Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-11679447-B2
Application number	US-202016861709-A
Country	US
Kind code	B2
Filing date	Apr 29, 2020
Priority date	Apr 30, 2019
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a space in which a substrate is treated, a support unit supporting the substrate inside the chamber, a laser unit irradiating laser to an edge region of the substrate, a vision unit capturing the edge region of the substrate to measure an offset value of the substrate, and an adjustment unit adjusting an irradiation location of the laser based on the offset value of the substrate.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a chamber configured to provide a space in which a substrate is treated;
a support unit configured to support the substrate inside the chamber;
a laser unit configured to irradiate laser to an edge region of the substrate;
a vision unit configured to capture the edge region of the substrate to measure an offset value of the substrate; and
an adjustment unit including a body that is configured to rotate to adjust an irradiation location of the laser based on the offset value of the substrate,
wherein the adjustment unit generates a profile for the offset value corresponding to a spin angle of the substrate and adjusts the irradiation location of the laser based on the profile with respect to a slope of the body that is calculated using the offset value and a distance between the substrate and the adjustment unit.

2. The substrate treating apparatus of claim 1 , wherein the adjustment unit further includes:
a light reflection unit provided inside the body and configured to coaxially change an irradiation direction of the laser and an imaging direction of the vision unit; and
a controller configured to adjust the irradiation location of the laser by driving the body.

3. The substrate treating apparatus of claim 2 , wherein the controller changes the irradiation location of the laser by adjusting the slope of the body.

4. The substrate treating apparatus of claim 3 , wherein the controller calculates a shortest distance between a predetermined reference point and an end of the substrate as the offset value of the substrate in an image captured by the vision unit and adjusts the slope of the body based on the offset value and the distance between the body and the substrate.

5. The substrate treating apparatus of claim 2 , wherein the controller changes the irradiation location of the laser by changing a location of the body.

6. The substrate treating apparatus of claim 5 , wherein the controller moves the location of the body by a distance corresponding to the offset value of the substrate.

7. The substrate treating apparatus of claim 4 , wherein the support unit includes a spin head for rotating the substrate, and
wherein the adjustment unit is synchronously controlled together with the spin head based on the offset value of the substrate.

Assignees

• Semes Co Ltd

Inventors

• Park Soo Young
• Kwon Ohyeol
• Ahn Jun Keon
• Lee Jung Hwan

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P90/128

  by edge treatment, e.g. chamfering · CPC title

• H10P72/53

  using optical controlling means · CPC title

• B23K26/0823

  Devices involving rotation of the workpiece · CPC title

• H01L21/681

  Electricity · mapped topic