Electronic device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11653537-B2
Application number	US-202017131398-A
Country	US
Kind code	B2
Filing date	Dec 22, 2020
Priority date	Jun 20, 2016
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

An electronic device including a base structure, a first pattern having at least one projection disposed on the base structure, a first conductive layer including a first portion disposed on the base structure and a second portion disposed on the first pattern and connected to the first portion, an insulating layer disposed on the first conductive layer covering the first portion and exposing the second portion, and a second conductive layer provided on the insulating layer and overlapping the first conductive layer. The second conductive layer is spaced apart from the first portion and is in contact with the second portion. Methods of manufacturing an electronic device capable of reducing the number of process steps in the manufacturing process are also disclosed.

First claim

What is claimed is:

1. An electronic device, comprising:
a display layer;
a sensing layer disposed on the display layer and defining an active area and a peripheral area adjacent to the active area; and
a black matrix disposed on the sensing layer,
wherein:
the sensing layer comprises:
a first conductive layer disposed on the display layer;
an insulating layer disposed on the first conductive layer;
a second conductive layer disposed on the insulating layer; and
a passivation layer disposed on the second conductive layer;

the passivation layer overlaps entire surface of the active area;
the black matrix is disposed on the passivation layer;
the first conductive layer comprises a plurality of connecting portions;
the second conductive layer comprises a plurality of first portions, a plurality of second portions, and a plurality of sensor portions disposed on a same layer;
the plurality of connecting portions and the plurality of sensor portions are electrically connected;
the plurality of first portions and the plurality of second portions are electrically connected; and
the plurality of first portions and the plurality of second portions are insulated from the plurality of connecting portions.

2. The electronic device of claim 1 , further comprising a thin-film encapsulation layer disposed on the display layer,
wherein the sensing layer is directly disposed on the thin-film encapsulation layer.

3. The electronic device of claim 2 , wherein the thin-film encapsulation layer comprises a plurality of organic layers and an inorganic layer.

4. The electronic device of claim 1 , wherein the display layer comprises a pixel defining layer having an opening defined therein and a light emitting layer disposed in the opening.

5. The electronic device of claim 4 , wherein the black matrix is non-overlapping with the opening.

6. The electronic device of claim 4 , wherein, when viewed in a plan view, the black matrix overlaps the pixel defining layer, the first conductive layer, and the second conductive layer.

7. The electronic device of claim 1 , wherein the black matrix is disposed directly on the passivation layer.

8. The electronic device of claim 1 , wherein the plurality of first portions, the plurality of second portions, and the plurality of sensor portions have mesh structure.

9. The electronic device of claim 1 , wherein a width of the black matrix is greater than a width of each of the plurality of connecting portions, the plurality of first portions, the plurality of second portions, and the plurality of sensor portions.

10. The electronic device of claim 1 , wherein the black matrix comprises a first black matrix and a second black matrix, and
wherein a width of the first black matrix is the same as a width of each of the plurality of connecting portions, the plurality of first portions, the plurality of second portions, and the plurality of sensor portions.

11. The electronic device of claim 1 , wherein, when viewed in a plan view, the black matrix covers the first conductive layer and the second conductive layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Sungkyun
• Son Jungha
• Choi Sangkyu

Classifications

• H10K50/865

  comprising light absorbing layers, e.g. light-blocking layers · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/84

  Passivation; Containers; Encapsulations · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/87

  Passivation; Containers; Encapsulations · CPC title