Thermally conductive resin and thermal interface material comprising the same
US-10329468-B2 · Jun 25, 2019 · US
Polyamideimide resin composition and flourine-based coating material
US11674039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11674039-B2 |
| Application number | US-201716486355-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 20, 2017 |
| Priority date | Feb 20, 2017 |
| Publication date | Jun 13, 2023 |
| Grant date | Jun 13, 2023 |
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- Title
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Abstract
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Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polyamideimide resin composition comprising: (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, (C) water, and a basic compound, wherein the polyamideimide resin composition excludes N-formylmorpholine, an acid value of the polyamideimide resin (A), composed of a combination of carboxyl groups and other carboxyl groups formed as a result of ring-opening of acid anhydride groups, is within a range from 10 to 80 mgKOH/g, and the basic compound is included in an amount of 2.5 to 10 equivalents, relative to the acid value of the polyamideimide resin (A). 2. The polyamideimide resin composition according to claim 1 , wherein a number average molecular weight of the polyamideimide resin (A) is within a range from 5,000 to 50,000. 3. The polyamideimide resin composition according to claim 1 , wherein an amount of the water (C) is at least 10% by mass of the composition.
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Classifications
characterised by the solvent(s) used · CPC title
containing fluorine atoms · CPC title
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title
Polyamide-imides · CPC title
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Frequently asked questions
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- What does patent US11674039B2 cover?
- Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
- Who is the assignee on this patent?
- Hitachi Chemical Co Ltd, Resonac Corp
- What technology area does this patent fall under?
- Primary CPC classification C08G73/1035. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 13 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).