Etch bias characterization and method of using the same

Patent metadata

Field	Value
Publication number	US-11675274-B2
Application number	US-201816484582-A
Country	US
Kind code	B2
Filing date	Feb 21, 2018
Priority date	Feb 24, 2017
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

A method involving determining an etch bias for a pattern to be etched using an etch step of a patterning process based on an etch bias model, the etch bias model including a formula having a variable associated with a spatial property of the pattern or with an etch plasma species concentration of the etch step, and including a mathematical term including a natural exponential function to the power of a parameter that is fitted or based on an etch time of the etch step; and adjusting the patterning process based on the determined etch bias.

First claim

The invention claimed is:

1. A method, comprising:
determining, by a hardware computer and based on an etch bias model, an etch bias for a pattern to be etched using an etch step of a patterning process, the etch bias model comprising a formula including a variable associated with a spatial property of the pattern or with an etch plasma species concentration of the etch step, and including a mathematical term comprising a natural exponential function to the power of a parameter that is fitted or based on an etch time of the etch step; and
adjusting the patterning process based on the determined etch bias.

2. The method of claim 1 , wherein the parameter of the exponential function is fitted or based on the etch time and a reaction constant for the etch step.

3. The method of claim 1 , wherein the variable comprises the spatial property of the pattern and the spatial property of the pattern is an initial pattern element dimension.

4. The method of claim 1 , wherein the variable comprises the spatial property of the pattern and the formula comprises the variable multiplied by the mathematical term.

5. The method of claim 1 , wherein the variable comprises the spatial property of the pattern and the formula comprises a form of CD 0 (e kt −1), where CD 0 is the variable and corresponds to a dimension of the pattern and kt is the parameter that is fitted for the etch time t of the etch step, wherein k is a reaction constant for the etch step.

6. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and the formula further comprises a calibration parameter.

7. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and the formula comprises the variable multiplied by the mathematical term.

8. The method of claim 1 , wherein the variable comprises the etch plasma species concentration wherein the formula comprises a form of k 1 C T0 (e kt −1), wherein k 1 is a calibration parameter, C T0 is the variable and corresponds to the etch plasma species concentration, and kt is the parameter that is fitted for the etch time t of the etch step, wherein k is a reaction constant for the etch step.

9. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and the etch plasma species concentration is defined for an etched area of the pattern within an etched material ambit surrounding an evaluation point on the pattern, wherein the etch plasma species concentration is proportional to the etched area.

10. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and the formula contains a modified form of the Arrhenius equation incorporated in the power of the exponential function.

11. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and the formula incorporates a patterning material concentration in the power of the exponential function.

12. The method of claim 1 , wherein the variable comprises the etch plasma species concentration and wherein the formula has a form comprising

k
1

⁢

C

T
⁢
0

(

e

Ate

-
CR

s

-
1

)

where k 1 is a calibration parameter, C T0 is the variable and corresponds to the etch plasma species concentration, C R is a patterning material concentration, At is the parameter that is fitted for the etch time t of the etch step, wherein A is a frequency factor for the reaction of the etch step and s is a constant for the etch step.

13. The method of claim 1 , further comprising:
collecting, at each of a plurality of sites in a pattern, a value of a spatial property of the pattern; and
fitting, by a hardware computing device and using the values of the spatial property, the formula to generate the parameter.

14. The method of claim 1 , wherein adjusting the patterning process comprises adjusting a border of a region of the patterning device according to the calculated etch bias.

15. A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
determine, based on an etch bias model, an etch bias for a pattern to be etched using an etch step of a patterning process, the etch bias model comprising a formula including a variable associated with a spatial property of the pattern or with an etch plasma species concentration of the etch step, and including a mathematical term comprising a natural exponential function to the power of a parameter that is fitted or based on an etch time of the etch step; and
adjust the patterning process based on the determined etch bias.

16. The computer program product of claim 15 , wherein the parameter of the exponential function is fitted or based on the etch time and a reaction constant for the etch step.

17. The computer program product of claim 15 , wherein the variable comprises the spatial property of the pattern and the spatial property of the pattern is an initial pattern element dimension.

18. The computer program product of claim 15 , wherein the variable comprises the spatial property of the pattern and the formula comprises the variable multiplied by the mathematical term.

19. A method, comprising:
determining, by a hardware computer and based on an etch bias model, an etch bias for a pattern to be etched using an etch step of a patterning process, the etch bias model comprising a function of an etch plasma species spatial concentration and of a patterning material concentration in an exponent in, or of, the function; and
adjusting the patterning process based on the determined etch bias.

20. A computer program product comprising a non-transitory computer readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
determine, based on an etch bias model, an etch bias for a pattern to be etched using an etch step of a patterning process, the etch bias model comprising a function of an etch plasma species spatial concentration and of a patterning material concentration in an exponent in, or of, the function; and
adjust the patterning process based on the determined etch bias.

Assignees

• Asml Netherlands Bv

Inventors

• Fan Yongfa
• Zheng Leiwu
• Feng Mu
• Zhao Qian
• Wang Jen-Shiang

Classifications

• G03F7/705 Primary

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

• G03F7/70625 Primary

  Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

• G03F1/80 Primary

  Etching · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title