Feedthrough assembly and device including same

Patent metadata

Field	Value
Publication number	US-11633611-B2
Application number	US-202017125250-A
Country	US
Kind code	B2
Filing date	Dec 17, 2020
Priority date	Dec 19, 2019
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

First claim

What is claimed is:

1. A feedthrough header assembly comprising:
a header comprising an inner surface and an outer surface;
a dielectric substrate comprising a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header;
a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer comprises a first conductive portion and a second conductive portion electrically isolated from the first conductive portion; and
a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header, wherein the feedthrough pin extends beyond the outer surface of the header.

2. The assembly of claim 1 , wherein the first conductive portion is electrically connected to the header by a conductive post that extends from the inner surface of the header through the dielectric substrate to the first conductive portion.

3. The assembly of claim 1 , wherein the feedthrough pin is electrically connected to the second conductive portion of the patterned conductive layer by a weld joint.

4. The assembly of claim 1 , wherein the feedthrough pin extends through the second conductive portion of the patterned conductive layer.

5. The assembly of claim 1 , further comprising a filter disposed on the patterned conductive layer and electrically connected to at least one of the first conductive portion or the second conductive portion of the patterned conductive layer.

6. The assembly of claim 1 , further comprising insulating material disposed between the feedthrough pin and at least a portion of the via disposed through the header so that the feedthrough pin is electrically isolated from the header.

7. The assembly of claim 1 , wherein the assembly further comprises an elliptical cross-section in a plane substantially parallel to the first major surface of the dielectric substrate.

8. The assembly of claim 1 , further comprising a conductive pad disposed on the patterned conductive layer so that the patterned conductive layer is between the conductive pad and the dielectric substrate, wherein the conductive pad comprises at least one of a solder bump, solder paste, conductive epoxy, or conductive joint.

9. An electronics module comprising:
an electronic layer comprising a substrate and an electronic component disposed on the substrate; and
a feedthrough header assembly electrically connected to the electronic layer, wherein the feedthrough header assembly comprises:
a header comprising an inner surface and an outer surface;
a dielectric substrate comprising a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header;
a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer comprises a first conductive portion and a second conductive portion electrically isolated from the first conductive portion;
a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header, wherein the feedthrough pin extends beyond the outer surface of the header.

10. The module of claim 9 , wherein the first conductive portion is electrically connected to the header by a conductive post that extends from the inner surface of the header through the dielectric substrate to the first conductive portion.

11. The module of claim 9 , wherein the feedthrough header assembly further comprises a conductive pad disposed on the patterned conductive layer so that the patterned conductive layer is between the conductive pad and the dielectric substrate, wherein the electronic component is electrically connected to the conductive pad of the feedthrough header assembly by a conductive via disposed through the substrate of the electronic layer.

12. The module of claim 9 , further comprising a filter disposed on the patterned conductive layer and electrically connected to at least one of the first conductive portion or the second conductive portion of the patterned conductive layer.

13. The module of claim 9 , wherein the feedthrough pin extends through the second conductive portion of the patterned conductive layer.

14. An implantable medical device comprising:
a power source; and
an electronics module electrically connected to the power source and comprising an electronic layer and a feedthrough header assembly electrically connected to the electronic layer, wherein the electronic layer comprises a substrate and an electronic component disposed on the substrate, and further wherein the feedthrough header assembly comprises:
a header comprising an inner surface and an outer surface;
a dielectric substrate comprising a first major surface and a second major surface, wherein the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header;
a patterned conductive layer disposed on the first major surface of the dielectric substrate, wherein the patterned conductive layer comprises a first conductive portion and a second conductive portion electrically isolated from the first conductive portion; and
a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header, wherein the feedthrough pin extends beyond the outer surface of the header.

15. The device of claim 14 , wherein the first conductive portion is electrically connected to the header by a conductive post that extends from the inner surface of the header through the dielectric substrate to the first conductive portion.

16. The device of claim 14 , further comprising an elongated tubular housing extending between a first end and a second end along a longitudinal axis, and further wherein a first portion of the housing adjacent to the first end encloses the electronics module and a second portion of the housing adjacent to the second end encloses the power source.

17. The device of claim 16 , wherein the first portion of the elongated tubular housing comprises a substantially transparent material.

18. The device of 16 , wherein the longitudinal axis is substantially orthogonal to the dielectric substrate of the feedthrough header assembly.

19. The device of claim 16 , wherein the longitudinal axis is substantially orthogonal to the substrate of the electronic layer of the electronics module.

20. The device of 14 , wherein the feedthrough header assembly further comprises a conductive pad disposed on the patterned conductive layer so that the patterned conductive layer is between the conductive pad and the dielectric substrate, wherein the conductive pad electrically connects the feedthrough header assembly to the electronic layer.

Assignees

• Medtronic Inc

Inventors

• Ries Andrew J
• Kim Chunho
• Munoz Robert A
• Kinsey Christopher T
• Voss Jeffrey
• Peterson Kris A
• Henschel Mark E

Classifications

• A61N1/3756

  Casings with electrodes thereon, e.g. leadless stimulators · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• A61N1/37512

  Pacemakers · CPC title

• A61N1/37205

  Microstimulators, e.g. implantable through a cannula · CPC title