Composition for forming resist overlayer film for EUV lithography

Patent metadata

Field	Value
Publication number	US-11675269-B2
Application number	US-201113880470-A
Country	US
Kind code	B2
Filing date	Sep 15, 2011
Priority date	Oct 21, 2010
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

There is provided a composition for forming an EUV resist overlayer film that is used in an EUV lithography process, that does not intermix with the EUV resist, that blocks unfavorable exposure light for EUV exposure, for example, UV light and DUV light and selectively transmits EUV light alone, and that can be developed with a developer after exposure. A composition for forming an EUV resist overlayer film used in an EUV lithography process including a resin containing a naphthalene ring in a main chain or in a side chain and a solvent, in which the resin may include a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group having at least one of these groups as a hydrophilic group.

First claim

The invention claimed is:

1. A method for producing a semiconductor device, the method comprising:
forming an EUV resist film on a substrate;
applying an EUV resist overlayer coating composition onto the resist film and baking the composition to form an EUV resist overlayer film, the EUV resist overlayer coating composition comprising:
a resin containing a naphthalene ring in a main chain or in a side chain; and
an alcoholic solvent for preventing intermixing with the EUV resist film, the alcoholic solvent being one or more selected from the group consisting of 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, tert-amyl alcohol, neopentyl alcohol, 2-methyl-1-butanol, 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol, 3,3-dimethyl-2-butanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol, and cyclohexanol;

exposing the substrate coated with the resist overlayer film and the resist film such that the EUV resist overlayer film blocks UV light and DUV light, which are unfavorable exposure light for EUV exposure, and selectively transmits EUV light alone, the EUV resist overlayer film having a transmittance of DUV light of less than 60% in a wavelength range of from 200 nm to 240 nm and a transmittance of EUV light of 80% or more when a film thickness of the resist overlayer film is 30 nm; and
developing the substrate after the exposure to remove the resist overlayer film and the resist film with a developer,
wherein the resin includes a unit structure of Formula (1) or unit structures of Formula (1) and Formula (2):

where:
each of R 1 and R 3 is independently a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group comprising at least one selected from the group consisting of a hydroxy group, a carboxy group, and a sulfo group;
each of R 2 and R 4 is independently a C 1-10 alkyl group, a C 2-10 alkenyl group, a benzyl group, a phenyl group, a halogen atom, a C 1-10 alkoxy group, a nitro group, a cyano group, a C 1-10 alkylthio group, or a combination of two or more thereof;
Ar 1 is a benzene ring or an anthracene ring;
each of n1 and n2 is independently an integer of 0 to 6; and
each of n3 and n4 is independently an integer of 0 to a maximum number of substituents capable of being present on the benzene ring or the anthracene ring with a proviso that n1 or n1+n3 is at least 1.

2. The method according to claim 1 , wherein the EUV resist overlayer coating composition further comprises an acid compound.

3. The method according to claim 2 , wherein the acid compound is a sulfonic acid compound or a sulfonate ester compound.

4. The method according to claim 2 , wherein the acid compound is an iodonium salt based acid generator or a sulfonium salt based acid generator.

5. The method according to claim 2 , wherein the acid compound is present in an amount of from 0.04 to 5% by mass based on 100% by mass of a total solid content of the composition.

6. The method according to claim 2 , wherein the acid compound is bis(4-tert-butylphenyl)iodonium trifluoromethanesulfonate or triphenylsulfonium trifluoromethanesulfonate.

7. The method according to claim 1 , wherein the EUV resist overlayer coating composition is applied on the EUV resist film that is arranged on the substrate such that the EUV resist film is between the EUV resist overlayer coating composition and the substrate.

8. The method according to claim 1 , wherein the EUV resist overlayer film is arranged on the EUV resist film that is arranged on the substrate during the exposure such that the EUV resist film is between the EUV resist overlayer film and the substrate.

9. The method according to claim 1 , wherein the alcoholic solvent is one or more selected from the group consisting of 1-pentanol, 2-pentanol, 3-pentanol, tert-amyl alcohol, neopentyl alcohol, 2-methyl-1-butanol, 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol, 3,3-dimethyl-2-butanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol, and cyclohexanol.

10. The method according to claim 1 , wherein the alcoholic solvent is one or more selected from the group consisting of 1-pentanol, 2-pentanol, 3-pentanol, tert-amyl alcohol, neopentyl alcohol, 2-methyl-1-butanol, 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 2,3-dimethyl-2-butanol, 3,3-dimethyl-1-butanol, 3,3-dimethyl-2-butanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, and 4-methyl-3-pentanol.

11. The method according to claim 1 , wherein the EUV resist overlayer coating composition comprises a solid content in a range of from 0.1 to 50% by mass.

12. The method according to claim 1 , wherein the developer is alkaline.

13. The method according to claim 1 , wherein the exposing is further carried out by irradiating light having a wavelength of 300 nm or less in an amount of about 5% in addition to the EUV light.

Assignees

• Sakamoto Rikimaru
• Ho Bangching
• Endo Takafumi
• Nissan Chemical Ind Ltd

Inventors

• Sakamoto Rikimaru
• Ho Bangching
• Endo Takafumi

Classifications

• C08G8/10

  with phenol · CPC title

• G03F7/091

  characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement · CPC title

• G03F7/11 Primary

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• G03F7/2039

  X-ray radiation · CPC title

• C08G8/08 Primary

  of formaldehyde, e.g. of formaldehyde formed in situ · CPC title