Heat-sinking components mounted on printed boards

Patent metadata

Field	Value
Publication number	US-2016081196-A1
Application number	US-201414487922-A
Country	US
Kind code	A1
Filing date	Sep 16, 2014
Priority date	Sep 16, 2014
Publication date	Mar 17, 2016
Grant date	—

Abstract

In some examples, a method may include coupling a printed board assembly (PBA) to a fixture. In some examples, the PBA may include a printed board and a plurality of components that are electrically and mechanically coupled to the printed board, where each of the plurality of components defines a respective surface. The method may further include planarizing at least one of the respective surfaces of the plurality of components using an abrasive tool. The method may further include attaching a heat sink to the respective surfaces of the plurality of components. A system for planarizing surfaces of components attached to printed boards is also described.

First claim

What is claimed is:

1 . A method comprising:
coupling a printed board assembly to a fixture, wherein the printed board assembly comprises a printed board and a plurality of components electrically and mechanically coupled to the printed board, and wherein each component of the plurality of components defines a respective surface; planarizing at least one of the respective surfaces of the plurality of components using an abrasive tool; and attaching a heat sink to the respective surfaces of the plurality of components.

2 . The method of claim 1 , further comprising:
positioning the printed board and heat sink within a housing comprising a thermally conductive material; and thermally coupling the heat sink and the thermally conductive material of the housing.

3 . The method of claim 1 , wherein the fixture includes a substantially rigid support and a compliant film, and wherein coupling the printed board assembly to the fixture comprises:
positioning the compliant film between a first surface of the printed board and the substantially rigid support, wherein a second surface of the printed board comprises at least two of the plurality of components, wherein the first surface of the printed board is opposite of the second surface, and wherein the compliant film is configured to conform to surface features on the first surface of the printed board.

4 . The method of claim 3 , wherein the compliant film comprises a polyurethane film.

5 . The method of claim 1 , wherein the fixture defines a surface configured to hold the printed board substantially planar while planarizing the at least one of the respective surfaces.

6 . The method of claim 1 , wherein planarizing at least one of the respective surfaces of the plurality of components further comprises moving a substantially planar surface of the abrasive tool in a direction substantially parallel to the substantially planar surface relative to the respective surfaces of the plurality of components.

7 . The method of claim 1 , wherein the respective surfaces of the plurality of components are surfaces substantially parallel to a major surface of the printed board.

8 . The method of claim 1 , wherein the abrasive tool comprises a lapping film on a rigid plate.

9 . The method of claim 1 , wherein the abrasive tool comprises an abrasive slurry and a substantially planar plate.

10 . The method of claim 1 , wherein the plurality of components comprise the active devices of a SSD.

11 . A system comprising:
a fixture configured to restrain a printed board assembly, wherein the printed board assembly comprises a printed board and a plurality of components electrically and mechanically coupled to the printed board, and wherein each component of the plurality of components defines a respective surface; and an abrasive tool, wherein at least one of the fixture or the abrasive tool is configured to be moved relative to the other of the abrasive tool or the fixture to planarize at least one of the respective surfaces of the plurality of components such that the respective surfaces of the plurality of components lie in a substantially flat plane after planarization.

12 . The system of claim 11 , wherein the fixture includes a substantially rigid support and a compliant film, and wherein the compliant film is positioned between a first surface of the printed board and the substantially rigid support, wherein a second surface comprises at least two of the plurality of components, wherein the first surface of the printed board is opposite of the second surface, and wherein the compliant film is configured to conform to surface features on the first surface of the printed board.

13 . The system of claim 12 , wherein the compliant film comprises a polyurethane film.

14 . The system of claim 11 , wherein the fixture defines a surface configured to hold the printed board substantially planar.

15 . The system of claim 11 , wherein the respective surfaces of the plurality of components are surfaces substantially parallel to the printed board.

16 . The system of claim 11 , wherein the abrasive tool comprises a lapping film on a rigid plate.

17 . The system of claim 11 , wherein the abrasive tool comprises an abrasive slurry and a substantially planar plate.

18 . The system of claim 11 , wherein the plurality of components comprise the active devices of a SSD.

19 . A system comprising:
means for restraining a printed board assembly, wherein the printed board assembly comprises a printed board and a plurality of components electrically and mechanically coupled to the printed board, and wherein each component of the plurality of components defines a respective surface; and means for planarizing at least one of the respective surfaces of the plurality of components such that the respective surfaces of the plurality of components lie in a substantially flat plane after planarization.

20 . The system of claim 18 , wherein the means for restraining the printed board comprises means for holding the printed board substantially planar.

Assignees

• HGST Netherlands BV

Inventors

• Babin Sr Michael T

Classifications

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title

• B24B37/30 Primary

  for single side lapping of plane surfaces · CPC title

• H05K2203/025

  Abrading, e.g. grinding or sand blasting · CPC title

• H05K2203/0165

  Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing · CPC title

• H05K3/22 Primary

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title