Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film

Patent metadata

Field	Value
Publication number	US-9850347-B2
Application number	US-201314417083-A
Country	US
Kind code	B2
Filing date	Jul 30, 2013
Priority date	Aug 1, 2012
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

First claim

The invention claimed is:

1. A polyamic acid resin composition comprising (a) polyamic acid and (b) a compound as represented by chemical formula (1):
Z V) k   (1)

wherein Z is a divalent or higher valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2) below, and k is an integer of 2 or more,

wherein δ represents oxygen or sulfur atom, W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

2. The polyamic acid resin composition as described in claim 1 , wherein W in chemical formula (2) is represented by any one of chemical formulae (3) to (10):

wherein R 21 to R 28 are independently a hydrocarbon group containing 1 to 10 carbon atoms or an organic group containing 1 to 10 carbon atoms and comprising hydrogen and carbon as essential elements and 1 to 10 other atoms of elements selected from the group of boron, oxygen, sulfur, nitrogen, phosphorus, silicon, and halogens.

3. The polyamic acid resin composition as described in claim 1 , wherein V in chemical formula (1) is represented by any one of chemical formulae (11) to (13):

4. The polyamic acid resin composition as described in claim 1 , wherein k in chemical formula (1) is an integer of 2 or 3.

5. The polyamic acid resin composition as described in claim 1 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):

wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.

6. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 1 .

7. A production method for polyimide film comprising a step for imidizing the polyamic acid resin composition as described in claim 1 .

8. A coated glass substrate produced by coating a glass substrate with a varnish containing the polyamic acid resin composition as described in claim 1 and removing the solvent by drying.

9. A glass substrate coated with polyimide film produced by heating the coated glass substrate as described in claim 8 at a temperature of 180° C. to 600° C.

10. A production method for a glass substrate coated with polyimide film comprising a step for imidizing, by heating, the coated glass substrate as described in claim 8 .

11. The polyamic acid resin composition as described in claim 2 , wherein V in chemical formula (1) is represented by any one of chemical formulae (11) to (13):

12. The polyamic acid resin composition as described in claim 2 , wherein k in chemical formula (1) is an integer of 2 or 3.

13. The polyamic acid resin composition as described in claim 3 , wherein k in chemical formula (1) is an integer of 2 or 3.

14. The polyamic acid resin composition as described in claim 2 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):

wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.

15. The polyamic acid resin composition as described in claim 3 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):

wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.

16. The polyamic acid resin composition as described in claim 4 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):

wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.

17. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 2 .

18. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 3 .

19. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 4 .

20. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 5 .

Assignees

• Toray Industries

Inventors

• Miyazaki Daichi
• Tomikawa Masao

Classifications

• C08J5/18

  Manufacture of films or sheets · CPC title

• C08G73/1053

  with oxygen only in the tetracarboxylic moiety · CPC title

• C08G69/32 Primary

  from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound · CPC title

• C03C17/32

  with synthetic or natural resins (C03C17/30 takes precedence) · CPC title

• C08G73/1035

  from tetracarboxylic acids or derivatives and diisocyanates · CPC title