Storage apparatus, a transfer system including the same, and a transferring method using the transfer system
US-12589942-B2 · Mar 31, 2026 · US
the workpieces being stored in a carrier, involving loading and unloading
the workpieces being stored in a carrier, involving loading and unloading · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/3604 |
| Official title | {the workpieces being stored in a carrier, involving loading and unloading} |
| Display label | the workpieces being stored in a carrier, involving loading and unloading |
| Total patents | 36 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2017 | 7 |
| 2018 | 5 |
| 2019 | 2 |
| 2020 | 4 |
| 2021 | 3 |
| 2023 | 4 |
| 2024 | 4 |
| 2025 | 3 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Nozzle and substrate processing apparatus including the same
US-12525470-B2 · Jan 13, 2026 · US
Frame unit forming method, frame unit forming apparatus, and method of forming device chips
US-2025300003-A1 · Sep 25, 2025 · US
Automated material handling system
US-2025183078-A1 · Jun 5, 2025 · US
Substrate carrier deterioration detection and repair
US-2025100161-A1 · Mar 27, 2025 · US
System with substrate carrier deterioration detection and repair
US-12162134-B2 · Dec 10, 2024 · US
Storage apparatus, a transfer system including the same, and a transferring method using the transfer system
US-2024228166-A1 · Jul 11, 2024 · US
Method of manufacturing a semiconductor device
US-2024014063-A1 · Jan 11, 2024 · US
Apparatus for preventing blockage of floating stage, substrate processing apparatus and substrate processing method
US-2024001401-A1 · Jan 4, 2024 · US
Nozzle and substrate processing apparatus including the same
US-2023207337-A1 · Jun 29, 2023 · US
Substrate carrier deterioration detection and repair
US-2023191619-A1 · Jun 22, 2023 · US
Technique for handling diced wafers of integrated circuits
US-11658056-B2 · May 23, 2023 · US
Substrate carrier deterioration detection and repair
US-11584019-B2 · Feb 21, 2023 · US
Substrate loading system
US-11195739-B2 · Dec 7, 2021 · US
Technique for handling diced wafers of integrated circuits
US-2021134648-A1 · May 6, 2021 · US
Substrate Carrier Deterioration Detection and Repair
US-2021118665-A1 · Apr 22, 2021 · US
Substrate carrier deterioration detection and repair
US-10861692-B2 · Dec 8, 2020 · US
Carrier substrate
US-10820426-B2 · Oct 27, 2020 · US
Substrate loading system
US-2020098596-A1 · Mar 26, 2020 · US
Apparatus and method for transferring a substrate
US-10529610-B2 · Jan 7, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/3604?
- CPC H10P72/3604 is the Cooperative Patent Classification code for “the workpieces being stored in a carrier, involving loading and unloading.”
- How many patents are filed under CPC H10P72/3604 (the workpieces being stored in a carrier, involving loading and unloading)?
- Our database includes 36 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/3604 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).