Method of producing printed circuit boards with routing conductors and dielectric strands

Patent metadata

Field	Value
Publication number	US-11596054-B2
Application number	US-201916670374-A
Country	US
Kind code	B2
Filing date	Oct 31, 2019
Priority date	Sep 13, 2018
Publication date	Feb 28, 2023
Grant date	Feb 28, 2023

Abstract

Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.

First claim

What is claimed is:

1. A method of producing a printed circuit board, comprising:
providing a first layer comprising a first dielectric material and a first ground conductive layer in communication with the first dielectric material;
providing a second layer comprising a second dielectric material; and
positioning an intermediate layer between the first dielectric material and the second dielectric material, the intermediate layer comprising:
a first fiberglass material comprising two or more non-woven first fiberglass strands;
a second fiberglass material; and
a conductor proximal to the first fiberglass material and the second fiberglass material.

2. The method of claim 1 , wherein the first dielectric material includes a first set of fiberglass bundles in a first orientation interwoven with a second set of fiberglass bundles in a second orientation.

3. The method of claim 1 , further comprising:
positioning the first fiberglass material and the second fiberglass material adjacent to a first side and a second side of the conductor, respectively, wherein the second side is oppositely disposed from the first side of the conductor; and
positioning the second layer in communication with the intermediate layer.

4. The method of claim 3 , wherein the intermediate layer is positioned between the first dielectric material and the second dielectric material.

5. The method of claim 3 , further comprising depositing an epoxy resin in the intermediate layer and subjecting the resin to a curing process to bind the first and second layers to opposite surfaces of the intermediate layer.

6. The method of claim 1 , wherein each of the two or more non-woven first fiberglass strands of the first fiberglass material run parallel to the conductor.

7. The method of claim 6 , wherein the two or more non-woven first fiberglass strands are adjacently positioned with respect to one another and collectively form a first co-planar arrangement with minimal openings formed between the adjacently positioned non-woven first fiberglass strands.

8. The method of claim 1 , wherein the second fiberglass material includes two or more non-woven second fiberglass strands adjacently positioned to respect to one another and collectively forming a second co-planar arrangement with minimal openings formed between the adjacently positioned non-woven second fiberglass strands, and wherein each of the two or more non-woven second fiberglass strands of the second fiberglass material run parallel to the conductor.

9. The method of claim 1 , wherein the conductor is a single ended conductor and/or a differential pair.

10. The method of claim 1 , wherein at least one of the two or more non-woven first fiberglass strands of the first fiberglass material is in direct contact with the conductor.

11. The method of claim 10 , wherein the second fiberglass material includes two or more non-woven second fiberglass strands, and wherein at least one of the two or more non-woven second fiberglass strands of the second fiberglass material is in direct contact with the conductor.

12. The method of claim 1 , wherein the two or more non-woven first fiberglass strands are in direct contact with the first dielectric material.

13. A method of producing a printed circuit board, comprising:
providing a first layer comprising a dielectric material and a ground conductive layer in communication with the dielectric material; and
positioning a second layer adjacent to the first layer, the second layer comprising:
a conductor; and
a fiberglass material proximal to the conductor, the fiberglass material comprising two or more non-woven fiberglass strands.

14. The method of claim 13 , wherein the dielectric material includes a first set of fiberglass bundles in a first orientation interwoven with a second set of fiberglass bundles in a second orientation.

15. The method of claim 13 , further comprising depositing an epoxy resin in the second layer and subjecting the resin to a curing process to bind the second layer to the first layer.

16. The method of claim 13 , wherein each of the two or more non-woven fiberglass strands of the first fiberglass material run parallel to the conductor.

17. The method of claim 16 , wherein the two or more non-woven fiberglass strands are adjacently positioned with respect to one another and collectively form a co-planar arrangement with minimal openings formed between the adjacently positioned non-woven fiberglass strands.

18. The method of claim 13 , wherein the conductor is a single ended conductor and/or a differential pair.

19. The method of claim 13 , wherein at least one of the two or more non-woven fiberglass strands of the fiberglass material is in direct contact with the conductor.

20. The method of claim 13 , wherein the two or more non-woven fiberglass strands are in direct contact with the dielectric material.

Assignees

• IBM

Inventors

• Zhang Yanyan
• Walls Lloyd Andre
• Choi Jinwoo
• Mechaik Mehdi Mohamed

Classifications

• H05K1/0242

  Structural details of individual signal conductors, e.g. related to the skin effect · CPC title

• H01B3/08 Primary

  quartz; glass; glass wool; slag wool; vitreous enamels · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• H05K1/024 Primary

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title