Helmholtz-resonator for microphone assembly

Patent metadata

Field	Value
Publication number	US-11653143-B2
Application number	US-202017137728-A
Country	US
Kind code	B2
Filing date	Dec 30, 2020
Priority date	Dec 30, 2019
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A sensor assembly includes a housing having an external-device interface and a sound port to an interior to the housing. A transducer and an electrical circuit are disposed within the housing. The transducer is acoustically coupled to the sound port while the electrical circuit is electrically coupled to the transducer and the external-device interface. A cavity is formed in a portion of the sensor assembly. In some embodiments, the portion is a base of the housing of the sensor assembly. In other embodiments, the portion is a sound port adapter coupled to the sensor assembly. In any case, the cavity is acoustically coupled to the interior of the housing via the sound port and includes a wall portion structured to modify an acoustic property of the sensor assembly.

First claim

The invention claimed is:

1. A sensor assembly comprising:
a housing having an external-device interface and a sound port to an interior of the housing;
a transducer disposed within the housing and acoustically coupled to the sound port;
an electrical circuit disposed within the housing and electrically coupled to the transducer and to electrical contacts on the external-device interface;
a cavity formed in a portion of the sensor assembly and acoustically coupled to the interior of the housing by the sound port,
the cavity having a wall portion structured to modify an acoustic property of the sensor assembly wherein the cavity and wall portion comprise a neck connected to one or more chambers that define one or more enclosed volumes; and
wherein the sound port is acoustically coupled to the one or more chambers by the neck.

2. The assembly of claim 1 , wherein the housing comprises a base including the external-device interface and the sound port, and wherein the cavity and the wall portion are formed in the base.

3. The assembly of claim 2 , wherein the cavity and wall portion form a Helmholtz-resonator comprising the neck connected to one or more chambers.

4. The assembly of claim 3 , wherein the sound port is acoustically coupled to the one or more chambers of the Helmholtz-resonator by the neck.

5. The assembly of claim 4 , wherein the neck and the one or more chambers of the Helmholtz-resonator are formed in or on a same layer of the base.

6. The assembly of claim 4 , wherein the neck and the one or more chambers of the Helmholtz-resonator are formed in or on different layers of the base, with the neck being formed in or on a first layer and the one or more chambers being formed in or on a second different layer.

7. The assembly of claim 1 further comprising a sound port adapter having an acoustic channel with a sound inlet and a sound outlet on a mounting surface of the sound port adapter, the sound port adapter mounted over the sound port of the housing so that the sound outlet of the sound port adapter is acoustically coupled to the sound port, wherein the cavity and the wall portion are formed in the sound port adapter.

8. The assembly of claim 7 , wherein the acoustic channel of the sound port adapter is acoustically coupled to the cavity.

9. The assembly of claim 1 , wherein the acoustic property of the sensor assembly includes any one or more of inertance, resistance, compliance or resonance.

10. A microphone assembly comprising:
a housing having a surface-mountable external-device interface and a sound port to an interior of the housing;
an electro-acoustic transducer disposed in the interior of the housing and acoustically coupled to the sound port;
an electrical circuit disposed in the interior of the housing and electrically coupled to the electro-acoustic transducer and to electrical contacts on the external-device interface;
a cavity formed in a portion of the microphone assembly and acoustically coupled to the interior of the housing via the sound port,
the cavity having a wall portion defining a neck acoustically coupling the sound port to one or more chambers that define one or more enclosed volumes,
wherein the cavity modifies an acoustic property of the microphone assembly.

11. The microphone assembly of claim 10 , wherein the cavity and wall portion form a Helmholtz-resonator comprising the neck connected to one or more chambers.

12. The microphone assembly of claim 11 , wherein the housing comprises a base including the surface-mountable external-device interface and the sound port, and wherein the Helmholtz-resonator is formed in the base.

13. The microphone assembly of claim 11 , wherein the sound port is acoustically coupled to the one or more chambers of the Helmholtz-resonator via the neck.

14. The microphone assembly of claim 13 , wherein the neck and the one or more chambers of the Helmholtz-resonator are formed in or on different layers of the base, with the neck being formed in or on a first layer and the one or more chambers being formed in or on a second different layer.

15. The microphone assembly of claim 11 further comprising a sound port adapter having an acoustic channel with a sound inlet and a sound outlet on a mounting surface of the sound port adapter, the sound port adapter mounted over the sound port of the housing so that the sound outlet of the sound port adapter is acoustically coupled to the sound port, wherein the Helmholtz-resonator is formed in the sound port adapter.

16. The microphone assembly of claim 15 , wherein the sound inlet is located on a different surface of the sound port adapter than the mounting surface.

17. The microphone assembly of claim 10 , wherein the acoustic property of the microphone assembly includes any one or more of inertance, resistance, compliance or resonance.

18. A sound port adapter for a microphone assembly comprising an acoustic transducer disposed in a housing having a sound port on a top or bottom surface of the housing, the sound port adapter comprising:
a body member having a mounting surface configured to mount on the housing of the microphone assembly;
an acoustic channel disposed through the body member, the acoustic channel having a sound inlet and a sound outlet disposed on the mounting surface of the body member; and
a Helmholtz-resonator disposed in the body member, the Helmholtz-resonator comprising one or more chambers that define one or more enclosed volumes and a neck, the acoustic channel acoustically coupled to the one or more chambers by the neck.

19. The sound port adapter of claim 18 , wherein the Helmholtz-resonator modifies any one or more of a frequency of resonance or an amplitude of sound propagating through the acoustic channel of the sound port adapter.

20. The sound port adapter of claim 18 , wherein the sound port adapter includes a wall portion configured to form a non-straight acoustic path in the acoustic channel.

Assignees

• Knowles Electronics Llc

Inventors

• Bradt Christopher
• Murthy Usha
• Vondersaar Ben

Classifications

• H04R1/2869 Primary

  Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R1/08 Primary

  Mouthpieces; {Microphones;} Attachments therefor · CPC title