Polishing head system and polishing apparatus

Patent metadata

Field	Value
Publication number	US-11673222-B2
Application number	US-202117206652-A
Country	US
Kind code	B2
Filing date	Mar 19, 2021
Priority date	Mar 26, 2020
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

First claim

What is claimed is:

1. A polishing head system for polishing a workpiece having a film, to be processed, by relatively moving the workpiece and a polishing surface in the presence of a polishing liquid while pressing the workpiece against the polishing surface, comprising:
a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and first piezoelectric elements coupled to the retainer member, a carrier having multiple stepped portions which are in contact with the first piezoelectric elements to fix positions of first piezoelectric elements, and pressing-force measuring devices configured to measure pressing forces generated by the first piezoelectric elements, the pressing-force measuring devices being disposed between the multiple stepped portions and the retainer member; and
a drive-voltage application device configured to apply voltages independently to the first piezoelectric elements.

2. The polishing head system according to claim 1 , wherein the retainer member comprises retainer members coupled to the first piezoelectric elements, respectively.

3. The polishing head system according to claim 1 , further comprising a retainer-member moving device configured to move an entirety of the first piezoelectric elements and the retainer member toward the polishing surface.

4. The polishing head system according to claim 3 , wherein the retainer-member moving device includes an elastic bag forming a first pressure chamber therein and a first gas supply line communicating with the first pressure chamber.

5. The polishing head system according to claim 1 , wherein:
the polishing head further includes coupling members coupled to the first piezoelectric elements, respectively; and
end surfaces of the coupling members are coupled to the retainer member.

6. The polishing head system according to claim 5 , wherein the polishing head further includes a first holding member configured to limit a range of movement of the coupling members in a direction perpendicular to a direction of pressing the retainer member.

7. The polishing head system according to claim 6 , wherein each of the coupling members has an upper protrusion, a lower protrusion, and a body portion located between the upper protrusion and the lower protrusion, a width of the body portion is smaller than widths of the upper protrusion and the lower protrusion, the holding member has a supporting portion that movably supports the body portion.

8. The polishing head system according to claim 1 , wherein the pressing-force measuring devices are arranged between the multiple stepped portions and the coupling members, respectively.

9. The polishing head system according to claim 1 , wherein the polishing head further includes a voltage distributor electrically coupled to the drive-voltage application device and the first piezoelectric elements, the voltage distributor being configured to distribute the voltage applied from the drive-voltage application device to the first piezoelectric elements.

10. The polishing head system according to claim 1 , wherein the actuator comprises a fluid-pressure type actuator, the fluid-pressure type actuator including an elastic membrane configured to form second pressure chambers and arranged to contact the back surface of the workpiece, and second gas supply lines communicating with the second pressure chambers, respectively.

11. The polishing head system according to claim 1 , wherein the actuator comprises second piezoelectric elements which are arranged so as to apply pressing forces to multiple regions of the workpiece.

12. The polishing head system according to claim 11 , wherein the polishing head further includes pressing members coupled to the second piezoelectric elements, respectively.

13. The polishing head system according to claim 12 , wherein the polishing head further includes a second holding member configured to limit a range of movement of the pressing members in a direction perpendicular to a direction of pressing of the workpiece.

14. The polishing head system according to claim 11 , wherein the second piezoelectric elements are electrically coupled to a voltage distributor which is configured to distribute the voltage applied from the drive-voltage application device to the second piezoelectric elements.

15. A polishing apparatus for polishing a workpiece, comprising:
a polishing table for holding a polishing pad;
a polishing-liquid supply nozzle configured to supply a polishing liquid onto the polishing pad;
a polishing head system; and
an operation controller configured to control operations of the polishing table, the polishing-liquid supply nozzle, and the polishing head system,
the polishing head system including:
a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and first piezoelectric elements coupled to the retainer member, a carrier having multiple stepped portions which are in contact with the first piezoelectric elements to fix positions of first piezoelectric elements, and pressing-force measuring devices configured to measure pressing forces generated by the first piezoelectric elements, the pressing-force measuring devices being disposed between the multiple stepped portions and the retainer member; and
a drive-voltage application device configured to apply voltages independently to the first piezoelectric elements.

16. The polishing apparatus according to claim 15 , further comprising a film-thickness sensor configured to measure a thickness of a film, to be processed, of the workpiece, the film-thickness sensor being arranged in the polishing table.

17. The polishing apparatus according to claim 16 , wherein the operation controller is configured to produce a film-thickness profile of the workpiece from measured values of the film thickness acquired by the film-thickness sensor, and to determine voltage instruction values for the drive-voltage application device based on the film-thickness profile.

18. The polishing apparatus according to claim 16 , wherein the operation controller is configured to determine voltage instruction values for the drive-voltage application device based on a difference between the film-thickness profile and a target film-thickness profile.

19. The polishing apparatus according to claim 15 , further comprising a loading and unloading device configured to allow the polishing head to hold the workpiece thereon.

20. The polishing apparatus according to claim 15 , further comprising an orientation detector configured to detect an orientation of the workpiece in its circumferential direction.

21. A processing system for processing a workpiece, comprising:
the polishing apparatus according to claim 15 for polishing the workpiece;
a cleaning device configured to clean the polished workpiece;
a drying device configured to dry the cleaned workpiece; and
a transporting device configured to transport the workpiece between the polishing apparatus, the cleaning device, and the drying device.

Assignees

• Ebara Corp

Inventors

• Watanabe Katsuhide
• Kobata Itsuki

Classifications

• B24B37/32 Primary

  Retaining rings · CPC title

• B24B49/04

  involving measurement of the workpiece at the place of grinding during grinding operation · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title

• B24B37/11 Primary

  Lapping tools · CPC title