Semiconductor device having a plurality of first structural bodies provided below a connection terminal and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11626376-B2
Application number	US-202117350899-A
Country	US
Kind code	B2
Filing date	Jun 17, 2021
Priority date	Sep 8, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A semiconductor device of an embodiment includes a first chip having a memory cell array, and a second chip having a control circuit. The first chip includes a substrate, a pad, a first structural body, and a second structural body. The substrate is arranged on the side opposite to a joined face of the first chip joined to the second chip, and includes a first face, a second face, and an opening extending from the second face to the first face in a first region. The memory cell array is provided between the first face and the opposed joined face. The pad is provided in the opening. The first structural body is provided between the first face and the joined face, and is electrically connected to the pad. The second structural body is provided between the first face and the joined face in the first region.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a first chip having a memory cell array; and
a second chip joined to the first chip and having a control circuit, the control circuit being configured to control the memory cell array,
wherein:
the first chip includes
a first insulating layer arranged on a side opposite to a joined face of the first chip joined to the second chip, the first insulating layer including a first face, a second face on a side opposite to the first face, and a connection terminal region in a first region, the memory cell array being provided between the first face and the opposed joined face,
a connection terminal provided in the connection terminal region such that the connection terminal is at least partially exposed,
a first structural body provided between the first face and the joined face, the first structural body being electrically connected to the connection terminal,
a second structural body provided between the first face and the joined face in the first region, and
an interlayer dielectric provided between a first stack of the memory cell array and the first structural body,

the connection terminal and the second structural body have portions overlapping each other as seen in a top view,
a material of the second structural body and a material of the interlayer dielectric are different, and
the connection terminal electrically connects the first chip to an external power supply,
wherein:
the first structural body includes a plurality of first structural bodies provided below the connection terminal, and
the second structural body is provided around the plurality of first structural bodies.

2. The semiconductor device according to claim 1 ,
wherein:
the first chip includes a first bond pad located on the joined face,
the second chip includes a second bond pad located on the joined face, and
the first bond pad and the second bond pad are electrically connected.

3. The semiconductor device according to claim 2 , wherein the first structural body is provided at a position overlapping the connection terminal and the second bond pad as seen in a top view.

4. The semiconductor device according to claim 1 , wherein the first chip further includes a substrate arranged on a side opposite to the face of the first chip joined to the second chip, the substrate including
a third face,
a fourth face on a side opposite to the third face, and
an opening extending from the fourth face to the third face in the first region, the first insulating layer being provided in the opening, the memory cell array being provided between the third face and the opposed joined face.

5. The semiconductor device according to claim 1 ,
wherein:
the memory cell array has a first stack including a plurality of conductive layers and a plurality of insulating layers alternately stacked in a first direction perpendicular to the first face, and
the second structural body has a third stack including a plurality of metal layers and a plurality of insulating layers alternately stacked corresponding to the first stack, the plurality of metal layers being insulated from the first structural body.

6. The semiconductor device according to claim 5 ,
wherein:
a material of the metal layers of the third stack is the same as a material of the conductive layers of the first stack, and
a material of the insulating layers of the third stack is the same as a material of the insulating layers of the first stack.

7. The semiconductor device according to claim 4 , wherein the first insulating layer is provided in the opening in a region from the third face to the fourth face.

8. The semiconductor device according to claim 4 ,
wherein:
the first chip is provided in a first wafer,
the second chip is provided in a second wafer,
a second insulating layer is further provided to cover a connected portion of the first wafer and the second wafer along side faces of the first wafer and the second wafer, and
a material of the second insulating layer is the same as a material of the first insulating layer provided in the opening so as to allow the connection terminal to be at least partially exposed on a side of the fourth face of the substrate in the first region.

9. The semiconductor device according to claim 1 , wherein the connection terminal is electrically connected to a bonding wire by wire bonding in the first region.

10. The semiconductor device according to claim 4 , wherein the connection terminal is provided along the third face in the opening.

11. The semiconductor device according to claim 4 , wherein the connection terminal is provided between the third face and the fourth face.

12. A semiconductor device comprising:
a first chip having a memory cell array; and
a second chip joined to the first chip and having a control circuit, the control circuit being configured to control the memory cell array,
wherein:
the first chip includes
a first insulating layer arranged on a side opposite to a joined face of the first chip joined to the second chip, the first insulating layer including a first face, a second face on a side opposite to the first face, and a connection terminal region in a first region, the memory cell array being provided between the first face and the opposed joined face,
a connection terminal provided in the connection terminal region such that the connection terminal is at least partially exposed,
a first structural body provided between the first face and the joined face, the first structural body being electrically connected to the connection terminal,
a second structural body provided between the first face and the joined face in the first region, and
an interlayer dielectric provided between a first stack of the memory cell array and the first structural body,

the connection terminal and the second structural body have portions overlapping each other as seen in a top view,
a material of the second structural body and a material of the interlayer dielectric are different, and
the connection terminal electrically connects the first chip to an external power supply,
wherein:
the memory cell array has a first stack including a plurality of conductive layers and a plurality of insulating layers alternately stacked in a first direction perpendicular to the first face, and
the second structural body has a second stack including a plurality of insulating layers alternately stacked corresponding to the first stack, the number of the insulating layers of the second stack being identical to a sum of the number of the plurality of conductive layers and the number of the plurality of insulating layers of the first stack.

13. The semiconductor device according to claim 12 , wherein the second stack is provided so as to be in contact with the first structural body.

14. The semiconductor device according to claim 12 ,
wherein:
the second stack includes two types of insulating layers, and
a material of one of the two types of insulating layers is the same as a material of each of the insulating layers of the first stack.

15. A method of manufacturing a semiconductor device, comprising:
forming a first stack in a memory cell array region on a third face of a substrate that includes the third face and a fourth face on a side opposite to the third face, and forming a first structural body and a second structural body as a second stack in a first region on the third face;
joining a first wafer and a second wafer together, the first wafer having the substrate, the second wafer having formed therein a control circuit that is configured to control

Assignees

• Kioxia Corp

Inventors

• Setta Yuji

Classifications

• H10W90/792

  between multiple chips · CPC title

• H10W80/327

  characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers · CPC title

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W90/00 Primary

  Package configurations · CPC title