Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays

Patent metadata

Field	Value
Publication number	US-11639556-B2
Application number	US-201715857362-A
Country	US
Kind code	B2
Filing date	Dec 28, 2017
Priority date	Dec 28, 2017
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.

First claim

What is claimed is:

1. A microelectrodeposition assembly for parallel direct writing of a two-dimensional (2D) array of discrete metal microstructures, the assembly comprising:
an electrolyte reservoir comprising a cavity surrounded by a wall, wherein a bottom of the electrolyte reservoir comprises a porous structure;
a 2D array of structures comprising micronozzles in fluid communication with the electrolyte reservoir through the porous structure, wherein the 2D array of structures comprises at least 10,000 micronozzles having a center-to-center pitch substantially equal to a center-to-center pitch of individual ones of the 2D array of discrete metal microstructures to be deposited in parallel by corresponding individual ones of the micronozzles; and
an electrode within the electrolyte reservoir, wherein the electrode is separated from the 2D array of structures by the porous structure and wherein the electrode comprises any of a mesh, a frame along a perimeter of the cavity of the electrolyte reservoir, or a rod extending into the cavity of the electrolyte reservoir.

2. The assembly of claim 1 , wherein the 2D array of structures comprising micronozzles is integral with the porous structure, and wherein the wall of the electrolyte reservoir is integral with the porous structure.

3. The assembly of claim 1 , wherein the porous structure comprises tortuous pores.

4. The assembly of claim 1 , wherein the porous structure comprises straight pores in an ordered array.

5. The assembly of claim 1 , wherein the porous structure comprises a ceramic material or an organic material, and wherein the micronozzles comprise an epoxy resin.

6. The assembly of claim 1 , wherein the 2D array of structures comprises between 10,000 micronozzles and 1,500,00 micronozzles, the center-to-center pitch is 100 microns or less, and each of the micronozzles comprises an orifice of a diameter substantially equal to, or greater than, a diameter of individual ones of the metal microstructures.

7. The assembly of claim 1 , wherein the porous structure comprises a plurality of orifices within an area overlapping an area of each of the micronozzles.

8. A microelectrodeposition system for parallel direct writing of a two-dimensional (2D) array of discrete metal microstructures, the system, comprising:
a micronozzle assembly, comprising:
an electrolyte reservoir coupled to a fluid path, wherein the electrolyte reservoir comprises a cavity surrounded by a wall and a bottom of the electrolyte reservoir comprises a porous structure;
a 2D array of structures comprising between 10,000 and 1,500,000 micronozzles in fluid communication with the electrolyte reservoir through the porous structure, the micronozzles having a center-to-center pitch of 100 microns or less and substantially equal to a center-to-center pitch of individual ones of the 2D array of discrete metal microstructures to be deposited in parallel by corresponding individual ones of the micronozzles;
an electrode within the electrolyte reservoir, wherein the electrode is separated from the 2D array of structures by the porous structure and wherein the electrode comprises any of a mesh, a frame along a perimeter of the cavity of the electrolyte reservoir, or a rod extending into the cavity of the electrolyte reservoir;

a power source coupled to the electrode; and
a motion actuator to displace the micronozzle assembly vertically relative to the 2D array of microstructures during the direct writing.

9. The system of claim 8 , wherein the fluid path includes an interface to couple the fluid path to a vessel for containing electrolyte.

10. The system of claim 8 , wherein the fluid path includes an interface to couple the fluid path to a pressure source.

11. The system of claim 8 , further comprising an interface to couple the micronozzle assembly to the motion actuator.

12. The system of claim 8 , further comprising a substrate mount, wherein the substrate mount includes an interface to couple the substrate mount to the motion actuator.

13. The system of claim 8 , wherein the porous structure comprises tortuous pores.

14. The system of claim 8 , wherein the porous structure comprises straight pores in an ordered array.

15. The system of claim 8 , wherein the porous structure comprises a ceramic material or an organic material, and wherein the micronozzles comprise an epoxy resin.

16. The system of claim 15 , wherein the porous structure comprises the organic material and the organic material is one of cellulose acetate, mixed cellulose ester, polycarbonate, polyether ether ketone (PEEK), polyethersulfone (PES), polyester, polypropylene, polytetrafluoroethylene (PTFE), or polyvinylidene difluoride (PVDF).

17. The system of claim 8 , wherein each of the micronozzles comprises a conical interior cavity.

18. The system of claim 8 , wherein the center-to-center pitch of the micronozzles is 30 microns, or less.

Assignees

• Intel Corp

Inventors

• Walczyk Joe
• Tadayon Pooya
• Hoitink Andrew
• Schulz Tanner

Classifications

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title

• H10W72/01225

  in solid form, e.g. by using a powder or by stud bumping · CPC title

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title

• C25D5/026 Primary

  using locally applied jets of electrolyte · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title