Planarization apparatus including superstrate chuck with bendable periphery

Patent metadata

Field	Value
Publication number	US-11587795-B2
Application number	US-202017035212-A
Country	US
Kind code	B2
Filing date	Sep 28, 2020
Priority date	Sep 28, 2020
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

A planarization apparatus, including a chuck having a first surface and a second surface at two opposing sides thereof. The chuck includes a first zone extending along a periphery of the chuck, a second zone at an inner portion of the chuck, the second zone being surrounded by the first zone; and a flexure connecting the first zone with the second zone. The first zone includes a first member extending along the first surface from the flexure and a first ring land protruding from the first member adjacent to the flexure.

First claim

What is claimed is:

1. A planarization apparatus, comprising:
a superstrate chuck having a first surface and a second surface at two opposing sides thereof, the superstrate chuck including:
a first zone extending along a periphery of the superstrate chuck; and
a second zone at an inner portion of the superstrate chuck, the second zone being surrounded by the first zone;
wherein the first zone includes:
a first member extending along the first surface from an edge of the second zone, the first member is configured bendable independently from the second zone; and
a first ring land protruding from the first member, and

wherein the first zone further comprises a bonding land protruding from the first member adjacent to the first ring land.

2. The planarization apparatus of claim 1 , further comprising an electrostatic force generation source configured to generate electrostatic force along the first surface at the first zone.

3. The planarization apparatus of claim 1 , further comprising a flexure connecting a portion of the first zone with a portion of the second zone, wherein the second zone includes a second ring land protruding from the first surface, such that the flexure is located between the first ring land and the second ring land.

4. The planarization apparatus of claim 1 , wherein the first member is spaced apart from the second zone with a gap, and the first member is bendable about the gap.

5. The planarization apparatus of claim 1 , wherein the superstrate chuck is configured to retain a superstrate at the first surface.

6. The planarization apparatus of claim 5 , wherein the first ring land is in contact with the superstrate at location between a mesa portion and a recessed peripheral portion of the superstrate.

7. The planarization apparatus of claim 6 , wherein the first zone further includes a bonding land protruding in contact with the superstrate at the recessed peripheral portion.

8. The planarization apparatus of claim 5 , wherein the second zone includes a second ring land protruding from the first surface and in contact with the superstrate within a range of the mesa portion.

9. The planarization apparatus of claim 1 , further comprising a pressure source configured to apply a pressure to the second zone.

10. The planarization apparatus of claim 1 , further comprising a vacuum source configured to apply vacuum to the first zone and the second zone.

11. The planarization apparatus of claim 1 , wherein the first zone further includes a second member extending along the second surface of the superstrate chuck, the first member and the second member define an empty space in the first zone.

12. The planarization apparatus of claim 11 , wherein the first zone further includes a stopper protruding from the second member towards the first member.

13. The planarization apparatus of claim 3 , further comprising one or more actuators configured to generate a force to move the first member about the flexure.

14. The planarization apparatus of claim 13 , wherein the one or more actuators mounted to the first member and a second member.

15. The planarization apparatus of claim 13 , wherein the one or more actuators connect the first member with the second member at a side distal to the second zone.

16. The planarization apparatus of claim 1 , further comprising one or more sensors configured to measure movement of the first member.

17. A planarization apparatus, comprising:
a superstrate chuck having a first surface and a second surface at two opposing sides thereof, the superstrate chuck including:
a first zone extending along a periphery of the superstrate chuck; and
a second zone at an inner portion of the superstrate chuck, the second zone being surrounded by the first zone;
wherein the first zone includes:
a first member extending along the first surface from an edge of the second zone, the first member is configured bendable independently from the second zone; and
a first ring land protruding from the first member,

wherein the first zone further includes a second member extending along the second surface of the superstrate chuck, the first member and the second member define an empty space in the first zone.

18. A planarization apparatus, comprising:
a superstrate chuck having a first surface and a second surface at two opposing sides thereof, the superstrate chuck including:
a first zone extending along a periphery of the superstrate chuck; and
a second zone at an inner portion of the superstrate chuck, the second zone being surrounded by the first zone;

wherein the first zone includes:
a first member extending along the first surface from the periphery of the superstrate chuck, the first member is configured to be bendable relative to the periphery of the superstrate chuck;
a first ring land protruding from the first member;
a second ring land protruding from the first member;
an upper member extending above the first member; and
one or more additional lands extending from the upper member towards a back surface of the first member.

Assignees

• Canon Kk

Inventors

• Lu Xiaoming

Classifications

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P14/6538

  by exposure to UV light · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H10P95/08 Primary

  Planarisation of organic insulating materials · CPC title