Substrate holding device
US-2020258768-A1 · Aug 13, 2020 · US
Substrate holding apparatus
US11658058B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11658058-B2 |
| Application number | US-202117171384-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 9, 2021 |
| Priority date | Feb 20, 2020 |
| Publication date | May 23, 2023 |
| Grant date | May 23, 2023 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate holding apparatus to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated, the substrate holding apparatus comprising: a gripper configured to come in contact with the edge portion of the substrate and thereby grasp the substrate: a suction mechanism configured to attract the portion to be plated of the substrate by suction to hold the portion to be plated; and a protrusion provided at a position corresponding to the portion to be plated of the substrate, and protruding toward the substrate held by the substrate holding apparatus more than the suction mechanism protrudes toward the substrate. 2. The substrate holding apparatus according to claim 1 , wherein the protrusion is disposed to come in contact with a scribe line of the substrate. 3. The substrate holding apparatus according to claim 1 , wherein a tip of the protrusion has a curved surface. 4. The substrate holding apparatus according to claim 1 , wherein the protrusion is made of an antistatic material. 5. The substrate holding apparatus according to claim 1 , wherein the protrusion is provided at a position closer to a suction position by the suction mechanism than to a grasp position by the gripper. 6. The substrate holding apparatus according to claim 1 , wherein the protrusion is fixed to a base body of the substrate holding apparatus. 7. The substrate holding apparatus according to claim 1 , wherein the suction mechanism is a vacuum chuck or Bernoulli chuck. 8. A substrate holding apparatus to hold a substrate, comprising: a gripper configured to come in contact with an edge portion of the substrate and thereby grasp the substrate; a suction mechanism configured to attract a first plate surface of the substrate by suction to hold the first plate surface; and a protrusion provided at a position corresponding to a central side in the first plate surface away from a suction position by the suction mechanism, and protruding toward the substrate held by the substrate holding apparatus more than the suction mechanism protrudes toward the substrate.
Assignees
Inventors
Classifications
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
- H10P72/3302Primary
Mechanical parts of transfer devices · CPC title
- H10P72/78Primary
using vacuum or suction, e.g. Bernoulli chucks · CPC title
comprising at least one plating chamber · CPC title
Electroplating of selected surface areas · CPC title
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Frequently asked questions
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- What does patent US11658058B2 cover?
- Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of th…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/3302. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).