Substrate carrier deterioration detection and repair

Patent metadata

Field	Value
Publication number	US-11584019-B2
Application number	US-202017114178-A
Country	US
Kind code	B2
Filing date	Dec 7, 2020
Priority date	Oct 26, 2017
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

First claim

What is claimed is:

1. An apparatus for semiconductor manufacturing, comprising:
an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing;
a first robotic arm configured to uninstall the housing from the carrier and to reinstall the housing into the carrier;
one or more second robotic arms configured to remove the filter from the carrier and to install a new filter into the carrier; and
an output port to release the carrier to production.

2. The apparatus of claim 1 , wherein the one or more second robotic arms are further configured to install and uninstall an O-ring between the filter and the housing.

3. The apparatus of claim 1 , further comprising:
a first inspection mechanism configured to inspect the new filter before it is installed by the one or more second robotic arms.

4. The apparatus of claim 3 , wherein the first inspection mechanism includes:
a camera to take an image of the new filter; and
a controller configured to determine quality of the new filter based on the image.

5. The apparatus of claim 1 , further comprising:
a second inspection mechanism configured to inspect the new filter after it has been installed by the one or more second robotic arms.

6. The apparatus of claim 5 , wherein the second inspection mechanism includes a laser mechanism to detect flatness of a surface of the new filter.

7. The apparatus of claim 1 , further comprising:
a rotator for rotating the carrier before the carrier is accessed by the first robotic arm.

8. The apparatus of claim 1 , further comprising:
a supply container for holding new parts including new filters.

9. The apparatus of claim 1 , further comprising:
a parts disposal for holding parts removed from the carrier.

10. An apparatus for semiconductor manufacturing, comprising:
an input port to receive a substrate carrier, wherein the substrate carrier includes a carrier body, a housing, and an air filter installed between the carrier body and the housing;
a first robotic arm configured to uninstall the housing from the substrate carrier;
one or more second robotic arms configured to remove the air filter from the substrate carrier;
a controller configured to determine quality of a new air filter before the new air filter is installed into the substrate carrier; and
an output port to release the substrate carrier to production after the new air filter is installed.

11. The apparatus of claim 10 , further comprising:
a camera to take an image of the new air filter, wherein the controller is configured to determine the quality of the new air filter based on the image.

12. The apparatus of claim 10 , further comprising:
an inspector configured to inspect the new air filter after the new air filter has been installed into the substrate carrier.

13. The apparatus of claim 12 , wherein the inspector is configured to use a laser to detect flatness of a surface of the new air filter.

14. The apparatus of claim 10 , further comprising:
a supply container for holding new parts including new air filters; and
a parts disposal for holding parts removed from the substrate carrier.

15. The apparatus of claim 10 , wherein the input port and the output port are configured to be attached to an overhead transport (OHT).

16. The apparatus of claim 10 , wherein the one or more second robotic arms are further configured to install the new air filter into the substrate carrier, and the first robotic arm is further configured to reinstall the housing into the substrate carrier after the new air filter has been installed into the substrate carrier.

17. An apparatus for semiconductor manufacturing, comprising:
an input port to receive a substrate carrier, wherein the substrate carrier includes a carrier body, a housing, and a filter installed between the carrier body and the housing;
a first mechanism configured to uninstall the housing from the substrate carrier;
a second mechanism configured to remove the filter from the substrate carrier;
a controller configured to determine quality of a new filter;
a third mechanism configured to inspect the new filter after the new filter is installed into the substrate carrier; and
an output port to release the substrate carrier to production after the new filter is installed into the substrate carrier and is inspected.

18. The apparatus of claim 17 , wherein the first mechanism is further configured to reinstall the housing into the substrate carrier after the new filter has been installed into the substrate carrier.

19. The apparatus of claim 17 , wherein the second mechanism is further configured to install the new filter into the substrate carrier.

20. The apparatus of claim 17 , wherein the controller is configured to determine the quality of the new filter based on an image of the new filter.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wang Jen-Ti
• Lin Chih-Wei
• Li Fu-Hsien
• Chen Yi-Ming
• Hung Cheng-Ho

Classifications

• H10P90/12

  Preparing bulk and homogeneous wafers · CPC title

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P72/3604

  the workpieces being stored in a carrier, involving loading and unloading · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3408

  Docking arrangements · CPC title