Wafer cassette packing apparatus

Patent metadata

Field	Value
Publication number	US-11569106-B2
Application number	US-201916547856-A
Country	US
Kind code	B2
Filing date	Aug 22, 2019
Priority date	Jan 9, 2019
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.

First claim

What is claimed is:

1. An apparatus for packing wafer cassette, the apparatus comprising:
a loading part to which a wafer cassette is loaded;
an accessory inspection part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette;
a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed;
a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film;
a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film;
a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed;
an unloading part configured to discharge the wafer cassette which has been completely packaged;
a first defective product discharge part configured to discharge the wafer cassette determined to be defective as a result of inspection by the accessory inspection part;
a packing inspection part configured to inspect a condition of the wafer cassette which has been packed by the secondary film packing part; and
a second defective product discharge part configured to discharge the wafer cassette determined to be defective as a result of inspection by the packing inspection part,
wherein each of the accessory inspection part and the packing inspection part includes a camera and performs a vision inspection,
wherein the wafer cassette determined as normal by the packing inspection part is moved to the second label attaching part, and
wherein the second label attaching part attaches the second label to the wafer cassette which is completely double-packed using the primary film and the secondary film.

2. The apparatus of claim 1 , wherein the recipe includes at least one of a bar code and a quick response (QR) code.

3. The apparatus of claim 2 , wherein the recipe contains selection information on at least one of the primary film, the first label, the secondary film, the second label, a packing direction, and a packing method according to the kinds of wafer cassettes.

4. The apparatus of claim 3 , wherein the accessory inspection part comprises:
a stage configured to rotate and support the wafer cassette;
the camera configured to inspect the recipe attached to the wafer cassette and the accessories of the wafer cassette; and
a robot diffraction arm configured to freely move the camera.

5. The apparatus of claim 1 , wherein the primary film packing part and the secondary film packing part include a film packing device.

6. The apparatus of claim 5 , wherein the film packing device comprises:
a film supply unit configured to supply a packing film;
a film opening unit configured to open an opening of the packing film;
a cassette inserting unit configured to insert a wafer cassette into the opening of the packing film; and
a sealing unit configured to seal an edge of the packing film into which the wafer cassette has been inserted.

7. The apparatus of claim 1 , further comprising a drying agent attaching part configured to attach a drying agent on a surface of the primary film with which the wafer cassette has been packed.

8. The apparatus of claim 7 , wherein the drying agent attaching part comprises:
a drying agent supply unit configured to supply a drying agent to one side of the wafer cassette which has been packed using the primary film; and
a taping unit configured to attach the drying agent to the surface of the primary film using a tape.

Assignees

• Sk Siltron Co Ltd

Inventors

• Yun Tae Ju
• Lee Chi Bok

Classifications

• H10P72/3218

  Conveying cassettes, containers or carriers · CPC title

• H10P72/0438

  Apparatus for making assemblies not otherwise provided for, e.g. package constructions · CPC title

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H10P72/0616 Primary

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H01L21/673

  Electricity · mapped topic