Structural adhesive compositions

Patent metadata

Field	Value
Publication number	US-11674062-B2
Application number	US-201916507931-A
Country	US
Kind code	B2
Filing date	Jul 10, 2019
Priority date	Dec 10, 2015
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

First claim

We claim:

1. An adhesive composition comprising:
an epoxy compound;
a polymeric compound comprising at least two aminimide functional groups, wherein the polymeric compound reacts with the epoxy compound upon exposure to a temperature of at least 100° C.; wherein the polymeric compound is present in an amount of 2-8% by weight based on total weight of the adhesive composition;
rubber particles having a core/shell structure; and
a secondary latent catalyst;
wherein the composition comprises a one-component composition and has less than a 100% increase in viscosity when stored at 25° C. for 90 days.

2. The adhesive composition of claim 1 , wherein the epoxy compound is present in an amount of 50% to 90% by weight based on total composition weight.

3. The adhesive composition of claim 1 , wherein the epoxy comprises an epoxy-capped polyester.

4. The adhesive composition of claim 1 , wherein the polymeric compound comprises a reaction product of reactants comprising a polyepoxide, a hydrazine comprising a trivalent nitrogen, and a reactant comprising a carbonyl group.

5. The adhesive composition of claim 1 , wherein the polymeric compound further comprises at least one additional functional group.

6. The adhesive composition of claim 1 , further comprising an amidine salt.

7. A method for forming a bonded substrate comprising:
applying the adhesive composition of claim 1 to a first substrate;
contacting a second substrate to the adhesive composition such that the adhesive composition is located between the first substrate and the second substrate; and
curing the adhesive composition.

8. An adhesive comprising the composition of claim 1 in a cured state.

9. The adhesive composition of claim 1 , wherein the at least two aminimide functional groups comprise an anionic nitrogen bonded to a cationic nitrogen and a carbonyl group.

10. The adhesive composition of claim 1 , wherein the at least two aminimide functional groups comprise the formula

wherein R and R′ may be the same or different and may be an alkyl group or an aryl group.

Assignees

• Ppg Ind Ohio Inc

Inventors

• Chao Tien-Chieh
• Nakajima Masayuki
• Zhou Hongying
• Swarup Shanti
• Desai Umesh C

Classifications

• C08G59/1455

  Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/44

  Amides · CPC title

• C08G59/1477

  containing nitrogen · CPC title

• C08G59/4042

  Imines; Imides · CPC title