Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs

Patent metadata

Field	Value
Publication number	US-11588448-B2
Application number	US-202016910900-A
Country	US
Kind code	B2
Filing date	Jun 24, 2020
Priority date	Jun 24, 2020
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.

First claim

That which is claimed is:

1. A packaged radio frequency (“RF”) transistor amplifier, comprising:
a package housing;
an RF transistor amplifier die that is mounted within the package housing;
a first capacitor die that is mounted within the package housing;
an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die;
an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die, the output leadframe including an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.

2. The packaged RF transistor amplifier of claim 1 , wherein the first capacitor die is a first output impedance matching capacitor die, and wherein the first arm is electrically interposed between a drain terminal of the RF transistor amplifier die to and a first output impedance matching capacitor of the first output impedance matching capacitor die.

3. The packaged RF transistor amplifier of claim 1 , wherein a width of the first arm is less than half a width of the output pad region.

4. The packaged RF transistor amplifier of claim 1 , wherein the output leadframe further comprises a second arm that extends from one of the output pad region and the output lead to be adjacent a second output impedance matching capacitor die.

5. The packaged RF transistor amplifier of claim 1 , wherein a distal end of the first arm is outside the package housing.

6. The packaged RF transistor amplifier of claim 5 , wherein the distal end of the first arm is configured to be connected to a direct current voltage source.

7. The packaged RF transistor amplifier of claim 1 , wherein the input leadframe includes an input pad region, an input lead, and a third arm that extends from the input pad region to outside the package housing to provide a direct current voltage source input.

8. The packaged RF transistor amplifier of claim 7 , wherein the input leadframe further comprises a fourth arm that extends from the input pad region.

9. The packaged RF transistor amplifier of claim 2 , wherein the first output impedance matching capacitor die is connected to the first arm by a first conductive bump.

10. The packaged RF transistor amplifier of claim 5 , wherein the output lead extends through a first wall of the package housing, and the first arm extends through a second wall of the package housing that is different from the first wall.

11. The packaged RF transistor amplifier of claim 10 , wherein the second wall is generally perpendicular to the first wall.

12. The packaged RF transistor amplifier of claim 1 , wherein the RF transistor amplifier die is configured to operate in at least a portion of one or more of the 2.5-2.7 GHz, 3.4-4.2 GHz, or 5.1-5.8 GHz frequency bands.

13. The packaged RF transistor amplifier of claim 1 , wherein the RF transistor amplifier die is configured to operate at frequencies above 10 GHz.

14. A packaged radio frequency (“RF”) transistor amplifier, comprising:
a package housing;
an RF transistor amplifier die that is mounted within the package housing;
an input leadframe that includes an input lead that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die;
a monolithic output leadframe that includes an output lead, a direct current lead and an electrical connection between the output lead and the direct current lead,
wherein the output lead extends through a first portion of the package housing to electrically connect to a drain terminal of the RF transistor amplifier die, and the direct current lead extends through a second portion of the package housing that is spaced apart from the first portion of the package housing.

15. The packaged RF transistor amplifier of claim 14 , wherein the output leadframe further includes an output pad region, and wherein the direct current lead comprises an arm that extends from the output pad region.

16. The packaged RF transistor amplifier of claim 15 , further comprising a first capacitor die, wherein a portion of the first arm is adjacent the first capacitor die.

17. The packaged RF transistor amplifier of claim 16 , wherein the first capacitor die is a first output impedance matching capacitor die, and wherein the first arm is part of an electrical path connecting a drain terminal of the RF transistor amplifier die to the first output impedance matching capacitor die.

18. The packaged RF transistor amplifier of claim 14 , wherein the output lead extends through a first wall of the package housing, and the direct current lead extends through a second wall of the package housing.

19. The packaged RF transistor amplifier of claim 14 , wherein the input leadframe is a monolithic input leadframe that includes the input lead a second direct current lead and an electrical connection between the input lead and the second direct current lead, and wherein the input lead and the second direct current lead extend through spaced apart portions of the package housing.

20. The packaged RF transistor amplifier of claim 14 , wherein the output lead extends through a first wall of the package housing, and the direct current lead extends through a second wall of the package housing.

21. The packaged RF transistor amplifier of claim 18 , wherein the second wall is generally perpendicular to the first wall.

22. The packaged RF transistor amplifier of claim 14 , wherein the RF transistor amplifier die is configured to operate in at least a portion of one or more of the 2.5-2.7 GHz, 3.4-4.2 GHz, or 5.1-5.8 GHz frequency bands.

23. A packaged radio frequency (“RF”) transistor amplifier, comprising:
a package housing;
an RF transistor amplifier die that is mounted within the package housing,
a first output impedance matching capacitor die that is mounted within the package housing;
an input leadframe that electrically connects to a gate terminal of the RF transistor amplifier die; and
an output leadframe that includes an output lead that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die,
wherein the output leadframe is mounted on the first output impedance matching capacitor die and electrically connected to the first output impedance matching capacitor die via a first conductive bump, and
wherein the output leadframe is a monolithic structure that further comprises an output pad region and a first arm, and wherein the first arm is directly connected to the first output impedance matching capacitor die via the first conductive bump.

24. The packaged RF transistor amplifier of claim 23 , wherein the output leadframe further comprises a second arm that is directly connected to a second output impedance matching capacitor die by a second conductive bump.

25. The packaged RF transistor amplifier of claim 23 , wherein a distal end of the first arm is outside the package housing.

26. The packaged RF transistor amplifier of claim 23 , wherein the input leadframe is a monolithic structure that includes an input pad region, the input lead, and a third arm that extends from the input pad region to outside the package housing.

27. The packaged RF transistor amplifier of cla

Assignees

• Wolfspeed Inc

Inventors

• Chidurala Madhu
• Wilson Richard
• Jang Haedong
• Ward Simon

Classifications

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W44/234

  Arrangements for impedance matching · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/134

  having other interconnections parallel to the conductive base · CPC title