Method of plating

Patent metadata

Field	Value
Publication number	US-11598017-B2
Application number	US-202117160953-A
Country	US
Kind code	B2
Filing date	Jan 28, 2021
Priority date	Feb 10, 2020
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

There is provided a method of plating comprising: a process of bringing a sealing portion of a seal provided to prevent a contact of a substrate holder that holds a substrate from coming into contact with a plating solution, into contact with pure water; and a process of detecting a leak of the seal, based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with a chemical solution.

First claim

What is claimed is:

1. A method of plating, comprising
a process of bringing a sealing portion of a seal into contact with pure water, the seal preventing a contact of a substrate holder that holds a substrate from coming into contact with a plating solution; and
a process of detecting a leak of the seal based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder, the process of detecting occurring after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with the plating solution
wherein the leak detection electrode is placed in a neighborhood of a conductive member for substrate electric conduction in order to be electrically insulated from the conductive member, and
the process of detecting the leak of the seal detects the leak of the seal by utilizing a short circuit between the leak detection electrode and the conductive member caused by presence of pure water.

2. The method of plating according to claim 1 ,
wherein the process of bringing the sealing portion into contact with the pure water is performed in a preliminary cleaning process of cleaning the substrate with pure water and/or in a pre-wet process of bringing the substrate into contact with degassed pure water.

3. The method of plating according to claim 2 ,
wherein the process of detecting the leak of the seal is performed during the preliminary cleaning process and/or the pre-wet process.

4. The method of plating according to claim 3 ,
wherein the process of detecting the leak of the seal is further performed in or after a subsequent process that is subsequent to the pre-wet process.

5. The method of plating according to claim 4 ,
wherein the process of detecting the leak of the seal is further performed after the substrate is plated.

6. The method of plating according to claim 3 ,
wherein the process of detecting the leak of the seal is further performed before the substrate is held by the substrate holder.

7. The method of plating according to claim 6 , further comprising:
a process of cleaning the substrate holder, wherein
the process of detecting the leak of the seal is further performed after the substrate holder is cleaned and before a next substrate is held by the cleaned substrate holder.

8. The method of plating according to claim 1 ,
wherein the leak detection electrode is provided along an outer circumference of the substrate and is extended from an upper portion of the substrate to at least middle of a side portion, extended from an upper portion of the substrate through the side portion to a lower portion or extended along an entire circumference of the substrate, in a state that the substrate is held by the substrate holder.

Assignees

• Ebara Corp

Inventors

• OGATA Shoichiro
• Yamasaki Gaku

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/004 Primary

  Sealing devices · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title