Maintaining coercive field after high temperature anneal for magnetic device applications with perpendicular magnetic anistropy

Patent metadata

Field	Value
Publication number	US-11569441-B2
Application number	US-202016876658-A
Country	US
Kind code	B2
Filing date	May 18, 2020
Priority date	Apr 3, 2017
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A magnetic tunnel junction with perpendicular magnetic anisotropy (PMA MTJ) is disclosed wherein a free layer interfaces with a tunnel barrier and has a second interface with an oxide layer. A lattice-matching layer adjoins an opposite side of the oxide layer with respect to the free layer and is comprised of CoXFeYNiZLWMV or an oxide or nitride of Ru, Ta, Ti, or Si, wherein L is one of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag, or P, and M is one of Mo, Mg, Ta, Cr, W, or V, (x+y+z+w+v)=100 atomic %, x+y>0, and each of v and w are >0. The lattice-matching layer grows a BCC structure during annealing thereby promoting BCC structure growth in the oxide layer that results in enhanced free layer PMA and improved thermal stability.

First claim

What is claimed is:

1. A method comprising:
providing a stack of layers that includes a reference layer, a tunnel barrier, and a free layer;
forming an oxide layer on the free layer;
forming a lattice-matching layer on the oxide layer;
forming a hard mask on the first lattice-matching layer; and
annealing the lattice-matching layer so that the lattice-matching layer grows a body centered cubic (BCC) structure.

2. The method of claim 1 , wherein the lattice-matching layer includes non-magnetic metals or alloys.

3. The method of claim 1 , wherein the lattice-matching layer includes non-magnetic metals or alloys of M, and
wherein M is selected from the group consisting of Mo, Mg, Ta, Cr, W, Ru and V.

4. The method of claim 1 , wherein the lattice-matching layer includes a material having a composition denoted as Co X Fe Y Ni Z L W ,
wherein (x+y) is greater than zero, wherein w is greater than zero, and wherein (x+y+z+w) is equal to 100 atomic %, and
wherein L is a material selected from the group consisting of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag, and P.

5. The method of claim 1 , wherein the lattice-matching layer includes a material having a composition denoted as Co X Fe Y Ni Z L W M V ,
wherein (x+y) is greater than zero, wherein each of v and w is greater than zero, and wherein (x+y+z+w+v) is equal to 100 atomic %,
wherein M is material selected from the group consisting of Mo, Mg, Ta, Cr, W, Ru, and V, and
wherein L is a material selected from the group consisting of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag and P.

6. The method of claim 1 , wherein the oxide layer includes a material selected from the group consisting of MgTaOx, MgO, SiOx, SrTiOx, BaTiOx, CaTiOx, LaAlOx, MnOx, VOx, Al 2 O 3 , TiOx, BOx, and HfOx.

7. The method of claim 1 , wherein the lattice-matching layer includes a material that is an oxide or nitride of Ru, Ta, Ti, or Si.

8. A method comprising:
forming a lattice-matching layer on a substrate;
forming an oxide layer on the substrate;
forming a free layer on the substrate, the free layer interfacing with the oxide layer;
forming a tunnel barrier layer on the substrate, the tunnel barrier layer interfacing with the free layer;
forming a reference layer on the on the substrate, the reference layer interfacing with the tunnel barrier layer;
forming a hard mask layer on the substrate to form a stack of layers that includes the hard mask layer, the reference layer, the tunnel barrier layer, the free layer, the oxide layer and the lattice-matching layer; and
annealing the stack of layers so that the lattice-matching layer grows a body centered cubic (BCC) structure.

9. The method of claim 8 , wherein the lattice-matching layer includes non-magnetic metals or alloys of M, and
wherein M is selected from the group consisting of Mo, Mg, Ta, Cr, W, Ru and V.

10. The method of claim 8 , wherein the lattice-matching layer includes a material having a composition denoted as Co X Fe Y Ni Z L W ,
wherein (x+y) is greater than zero, wherein w is greater than zero, and wherein (x+y+z+w) is equal to 100 atomic %, and
wherein L is a material selected from the group consisting of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag, and P.

11. The method of claim 8 , wherein the lattice-matching layer includes a material having a composition denoted as Co X Fe Y Ni Z L W M V ,
wherein (x+y) is greater than zero, wherein each of v and w is greater than zero, and wherein (x+y+z+w+v) is equal to 100 atomic %,
wherein M is material selected from the group consisting of Mo, Mg, Ta, Cr, W, Ru, and V, and
wherein L is a material selected from the group consisting of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag and P.

12. The method of claim 8 , further comprising forming a seed layer on the substrate, and
wherein forming the lattice-matching layer on the substrate includes forming the lattice-matching layer directly on the seed layer such that the lattice-matching layer interfaces with the seed layer.

13. The method of claim 8 , wherein forming the oxide layer on the lattice-matching layer includes forming the oxide layer directly on the lattice-matching layer.

14. The method of claim 8 , wherein annealing the stack of layers includes annealing at a temperature of about 400° C.

15. A method comprising:
forming a stack of layers on a substrate, the stack of layers including a reference layer, a tunnel barrier layer, a free layer, an oxide layer and a lattice-matching layer;
annealing the stack of layers so that the lattice-matching layer grows a body centered cubic (BCC) structure; and
patterning the stack of layers to form a magnetic tunnel junction (MTJ) structure.

16. The method of claim 15 , wherein the lattice-matching layer includes a first layer having a first material composition and a second layer having a second material composition that is different from the first material composition.

17. The method of claim 16 , wherein the lattice-matching layer further includes a third layer having a third material composition that is different from the second material composition.

18. The method of claim 15 , wherein annealing the stack of layers includes annealing at a temperature of about 400° C.

19. The method of claim 15 , wherein the lattice-matching layer includes a material selected from the group consisting of FeL and CoL, and
wherein L is a material selected from the group consisting of B, Zr, Nb, Hf, Mo, Cu, Cr, Mg, Ta, Ti, Au, Ag, and P.

20. The method of claim 15 , further comprising:
forming an insulting layer on the MTJ structure; and
forming an electrode layer on the MTJ structure.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Huanlong
• Lee Yuan-Jen
• Zhu Jian
• Jan Guenole
• Thomas Luc
• Wang Po-Kang
• Tong Ru-Ying
• Iwata Jodi

Classifications

• H01F10/14

  containing iron or nickel ({H01F10/126} , H01F10/13, H01F10/16 take precedence) · CPC title

• H01L43/12 Primary

  Electricity · mapped topic

• H01F10/32

  Spin-exchange-coupled multilayers, e.g. nanostructured superlattices {(applying spin-exchange-coupled multilayers to substrates H01F41/302)} · CPC title

• H01L43/08

  Electricity · mapped topic

• H01F41/14

  for applying magnetic films to substrates · CPC title