Roll stamp for imprint device, and manufacturing method therefor

US11656545B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11656545-B2
Application numberUS-201816764483-A
CountryUS
Kind codeB2
Filing dateNov 15, 2018
Priority dateNov 20, 2017
Publication dateMay 23, 2023
Grant dateMay 23, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to a roll stamp and a method of manufacturing the same, the roll stamp including a cylindrical metal mold including a debossed pattern formed on an outer side and a hollow portion formed on an inner side, and a dummy roller inserted into the hollow portion. Because a joining portion is not formed on the entire area of the cylindrical metal mold, a problem in which edge regions are separated does not occur. Also, due to the absence of the joining portion, it is possible to perform a patterning process continuously.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a roll stamp, the method comprising: providing an object including a first embossed pattern; placing a first resin layer on an upper surface of the object including the first embossed pattern and pressing the first resin layer; manufacturing a first resin mold including a first debossed pattern by separating the first resin layer from the object; forming a first metal layer on an upper portion of the first resin mold including the first debossed pattern; manufacturing a first metal mold including a second embossed pattern by separating the first metal layer from the first resin mold; forming a second metal layer on an upper portion of the first metal mold including the second embossed pattern; manufacturing a second metal mold including a second debossed pattern by separating the second metal layer from the first metal mold; placing a second resin layer on an upper surface of the second metal mold including the second debossed pattern and pressing the second resin layer; manufacturing a second resin mold including a third embossed pattern by separating the second resin layer from the second metal mold; manufacturing a cylindrical resin mold by rolling the second resin mold so that the third embossed pattern is placed on an inner circumference side of the cylindrical resin mold; forming a third metal layer having a cylindrical shape on the inner circumference of the cylindrical resin mold; manufacturing a cylindrical metal mold including a third debossed pattern formed on an outer side and a hollow portion formed on an inner side by separating the third metal layer having a cylindrical shape from the cylindrical resin mold; arranging dies at a predetermined distance from the cylindrical metal mold; filling a space between the cylindrical metal mold and the dies with a filler; manufacturing a cylindrical filler mold including a fourth embossed pattern formed on an inner circumference and a hollow portion formed on an inner side by separating the dies and the cylindrical metal mold from the filler; filling the hollow portion of the cylindrical filler mold with a metal material; and separating the cylindrical filler mold from the filled metal material. 2. The method of claim 1 , wherein each of the first resin mold and the second resin mold is formed of thermoplastic resin. 3. The method of claim 1 , wherein: the first metal layer is formed by performing an electroless plating method in which at least one or more of copper (Cu), nickel (Ni), silver (Ag), chromium (Cr), iron (Fe), and cobalt (Co) is plated; the second metal layer is formed by performing an electroless plating method or an electroplating method in which at least one or more of Cu, Ni, Ag, Cr, Fe, and Co is plated; and the third metal layer is formed by performing an electroless plating method in which at least one or more of Cu, Ni, Ag, Cr, Fe, and Co is plated. 4. The method of claim 1 , wherein the forming of the second metal layer on the upper portion of the first metal mold including the second embossed pattern includes forming a release layer on the upper portion of the first metal mold including the second embossed pattern and then forming the second metal layer on an upper portion of the release layer. 5. The method of claim 4 , wherein the release layer is a chromate layer. 6. A method of manufacturing a roll stamp, the method comprising: manufacturing a cylindrical metal mold including a first debossed pattern formed on an outer side and a first hollow portion formed on an inner side; arranging dies at a predetermined distance from the cylindrical metal mold; filling a space between the cylindrical metal mold and the dies with a filler; manufacturing a cylindrical filler mold including a first embossed pattern formed on an inner circumference and a second hollow portion formed on an inner side by separating the dies and the cylindrical metal mold from the filler; filling the second hollow portion of the cylindrical filler mold with a metal material; and separating the cylindrical filler mold from the filled metal material. 7. The method of claim 6 , wherein the manufacturing of the cylindrical metal mold including the first debossed pattern formed on the outer side and the first hollow portion formed on the inner side includes: manufacturing a resin mold including a second embossed pattern; manufacturing a cylindrical resin mold by rolling the resin mold so that the second embossed pattern is placed on an inner circumference side of the cylindrical resin mold; forming a metal layer layer having a cylindrical shape on an inner circumference of the cylindrical resin mold; and manufacturing the cylindrical metal mold by separating the metal layer having a cylindrical shape from the cylindrical resin mold. 8. The method of claim 7 , wherein the metal layer is formed by performing an electroless plating method or an electroplating method in which at least one or more of copper (Cu), nickel (Ni), silver (Ag), chromium (Cr), iron (Fe), and cobalt (Co) is plated.

Assignees

Inventors

Classifications

  • using reducing agents · CPC title

  • used as masters for making successive impressions · CPC title

  • Moulding articles characterised by the shape of the surface, e.g. ribs, high polish (mould construction therefor B29C33/42; surface shaping of articles B29C59/00; by incorporating filler in or near the surface B29C70/64) · CPC title

  • Two or more layers only obtained by electroless plating · CPC title

  • Microembossing · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11656545B2 cover?
The present invention relates to a roll stamp and a method of manufacturing the same, the roll stamp including a cylindrical metal mold including a debossed pattern formed on an outer side and a hollow portion formed on an inner side, and a dummy roller inserted into the hollow portion. Because a joining portion is not formed on the entire area of the cylindrical metal mold, a problem in which …
Who is the assignee on this patent?
Korea Inst Mach & Materials
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).