Chip spacing maintaining apparatus

Patent metadata

Field	Value
Publication number	US-2016007479-A1
Application number	US-201514789572-A
Country	US
Kind code	A1
Filing date	Jul 1, 2015
Priority date	Jul 1, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, the expand sheet being supported at its peripheral portion to an annular frame is provided. The chip spacing maintaining apparatus includes a far-infrared radiation applying unit for applying far-infrared radiation toward the expand sheet expanded in a target area between the outer circumference of the workpiece and the inner circumference of the annular frame, thereby shrinking the expand sheet in the target area, and an air layer forming unit provided adjacent to the far-infrared radiation applying unit, the air layer forming unit having a nozzle hole for discharging a gas toward the workpiece in applying the far-infrared radiation from the far-infrared radiation applying unit toward the expand sheet, thereby forming an air layer above the workpiece.

First claim

What is claimed is:

1 . A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, said expand sheet being supported at its peripheral portion to an annular frame, said chip spacing maintaining apparatus comprising:
a table having a support surface for supporting said workpiece, said support surface being adapted to hold said workpiece through said expand sheet under suction; fixing means for fixing said annular frame to the peripheral portion of said table; expanding means for expanding said expand sheet to form the spacing between said chips; far-infrared radiation applying means provided above said support surface of said table for applying far-infrared radiation toward said expand sheet expanded by said expanding means in a target area between an outer circumference of said workpiece and an inner circumference of said annular frame, thereby shrinking said expand sheet in said target area; positioning means for moving said far-infrared radiation applying means between a standby position and an operational position where the far-infrared radiation is applied to said expand sheet; and air layer forming means provided adjacent to said far-infrared radiation applying means, said air layer forming means having a nozzle hole for discharging a gas toward said workpiece in applying the far-infrared radiation from said far-infrared radiation applying means toward said expand sheet, thereby forming an air layer above said workpiece.

Assignees

• Disco Corp

Inventors

• Hattori Atsushi
• Ueki Atsushi

Classifications

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title