Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium

Patent metadata

Field	Value
Publication number	US-11604150-B2
Application number	US-201917256921-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Jun 29, 2018
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

An object is to allow for simple measurement of a bump height. There is provided a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

First claim

The invention claimed is:

1. A device for measuring a bump height, comprising:
a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and
a processor and memory containing computer readable instructions that when executed by the processor configure the processor to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

2. The device according to claim 1 ,
wherein the error is calculated by using the reflective index and a thickness of the resist layer set in a recipe.

3. The device according to claim 1 ,
wherein the light sensor is configured to irradiate an outer circumferential part of the substrate with the light, and
the memory containing computer readable instructions that when executed by the processor configure the processor to obtain the height of the bump in the outer circumferential part of the substrate.

4. The device according to claim 3 ,
wherein the light sensor and the substrate are rotated relative to each other by every predetermined angle by a substrate rotation mechanism configured to rotate the substrate or by a sensor rotation mechanism configured to rotate the light sensor around the substrate, and the light sensor is configured to scan the outer circumferential part of the substrate.

5. A device for measuring a bump height, comprising:
a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer, reflected light that is directly reflected from the seed layer, and reflected light that is reflected from the bump, by the light-receiving element; and
a processor and memory containing computer readable instructions that when executed by the processor configure the processor to measure a height of the seed layer, based on the reflected light that is reflected from the seed layer via the resist layer and the reflected light that is directly reflected from the seed layer, to measure a height of the bump, based on the reflected light that is reflected from the seed layer via the resist layer and the reflected light that is reflected from the bump, and to subtract the height of the seed layer from the height of the bump, so as to obtain the height of the bump relative to the seed layer.

6. An apparatus for processing a substrate, comprising:
a substrate processing module provided with one or a plurality of substrate processing units configured to perform substrate processing;
a dryer configured to dry the substrate after the substrate processing;
a bump height measurement device provided in the dryer; and
a processor and memory containing computer readable instructions that when executed by the processor configure the processor to control the substrate processing module, the dryer and the bump height measurement device, wherein
the bump height measurement device comprises a light sensor provided with a light source and a light-receiving element and configured to irradiate the substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element, and
the memory containing computer readable instructions that when executed by the processor configure the processor to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

7. The apparatus according to claim 6 ,
wherein the error is calculated by using the reflective index and a thickness of the resist layer set in a recipe.

8. The apparatus according to claim 6 ,
wherein the dryer is provided with a substrate rotation mechanism configured to rotate and dry the substrate.

9. The apparatus according to claim 6 ,
wherein the dryer is provided with an openable shielding member configured to shield the bump height measurement device from a drying module configured to dry the substrate.

10. The apparatus according to claim 6 ,
wherein the substrate is subjected to a plating process in a state that the substrate is held by a substrate holding member, and
the memory containing computer readable instructions that when executed by the processor configure the processor to perform an inspection for the height of the bump, based on the obtained height of the bump, and make the substrate holding member used to hold the substrate and/or a plating module used for the plating process of the substrate, unusable when the height of the bump has an abnormality.

11. The apparatus according to claim 6 ,
wherein the light sensor is configured to irradiate an outer circumferential part of the substrate with the light, and
the memory containing computer readable instructions that when executed by the processor configure the processor to calculate the height of the bump in the outer circumferential part of the substrate.

12. The apparatus according to claim 11 ,
wherein the light sensor and the substrate are rotated relative to each other by every predetermined angle by a substrate rotation mechanism configured to rotate and dry the substrate or by a sensor rotation mechanism configured to rotate the light sensor around the substrate, and the light sensor is configured to scan the outer circumferential part of the substrate.

13. The substrate processing apparatus according to claim 6 ,
wherein the bump height measurement device performs measurement of bump height with regard to plural measurement areas on the substrate, and
the memory containing computer readable instructions that when executed by the processor configure the processor to perform a tentative determination for presence or absence of any abnormality in bump height with regard to each measurement area where the measurement is performed, and perform final determination with regard to one measurement area by using a result of the tentative determination with regard to the one measurement area and results of the tentative determination with regard to one or plural other measurement areas including the one measurement area.

14. The apparatus according to claim 13 ,
wherein the memory containing computer readable instructions that when executed by the processor configure the processor to set one or a plurality of determination areas including a plurality of the measurement areas, on the substrate, and performs determination for bump height inspection with regard to each determination area by using results of tentative determination or

Assignees

• Ebara Corp

Inventors

• Okuzono Takahisa
• Tomita Masaki
• Fujikata Jumpei
• Takayanagi Hideki

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title