Substrate cleaning apparatus and substrate cleaning method

Patent metadata

Field	Value
Publication number	US-11554389-B2
Application number	US-202117152870-A
Country	US
Kind code	B2
Filing date	Jan 20, 2021
Priority date	Jan 21, 2020
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

First claim

We claim:

1. A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively, the substrate cleaning apparatus comprising:
a driving device configured to move the cleaning member to be brought into contact with the surface of the substrate; and
a spin chuck configured to rotate the substrate,
wherein an entire area of a top surface of the cleaning member comes into contact with the surface of the substrate, and
wherein a contact region between the cleaning member and the surface of the substrate has a shape that is widened radially from a center side of the substrate toward a peripheral side thereof.

2. The substrate cleaning apparatus of claim 1 ,
wherein the contact region of the cleaning member is of a sector shape when viewed from a top.

3. The substrate cleaning apparatus of claim 1 ,
wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate.

4. The substrate cleaning apparatus of claim 1 ,
wherein a groove is formed on the contact region of the cleaning member.

5. The substrate cleaning apparatus of claim 1 ,
wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate,
a groove is formed on a contact region of each of the central cleaning member and the peripheral cleaning member which comes into contact with the substrate, and
the groove of the peripheral cleaning member is larger than the groove of the central cleaning member.

6. The substrate cleaning apparatus of claim 1 ,
wherein the cleaning member has a circular sector shape and a central angle θ of the cleaning member is equal to or higher than 54 degrees.

7. A substrate cleaning method of cleaning a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively, the substrate cleaning apparatus comprising:
a driving device configured to move the cleaning member to be brought into contact with the surface of the substrate; and
a spin chuck configured to rotate the substrate,
wherein an entire area of a top surface of the cleaning member comes into contact with the surface of the substrate, and
wherein the cleaning member comprises a central cleaning member configured to be brought into contact with a central portion of the substrate and a peripheral cleaning member configured to be brought into contact with a peripheral portion of the substrate,
a contact region of each of the central cleaning member and the peripheral cleaning member has a shape widened radially from a central side of the substrate toward a peripheral side thereof,
the substrate cleaning method comprises:
rotating the cleaning member and the substrate relatively while bringing the cleaning member configured to be brought into contact with the surface of the substrate into contact with a cleaning target surface of the substrate;
cleaning the central portion of the substrate by the central cleaning member; and
cleaning the peripheral portion of the substrate by the peripheral cleaning member.

8. The substrate cleaning method of claim 7 ,
wherein the contact region of the central cleaning member is of a sector shape when viewed from a top, and a center of the sector shape is deviated from a center of the substrate.

9. The substrate cleaning method of claim 7 ,
wherein the contact region of the peripheral cleaning member is of a sector shape when viewed from a top, and a center of the sector shape is deviated from a center of the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Kubo Akihiro
• Takiguchi Yasushi
• Kodama Teruhiko
• Okamoto Yoshiki

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• B08B11/02

  Devices for holding articles during cleaning {(B08B9/42 takes precedence)} · CPC title

• B08B3/04

  Cleaning involving contact with liquid · CPC title