Active thermal interposer device

Patent metadata

Field	Value
Publication number	US-11609266-B2
Application number	US-202117531638-A
Country	US
Kind code	B2
Filing date	Nov 19, 2021
Priority date	Dec 4, 2020
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

First claim

We claim:

1. A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), said active thermal interposer device comprising:
a body layer comprising a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate; and
a plurality of heating zones defined across the second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during testing of said DUT.

2. The stand-alone active thermal interposer device as described in claim 1 wherein each heating zone of said plurality of heating zones comprises resistive traces for providing heat responsive to a voltage/current signal applied thereto as controlled by said thermal controller.

3. The stand-alone active thermal interposer device as described in claim 2 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with corresponding pogo pins of a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input voltage/current signals from said thermal array for supply to said plurality of heater zones and also operable to output temperature sensor data corresponding to said plurality of heater zones.

4. The stand-alone active thermal interposer device as described in claim 2 further comprising a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said DUT from electro-magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones.

5. The stand-alone active thermal interposer device as described in claim 1 wherein said body layer further comprises a two dimensional identification code viewable thereon and wherein said two dimensional identification code is operable to be machine read and provides one of:
calibration values for a resistance temperature detector of the active thermal interposer device;
identification information for identifying the active thermal interposer device; and
security information for authenticating the active thermal interposer device.

6. The stand-alone active thermal interposer device as described in claim 1 wherein said body layer further comprises alignment features disposed on said first surface, said alignment features for providing alignment between power pins of said active thermal interposer device and pads of a thermal head of said tester system, and wherein said thermal head comprises said cold plate.

7. The stand-alone active thermal interposer device as described in claim 6 wherein said alignment features comprise micro-alignment bushings.

8. The stand-alone active thermal interposer device as described in claim 1 further comprising a plurality of mechanical buttons for providing mechanical compliance between said interface surface of said DUT and said plurality of heater zones, wherein each mechanical button is disposed between said body layer and a respective heater zone of said plurality of heater zones, and wherein further each mechanical button comprises an array of spring loaded pogo pins.

9. The stand-alone active thermal interposer device as described in claim 1 further comprising a kick-off mechanical button disposed on said second surface of said body layer, said kick-off mechanical button comprising an array of spring loaded pogo pins and operable to separate said interface surface of said DUT from said second surface of said body layer when a force applied therebetween is removed.

10. The stand-alone active thermal interposer device as described in claim 1 wherein said DUT comprises a multi-chip module and wherein further said plurality of heating zones are operable to be selectively energized for selectively heating and maintaining temperatures of chips of said multi-chip module during said testing of said DUT.

11. The stand-alone active thermal interposer device as described in claim 1 further comprising a Peltier/TEC cooling layer disposed on said first surface of said body layer.

12. The stand-alone active thermal interposer device as described in claim 11 wherein said body layer further comprises a plurality of pogo pin mechanical interfaces, said plurality of pogo pin mechanical interfaces operable to input voltage/current signals for supply to said plurality of heater zones and also operable to output temperature sensor data corresponding to said plurality of heater zones and also operable to input signals to control said Peltier/TEC cooling layer.

13. A method of testing a system-in-package device under test (DUT) using an automated handler system and a tester system, said method comprising:
using said handler, automatically picking up said DUT from a tray and automatically placing said DUT into a socket;
using an optical sensor to determine if said DUT is aligned planar with respect to its orientation within said socket;
using said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device on top of said DUT within said socket wherein said automatically placing said active thermal interposer device comprises using alignment features of said active thermal interposer device and of said socket to align said active thermal interposer device; and
using said optical sensor to determine if said active thermal interposer device is aligned planar regarding its orientation within said socket and with respect to said DUT.

14. A method as described in claim 13 further wherein said automatically picking up said DUT from a tray and automatically placing said DUT into a socket is performed by a first pick-and-place head of said handler and wherein further said automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device onto top of said DUT within said socket is performed by a second pick-and-place head of said handler.

15. A method as described in claim 13 wherein said automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device onto top of said DUT within said socket further comprises using an optical reader to read a two dimensional identification code disposed on said active thermal interposer device wherein said two dimensional identification code provides information including one of: an identification of said active thermal interposer device; thermal calibration data regarding said active thermal interposer device; and authentication information regarding said active thermal interposer device and further comprising relaying said information to said tester system.

16. A method of testing a system-in-package device under test (DUT) using an automated handler system and a tester system, said method comprising:
using a first pick-and-place head of said handler, automatically picking up said DUT from a tray and automatically placing said DUT into a socket; and
using a second pick-and-place head of said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device onto top of said DUT within said socket,
wherein said automatically placing said active thermal interposer device comprises align

Assignees

• Advantest Test Solutions Inc

Inventors

• Kabbani Samer
• Ferrari Paul
• Hiroki Ikeda
• Toshiyuki Kiyokawa
• Cruzan Gregory
• Ranganathan Karthik
• Berk Todd
• Williams Ian
• Ghazvini Mohammad
• Jones Thomas

Classifications

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2875 Primary

  related to heating · CPC title

• G01R31/2868

  Complete testing stations; systems; procedures; software aspects · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title

• H10N10/10

  operating with only the Peltier or Seebeck effects · CPC title