Electronic Devices with Increased Creepage Distances

Patent metadata

Field	Value
Publication number	US-2016365296-A1
Application number	US-201615176952-A
Country	US
Kind code	A1
Filing date	Jun 8, 2016
Priority date	Jun 9, 2015
Publication date	Dec 15, 2016
Grant date	—

Abstract

A device includes an encapsulation material and a first lead and a second lead protruding out of a surface of the encapsulation material. A recess extends into the surface of the encapsulation material. An elevation is arranged on the surface of the encapsulation material. The first lead protrudes out of the elevation.

First claim

What is claimed is:

1 . A device, comprising:
an encapsulation material; a first lead and a second lead protruding out of a surface of the encapsulation material; a recess extending into the surface of the encapsulation material; and a first elevation arranged on the surface of the encapsulation material, wherein the first lead protrudes out of the first elevation.

2 . The device of claim 1 , wherein the recess is arranged between the first lead and the second lead.

3 . The device of claim 1 , further comprising:
a second elevation arranged on the surface of the encapsulation material, wherein the second lead protrudes out of the second elevation.

4 . The device of claim 3 , wherein the first elevation and the second elevation are of similar shape and dimension.

5 . The device of claim 1 , wherein the surface of the encapsulation material defines a plane and the recess has a depth lying in a range from 100 micrometers to 2 millimeters below the level of the plane.

6 . The device of claim 1 , wherein the surface of the encapsulation material defines a plane and the first elevation has a height lying in a range from 100 micrometers to 2 millimeters above the level of the plane.

7 . The device of claim 1 , wherein the first elevation forms a collar surrounding the first lead.

8 . The device of claim 1 , wherein at least one of the recess and the first elevation has a rectangular shape.

9 . The device of claim 1 , wherein the recess extends from a first main surface of the encapsulation material to a second main surface of the encapsulation material.

10 . The device of claim 1 , wherein the encapsulation material and the first elevation are formed integrally from a same material.

11 . The device of claim 1 , wherein the encapsulation material comprises at least one of an epoxy, a glass fiber filled epoxy, a glass fiber filled polymer, an imide, a filled or non-filled thermoplastic polymer material, a filled or non-filled duroplastic polymer material, a filled or non-filled polymer blend, a thermosetting material, a mold compound, a glob-top material, and a laminate material.

12 . The device of claim 1 , wherein a spacing between the first lead and the second lead lies in a range from 200 micrometers to 2 millimeters.

13 . The device of claim 1 , further comprising:
a carrier; and a semiconductor chip arranged over a first surface of the carrier, wherein a second surface of the carrier opposite the first surface is exposed from the encapsulation material.

14 . The device of claim 13 , further comprising:
a heatsink arranged over the second surface of the carrier.

15 . The device of claim 14 , further comprising:
an electrically insulating and thermally conductive layer arranged between the encapsulation material and the heat sink.

16 . The device of claim 1 , further comprising:
a semiconductor chip at least partly covered by the encapsulation material, wherein at least one of the first lead and the second lead is electrically coupled to the semiconductor chip.

17 . A device, comprising:
an encapsulation material; a first lead and a second lead protruding out of a surface of the encapsulation material; a recess extending into the surface of the encapsulation material; and a first collar arranged on the surface of the encapsulation material, wherein the first collar surrounds the first lead.

18 . The device of claim 17 , wherein the recess is arranged between the first lead and the second lead.

19 . The device of claim 17 , further comprising:
a second collar arranged on the surface of the encapsulation material, wherein the second collar surrounds the second lead.

20 . A device, comprising:
a housing configured to accommodate a semiconductor chip, the housing comprising a surface with a first opening configured to accommodate a first lead and a second opening configured to accommodate a second lead; a recess extending into the surface of the housing; and an elevation arranged on the surface of the housing, wherein the elevation comprises the first opening.

21 . The device of claim 20 , wherein the recess is arranged between the first opening and the second opening.

Assignees

• Infineon Technologies Ag

Inventors

• Otremba Ralf
• Fuergut Edward
• Kasztelan Christian
• Kuek Hsieh Ting
• Lee Teck Sim
• Murugan Sanjay Kumar
• Wang Lee Shuang

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W72/07554

  changes in dispositions · CPC title