Sensor device with ingress protection

Patent metadata

Field	Value
Publication number	US-10291973-B2
Application number	US-201715813103-A
Country	US
Kind code	B2
Filing date	Nov 14, 2017
Priority date	May 14, 2015
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.

First claim

What is claimed is:

1. A sensor comprising:
a base having a first surface and an opposing second surface;
a microelectromechanical system (MEMS) die mounted to the first surface of the base;
an integrated circuit (IC) disposed on the base;
a cover disposed over the first surface of the base covering the MEMS die and the IC, the cover having an outer surface and an inner surface, the outer surface of the cover defining an indented region having an indented surface, the cover defining a top port extending between the indented surface and the inner surface, wherein a distance between the indented surface and the inner surface of the cover is less than a distance between the outer surface of the cover and the inner surface of the cover; and
a filtering material disposed on the indented surface covering the top port, the filtering material structured to prevent ingress of contaminants through the top port.

2. The sensor of claim 1 , wherein a depth of the indented region is greater than a thickness of the filtering material.

3. The sensor of claim 1 , wherein a depth of the indented region is substantially equal to a thickness of the filtering material such that an outer surface of the filtering material is substantially coplanar with the outer surface of the cover.

4. The sensor of claim 1 , wherein the filtering material includes a mesh filter.

5. The sensor of claim 1 , wherein the base defines a cavity disposed between the first surface and the second surface of the base and an opening disposed under the MEMS die, the opening extending between the cavity and the first surface of the base.

6. The sensor of claim 1 , wherein the integrated circuit is mounted on the first surface of the base.

7. The sensor of claim 1 , wherein at least a portion of the integrated circuit is embedded into the base.

8. The sensor of claim 1 , wherein the sensor is at least one of a microphone, a pressure sensor, or an acoustic sensor.

9. The sensor of claim 1 , wherein the filtering material is removably disposed on the indented surface.

10. The sensor of claim 1 , wherein the filtering material includes a replaceable mesh filter.

11. A sensor comprising:
a base having a first surface and an opposing second surface;
a microelectromechanical system (MEMS) die mounted to the first surface of the base;
an integrated circuit (IC) disposed on the base;
a cover disposed over the first surface of the base covering the MEMS die and the IC, the cover having an outer surface and an inner surface, the cover further defining an inwardly drawn region forming a depression in the cover, the inwardly drawn region defining a top port, wherein the inwardly drawn region includes a drawn region outer surface and a drawn region inner surface, wherein the top port extends between the drawn region outer surface and the drawn region inner surface; and
a filtering material disposed in the inwardly drawn region and covering the top port, the filtering material structured to prevent ingress of contaminants through the top port.

12. The sensor of claim 11 , wherein the inwardly drawn region includes a first sidewall extending between the drawn region inner surface and the inner surface of the cover, and a second sidewall extending between the drawn region outer surface and the outer surface of the cover.

13. The sensor of claim 11 , wherein a distance between a plane of the outer surface and a plane of the drawn region outer surface is greater than a thickness of the filtering material.

14. The sensor of claim 11 , wherein a distance between a plane of the outer surface and a plane of the drawn region outer surface is substantially equal to a thickness of the filtering material.

15. The sensor of claim 11 , wherein the drawn region outer surface defines an indented region having an indented surface, and wherein the top port extends between the indented surface and the drawn region inner surface.

16. The sensor of claim 15 , wherein the filtering material is disposed on the indented surface.

17. The sensor of claim 16 , wherein the filtering material is removably disposed on the indented surface.

18. The sensor of claim 16 , wherein the filtering material includes a replaceable mesh filter.

19. The sensor of claim 16 , wherein a distance between a plane of the indented surface and a plane of the outer surface of the cover is greater than a thickness of the filtering material.

20. The sensor of claim 16 , wherein a distance between a plane of the indented surface and a plane of the outer surface of the cover is substantially equal to a thickness of the filtering material.

21. The sensor of claim 11 , wherein the filtering material is disposed on the drawn region outer surface.

22. The sensor of claim 11 , wherein the filtering material includes a mesh filter.

23. The sensor of claim 11 , wherein the integrated circuit is mounted on the first surface of the base.

24. The sensor of claim 11 , wherein the integrated circuit is embedded into the base.

25. The sensor of claim 11 , wherein the base defines a cavity disposed between the first surface and the second surface of the base, and an opening disposed under the MEMS die, the opening extending between the cavity and the first surface of the base.

26. The sensor of claim 11 , wherein the sensor is at least one of a microphone, a pressure sensor, or an acoustic sensor.

27. A sensor comprising:
a base having a first surface and an opposing second surface;
a microelectromechanical system (MEMS) die mounted to the first surface of the base;
an integrated circuit (IC) disposed on the base;
a cover disposed over the first surface of the base covering the MEMS die and the IC, the cover having a top surface, the cover further having a bottom surface facing the base, the bottom surface of the cover defining an indented portion having an indented surface, wherein a distance between the indented surface and the top surface of the cover is less than a distance between the bottom surface of the cover and the top surface of the cover, the cover defining a top port within the indented portion; and
a mesh screen disposed within the indented portion and positioned to cover the top port, the mesh screen structured to prevent ingress of particles through the top port.

28. The sensor of claim 27 , wherein the mesh screen is flush with the bottom surface.

29. The sensor of claim 27 , wherein the indented portion does not extend completely through the cover.

30. The sensor of claim 27 , wherein the sensor is at least one of a microphone, a pressure sensor, or an acoustic sensor.

Assignees

• Knowles Electronics Llc

Inventors

• Lim Tony K
• Talag Norman Dennis

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W76/13

  Containers comprising a conductive base serving as an interconnection · CPC title

• H10W76/12

  characterised by their shape · CPC title