material.

5. The deployment body according to claim 1 , wherein the shape memory alloy material is a nickel-titanium alloy.

6. The deployment body according to claim 1 , wherein the at least one spring includes a plurality of springs.

7. The deployment body according to claim 6 , wherein the plurality of springs includes at least two springs that are configured to counterrotate relative to each other during the passive activation.

8. The deployment body according to claim 7 , wherein the plurality of springs includes a plurality of clockwise rotating springs and a plurality of counterclockwise rotating springs.

9. The deployment body according to claim 6 , wherein the plurality of springs are all configured to rotate in a same rotational direction during the passive activation.

10. The deployment body according to claim 1 , wherein the at least one spring includes a plurality of radial springs and a plurality of circumferential springs that have different elasticity.

11. The deployment body according to claim 10 further comprising a plurality of staves, wherein the plurality of circumferential springs are connected between the plurality of staves for spacing the plurality of staves when in the deployed position.

12. The deployment body according to claim 11 , wherein each of the plurality of radial springs is connected between the central hub and one of the plurality of staves.

13. The deployment body according to claim 6 , wherein the plurality of springs are arranged in a symmetrical pattern when in the deployed position.

14. The deployment body according to claim 1 , wherein the at least one spring includes only one spring that is rotatable in one rotational direction.

15. A deployment module comprising:
a sensor array having a plurality of sensors and a cable connecting the plurality of sensors; and
a deployment body arranged adjacent the sensor array and having a central hub, and a plurality of springs connected between the central hub and the cable of the sensor array, the plurality of springs being expandable from a stowed position in which the plurality of springs are wound around the central hub and a deployed position in which the plurality of springs are expanded radially outwardly from the central hub to maintain a deployed shape of the sensor array,
wherein the plurality of springs are formed of a shape memory alloy material that enables passive activation of the plurality of springs in which at least two of the plurality of springs are configured to counter-rotate relative to each other during expansion from the stowed position toward the deployed position.

16. A method of forming a deployment body that is engageable with a sensor array for deploying the sensor array, the method comprising:
forming at least one spring of a shape memory alloy material;
tuning the shape memory alloy material to maintain a predetermined superelasticity based on at least one of an operating temperature for the deployment body and a speed of actuation of the deployment body;
securing the at least one spring to a central hub, the at least one spring being expandable from a stowed position in which the at least one spring is wound around the central hub and a deployed position in which the at least one spring is expanded radially outwardly from the central hub to maintain a deployed shape of the sensor array; and
winding the at least one spring around the central hub.

17. The method according to claim 16 further comprising:
selecting a spin rate for the deployment body; and
determining a cant angle between the at least one spring and the central hub based on the spin rate; and
securing the at least one spring to the central hub at the determined cant angle.

18. The method according to claim 16 further comprising adjusting a stiffness of the at least one spring by at least one of:
forming a protrusion in the at least one spring to change a cross-section of the at least one spring; and
changing a thickness of the at least one spring.

19. The method according to claim 16 further comprising:
forming the at least one spring of the shape memory alloy material at a first temperature; and
winding the at least one spring around the central hub at a second temperature different than the first temperature.

20. The method according to claim 16 , wherein winding the at least one spring around the central hub includes bending the at least one spring at a minimal bend radius to prevent plastic deformation of the shape memory alloy material.

Assignees

• Raytheon Co

Inventors

• Koehler Frederick B
• Carlsten Curtis B
• Lyman Ward D
• Gaudette Jason E

Classifications

• F03G7/06145

  Springs · CPC title

• F03G7/064

  characterised by its use · CPC title

• B63B22/003 Primary

  adapted for being launched from an aircraft or water vehicle;, e.g. with brakes deployed in the water · CPC title

• F03G7/0636

  with several elements connected in parallel · CPC title

• G10K11/008

  Arrays of transducers (seismic streamers, see G01V1/20) · CPC title