Fluidic die with monitoring circuit fault protection structure

Patent metadata

Field	Value
Publication number	US-11667128-B2
Application number	US-201817046877-A
Country	US
Kind code	B2
Filing date	May 15, 2018
Priority date	May 15, 2018
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

A fluidic die includes fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage. The fluidic die further includes monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including a connection structure and a select transistor and a pulldown transistor connected to the electrode via the connection structure. The connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.

First claim

The invention claimed is:

1. A fluidic die comprising:
a plurality of fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage; and
monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including:
a connection structure; and
a select transistor and a pulldown transistor connected to the electrode via the connection structure, the connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.

2. The fluidic die of claim 1 , the select and pulldown transistors structured to share one of a drain region and a source region, the shared one of the drain and source regions having a first conductivity type implanted in a substrate having a second conductivity type complementary to the first conductivity type and forming a PN junction with the substrate having a first breakdown voltage less than the high voltage, the connection structure including:
a shared contact connecting the shared one of the drain and source regions to the electrode; and
a shunt implant region of the second conductivity type having a greater doping concentration than the substrate, the shunt implant region disposed adjacent to and spaced from the shared one of the drain and source regions and connected to a reference voltage, a pn-junction between the shunt implant region and the shared one of the drain and source regions having a second breakdown voltage less than the high voltage and less than the first breakdown voltage.

3. The fluidic die of claim 1 , the connection structure including a shared contact, the select and pulldown transistors structured to share one of a drain region and a source region connected to the electrode by the shared contact, the shared contact and the shared one of the source and drain regions structured to form an electrically conductive path through the shared one of the drain and source regions from the shared contact to a gate region of at least the select transistor having a path length greater than a minimum process distance to provide an electrical resistance to produce a resistive voltage drop in response to a fault current resulting from a short-circuit of the high-voltage fluid actuator to the electrode so that a fault voltage level at the gate region of the select transistor is below a voltage level at which damage occurs to a gate of the select transistor.

4. The fluidic die of claim 3 , the drain and source regions of the select and pulldown transistors arranged in a column in a substrate, the column extending in a first direction, an electrically conductive path through the shared one of the drain and source regions from the shared contact to a gate region of the pulldown transistor structured to have a path length of a minimum process distance.

5. The fluidic die of claim 3 , the shared contact and the shared one of the source and drain regions structured to form an electrically conductive path through the shared one of the drain and source regions from the shared contact to a gate region of the pulldown transistor having a path length greater than the minimum process length to provide an electrical resistance to produce a resistive voltage drop in response to the fault current so that a fault voltage level at the gate region of the pulldown transistor is below a voltage level at which damage occurs to a gate of the pulldown transistor.

6. The fluidic die of claim 5 , the drain and source regions of the select and pulldown transistors disposed in a column in a substrate extending in a first direction and having a column width in a second direction perpendicular to the first direction, the shared one of the drain and source regions having an extension in the second direction beyond the width of the column on which the shared contact is disposed.

7. The fluidic die of claim 6 , the other of the drain and source region of the select transistor shared with the other of a drain and a source region of a select transistor of an adjacent fluid chamber and having a horizontal extension beyond the width of the column with a corresponding shared contact disposed thereon and connected to sense circuitry of the monitoring circuitry.

8. The fluidic die of claim 6 , the shared one of the drain and source regions having a first conductivity type implanted in a substrate having a second conductivity type complementary to the first conductivity type, the connection structure including a shunt implant region of the second conductivity type and having a greater doping concentration than the substrate, the shunt implant region disposed adjacent to and spaced from the shared one of the drain and source regions proximate to the shared contact, a pn-junction between the shunt implant region and the shared one of the drain and source regions having a breakdown voltage less than the high voltage and greater than a breakdown voltage of a pn-junction between the shared one of the drain and source regions and the substrate, the shunt implant region electrically connected to a reference voltage.

9. The fluidic die of claim 1 , the select and pulldown transistors comprising one of a low-voltage NMOS FET and PMOS FET.

10. A fluidic die comprising:
a fluid chamber including an internal electrode and having a corresponding fluid actuator operating at a high voltage; and
low-voltage monitoring circuitry including:
a select transistor and a pulldown transistor to selectively couple to the electrode via a shared drain region connected to the electrode, the shared drain region comprising an implant of a first conductivity type in a substrate of a second conductivity type; and
a shunt implant region of the second conductivity type, having a greater doping concentration than the substrate, forming a junction with the drain region having a breakdown voltage less than the high voltage and greater than a breakdown voltage of a junction between the drain region and substrate, the shunt implant region to shunt from the drain region to ground at least a portion of a fault current resulting from a short-circuit of the fluid actuator to the electrode.

11. The fluidic die of claim 10 , the shared drain region connected to the electrode by a shared drain contact, a distance through the shared drain region from the shared drain contact to a gate region of the select transistor and a distance from the shared drain contact through the shared drain region to a gate region of the pulldown transistor each equal to a minimum process distance.

12. The fluidic die of claim 10 , the shunt implant region spaced from the shared drain region by a shunt gap, a distance of the shunt gap selected to control a breakdown voltage of the pn-junction between the shared drain region and the shunt implant region.

13. The fluidic die of claim 10 , the shared drain region disposed in the substrate in a column extending in a first direction and including an extension extending beyond a width of the column a second direction perpendicular to the first direction, the shared contact disposed on the extension.

14. A fluidic die comprising:
a plurality of fluid chambers, each including a cavitation plate and each having a corresponding fluid actuator operating at a high voltage; and
monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each f

Assignees

• Hewlett Packard Development Co

Inventors

• Martin Eric
• Mcmahon Terry
• Schulte Donald W

Classifications

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title

• B41J2/04581

  controlling heads based on piezoelectric elements · CPC title

• B41J2/0451

  for detecting failure, e.g. clogging, malfunctioning actuator · CPC title

• H03K17/6871

  the output circuit comprising more than one controlled field-effect transistor · CPC title

• B41J2/17566 Primary

  Ink level or ink residue control · CPC title