Method for producing structure, and structure

Patent metadata

Field	Value
Publication number	US-11569192-B2
Application number	US-201816615816-A
Country	US
Kind code	B2
Filing date	May 24, 2018
Priority date	May 25, 2017
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

First claim

The invention claimed is:

1. A manufacturing method of a structure in which a plurality of elements are bonded, the manufacturing method comprising:
applying a liquid resin to a surface of at least one of the plurality of elements;
smoothing a surface of the liquid resin by surface tension of the applied liquid resin;
forming a resin layer by curing the liquid resin, wherein a surface of the resin layer is smoothed;
forming a metal thin film on the smoothed surface of the resin layer, wherein the resin layer is sandwiched between the metal thin film and at least one of the plurality of elements;
forming another metal thin film on a surface of another element; and
superposing the metal thin film of the at least one element and the metal thin film of the other element, and tightly attaching and bonding the metal thin film of the at least one element and the metal thin film of the other element by deformation of the resin layer.

2. The manufacturing method of the structure according to claim 1 , wherein
the resin layer has elasticity.

3. The manufacturing method of the structure according to claim 2 , wherein
the plurality of elements are semiconductors.

4. The manufacturing method of the structure according to claim 3 , wherein
at least one of the semiconductors comprises a plurality of electrodes protruding from a surface of the at least one semiconductor for a predetermined length; and
the liquid resin is applied between the plurality of electrodes, and the surface of the liquid resin is smoothed by surface tension of the liquid resin such that distal end surfaces of the plurality of electrodes and the surface of the liquid resin are in the same plane.

5. The manufacturing method of the structure according to claim 3 , wherein
the plurality of elements are semiconductor chips that form semiconductors,
the liquid resin is applied to a front surface and/or a back surface of each of the semiconductor chips, and
the applied liquid resin is smoothed to have a surface roughness lower than that of the other element.

6. The manufacturing method of the structure according to claim 1 , wherein
the plurality of elements are semiconductors.

7. The manufacturing method of the structure according to claim 6 , wherein
at least one of the semiconductors comprises a plurality of electrodes protruding from a surface of the at least one semiconductor for a predetermined length; and
the liquid resin is applied between the plurality of electrodes, and the surface of the liquid resin is smoothed by surface tension of the liquid resin such that distal end surfaces of the plurality of electrodes and the surface of the liquid resin are in the same plane.

8. The manufacturing method of the structure according to claim 6 , wherein
the plurality of elements are semiconductor chips that form semiconductors,
the liquid resin is applied to a front surface and/or a back surface of each of the semiconductor chips, and
the applied liquid resin is smoothed to have a surface roughness lower than that of the other element.

9. The manufacturing method of the structure according to claim 1 , wherein
the metal thin film of the at least one element is bonded to the metal thin film of the other element using atomic diffusion.

10. A manufacturing method of a structure in which a plurality of elements are bonded, the manufacturing method comprising:
applying a liquid resin to surfaces of the plurality of elements;
smoothing surfaces of the liquid resin using surface tension of the applied liquid resin;
foaming resin layers by curing the liquid resin, wherein a surface of each of the resin layers is smoothed;
forming a metal thin film on the smoothed surface of each of the resin layers, wherein each of the resin layers is sandwiched between the metal thin film and each of the plurality of elements; and
superposing the metal thin films of the plurality of elements to one another, and tightly attaching and bonding the metal thin films to each other by deformation of the resin layer.

11. The manufacturing method of the structure according to claim 10 , wherein
the resin layers have elasticity.

12. The manufacturing method of the structure according to claim 11 , wherein
the plurality of elements are semiconductors.

13. The manufacturing method of the structure according to claim 12 , wherein
at least one of the semiconductors comprises a plurality of electrodes protruding from a surface of the at least one semiconductor for a predetermined length; and
the liquid resin is applied between the plurality of electrodes, and the surface of the liquid resin is smoothed by surface tension of the liquid resin such that distal end surfaces of the plurality of electrodes and the surface of the liquid resin are in the same plane.

14. The manufacturing method of the structure according to claim 12 , wherein
the plurality of elements are semiconductor chips that form semiconductors,
the liquid resin is applied to a front surface and/or a back surface of each of the semiconductor chips, and
the applied liquid resin is smoothed to have a surface roughness lower than that of the plurality of elements.

15. The manufacturing method of the structure according to claim 10 , wherein
the plurality of elements are semiconductors.

16. The manufacturing method of the structure according to claim 15 , wherein
at least one of the semiconductors comprises a plurality of electrodes protruding from a surface of the at least one semiconductor for a predetermined length; and
the liquid resin is applied between the plurality of electrodes, and the surface of the liquid resin is smoothed by surface tension of the liquid resin such that distal end surfaces of the plurality of electrodes and the surface of the liquid resin are in the same plane.

17. The manufacturing method of the structure according to claim 15 , wherein
the plurality of elements are semiconductor chips that form semiconductors,
the liquid resin is applied to a front surface and/or a back surface of each of the semiconductor chips, and
the applied liquid resin is smoothed to have a surface roughness lower than that of the plurality of elements.

18. The manufacturing method of the structure according to claim 10 , wherein
the metal thin film of at least one of the plurality of elements is bonded to the metal thin film of another element using atomic diffusion.

Assignees

• Shinkawa Kk
• Univ Tohoku

Inventors

• Eguchi Yuji
• Seyama Kohei
• Nakamura Tomonori
• Kikuchi Hiroshi
• Shimatsu Takehito
• UOMOTO Miyuki

Classifications

• H01L24/27 Primary

  Electricity · mapped topic

• H01L2224/8383

  Electricity · mapped topic

• H01L24/83

  Electricity · mapped topic

• H01L24/30

  Electricity · mapped topic

• H01L2224/27416

  Electricity · mapped topic