Planarization apparatus, planarization process, and method of manufacturing an article

Patent metadata

Field	Value
Publication number	US-11562924-B2
Application number	US-202016779205-A
Country	US
Kind code	B2
Filing date	Jan 31, 2020
Priority date	Jan 31, 2020
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.

First claim

What is claimed is:

1. An apparatus, comprising:
a chuck comprising a plurality of lands defining a central zone and a peripheral zone surrounding the central zone; and
a superstrate including:
a body having an edge;
a first side having:
a mesa extending therefrom, wherein an edge of the mesa is at a radial width from the edge of the body;
a contact surface provided on the mesa to be in contact with a formable material formed on a substrate; and

a second side opposite to the first side having a central portion and a peripheral portion surrounding the central portion, the peripheral portion including a recessed region,

wherein the second side is in contact with the lands of the chuck while being retained thereby.

2. The apparatus of claim 1 , wherein recessed region is concentric with the body.

3. The apparatus of claim 1 , wherein the recessed region includes a stepped down surface extending circumferentially throughout the peripheral portion of the second side.

4. The apparatus of claim 1 , wherein the recessed region includes a tapered down surface extending circumferentially throughout the peripheral portion of the second side.

5. The apparatus of claim 1 , wherein the recessed region of the second side has a radial width wider than the radial width from the edge of the mesa to the edge of the body.

6. The apparatus of claim 1 , wherein the recessed region of the second side has a radial width equal to the radial width from the edge of the mesa to the edge of the body.

7. The apparatus of claim 1 , wherein the recessed region further comprises a trench extending circumferentially between the central portion and an edge of the second side.

8. The apparatus of claim 1 , wherein the lands of the chuck have a same height.

Assignees

• Canon Kk

Inventors

• Bamesberger Seth J
• Ozturk Ozkan
• Jones Christopher Ellis
• Im Se-Hyuk

Classifications

• H01L21/67253

  Electricity · mapped topic

• H01L21/7684 Primary

  Electricity · mapped topic

• H01L21/32115

  Electricity · mapped topic

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P95/04

  Planarisation of conductive or resistive materials · CPC title