Electronic devices including electrically insulated load electrodes

Patent metadata

Field	Value
Publication number	US-11646258-B2
Application number	US-202016944303-A
Country	US
Kind code	B2
Filing date	Jul 31, 2020
Priority date	Aug 6, 2019
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

An electronic device and method is disclosed. In one example, the electronic device includes an electrically insulating material, a first load electrode arranged on a first surface of the electrically insulating material, and a second load electrode arranged on a second surface of the electrically insulating material opposite to the first surface, wherein the load electrodes are separated by the electrically insulating material along the entire length on which the load electrodes have opposite sections, wherein surfaces of the load electrodes facing away from the electrically insulating material are uncovered by the electrically insulating material.

First claim

The invention claimed is:

1. An electronic device, comprising:
an electrically insulating material;
a first load electrode arranged on a first surface of the electrically insulating material; and
a second load electrode arranged on a second surface of the electrically insulating material opposite to the first surface,
wherein the load electrodes are separated by the electrically insulating material along the entire length on which the load electrodes have opposite sections,
wherein surfaces of the load electrodes facing away from the electrically insulating material are uncovered by the electrically insulating material;
wherein the electrically insulating material, when viewed in a direction perpendicular to the first surface or the second surface, extends beyond at least one side surface of at least one of the load electrodes;
the electronic device further including a chip carrier comprising multiple leads, wherein the leads of the chip carrier form the load electrodes, and wherein a portion of the load electrodes are exposed from the electrically insulating material for connection to external devices.

2. The electronic device of claim 1 , wherein the load electrodes are separated by the electrically insulating material by a distance of smaller than 2.0 mm.

3. The electronic device of claim 1 , wherein, when viewed in a direction perpendicular to the first surface or the second surface, the electrically insulating material extends beyond at least one end portion of at least one of the load electrodes.

4. The electronic device of claim 1 , wherein, when viewed in a direction perpendicular to the first surface or the second surface, the load electrodes at least partly overlap.

5. The electronic device of claim 1 , wherein a surface of the electrically insulating material and at least one of the uncovered surfaces of the load electrodes are arranged in a common plane.

6. The electronic device of claim 1 , the chip carrier further including a diepad, the electronic device further comprising:
a semiconductor chip arranged on the diepad, wherein the load electrodes are electrically connected to the semiconductor chip.

7. The electronic device of claim 6 , wherein at least one of the load electrodes and the diepad form an angle of greater than 70 degrees.

8. The electronic device of claim 6 , further comprising:
a mold material, wherein the semiconductor chip and the chip carrier are at least partly encapsulated by the mold material, wherein the electrically insulating material is formed by the mold material.

9. The electronic device of claim 8 , wherein the mold material comprises at least one of the following materials: epoxy, filled epoxy, glass fiber filled epoxy, imide, thermoplast, thermoset polymer, polymer blend.

10. An electronic device, comprising:
an electrically insulating material;
a first load electrode arranged on a first surface of the electrically insulating material; and
a second load electrode arranged on a second surface of the electrically insulating material opposite to the first surface,
wherein the load electrodes are separated by the electrically insulating material along the entire length on which the load electrodes have opposite sections,
wherein surfaces of the load electrodes facing away from the electrically insulating material are uncovered by the electrically insulating material;
wherein the electrically insulating material, when viewed in a direction perpendicular to the first surface or the second surface, extends beyond at least one side surface of at least one of the load electrodes;
the electronic device further comprising:
a chip carrier comprising a diepad and multiple leads, wherein the load electrodes are formed by the leads of the chip carrier;

a semiconductor chip arranged on the diepad, wherein the load electrodes are electrically connected to the semiconductor chip; and
at least one trench formed in a surface of the mold material, wherein the at least one trench is configured to increase a creepage distance between electrodes of the electronic device.

11. The electronic device of claim 1 , wherein the electrically insulating material comprises at least one of the following materials: dielectric printed circuit board material, ceramic material, polyimide, plastic, epoxy.

12. The electronic device of claim 1 , wherein at least one of the load electrodes is formed comb-shaped.

13. The electronic device of claim 1 , wherein at least one of the load electrodes is coated with at least one of the following metals or alloys thereof: tin, silver, gold, palladium, nickel.

14. The electronic device of claim 1 , wherein the electronic device is configured to operate at a frequency of higher than 30 kHz.

15. The electronic device of claim 6 , wherein:
the semiconductor chip comprises a transistor, and
the load electrodes form a drain and a source of the transistor or form an emitter and a collector of the transistor.

16. The electronic device of claim 1 , further comprising:
a printed circuit board, wherein the electronic device is electrically and mechanically connected to the printed circuit board.

17. A method for manufacturing an electronic device, the method comprising:
arranging a chip carrier in an encapsulation tool, a first connection conductor of the chip carrier being designed as a first load electrode contact electrode of the electronic device to be produced and a second connection conductor of the chip carrier being designed as a second load electrode of the electronic device to be produced;
pressing a surface of the first lead against a first surface of the encapsulation tool by a first retractable pin;
pressing a surface of the second lead of the chip carrier against a second surface of the encapsulation tool by a second retractable pin; and

encapsulating the chip carrier and the first and second connection conductors by arranging an encapsulation material in the encapsulation tool, the pressed surface of the first connection conductor and the pressed surface of the second connection conductor being uncovered by the encapsulation material after the encapsulation of the chip carrier and the first and second connection conductors are uncovered by the encapsulation material; and
wherein the load electrodes are separated by the encapsulation material over the entire length, on which the load electrodes have opposite sections, the encapsulation material, if in a direction perpendicular to the first surface or the considered second surface, extends beyond at least one side surface of at least one of the load electrodes and wherein the encapsulation material is electrically insulating, where at least a portion of the load electrodes are exposed from the encapsulation material for connection to external devices.

Assignees

• Infineon Technologies Ag

Inventors

• Fuergut Edward
• Basler Thomas
• Bayerer Reinhold
• Nikitin Ivan

Classifications

• H10W44/203

  Electrical connections · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title