Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board

Patent metadata

Field	Value
Publication number	US-11553593-B2
Application number	US-201917053661-A
Country	US
Kind code	B2
Filing date	Apr 25, 2019
Priority date	May 9, 2018
Publication date	Jan 10, 2023
Grant date	Jan 10, 2023

Abstract

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

First claim

The invention claimed is:

1. A support-attached resin film for an interlayer insulating layer, comprising: the support, and a resin composition layer formed on one side surface of the support,
wherein the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less.

2. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the support is a polyethylene terephthalate film, and a thickness thereof is 75 μm or less.

3. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the resin composition layer is a layer containing a resin composition (1) containing an epoxy resin (a) and a cyanate resin (b).

4. The support-attached resin film for an interlayer insulating layer according to claim 3 , wherein the resin composition (1) further contains at least one selected from an active ester curing agent (c), a curing accelerator (d), and inorganic filler (e).

5. The support-attached resin film for an interlayer insulating layer according to claim 4 , wherein the resin composition (1) contains the epoxy resin (a), the cyanate resin (b), the active ester curing agent (c), the curing accelerator, (d) and the inorganic filler (e), and
a content of the epoxy resin (a) is from 5 to 40 parts by mass, a content of the cyanate resin (b) is from 1 to 20 parts by mass, a content of the active ester curing agent (c) is from 2 to 30 parts by mass, a content of the curing accelerator (d) is from 0.01 to 1 part by mass, and a content of the inorganic filler (e) is from 40 to 85 parts by mass with respect to 100 parts by mass of the resin composition (1) in terms of solid content.

6. The support-attached resin film for an interlayer insulating layer according to claim 3 , wherein the resin composition (1) further contains at least one selected from dicyandiamide (f), a phenoxy resin (g), and a resin having a siloxane skeleton (h).

7. The support-attached resin film for an interlayer insulating layer according to claim 3 , wherein the resin composition layer includes a resin composition layer for the interlayer insulating layer and an adhesive auxiliary layer, and the resin composition layer for the interlayer insulating layer is a layer obtained by forming the resin composition (1) as a layer.

8. The support-attached resin film for an interlayer insulating layer according to claim 7 , wherein the adhesive auxiliary layer is a layer obtained by forming a resin composition ( 2 ) containing an epoxy resin (i) and a cyanate resin (j) as a layer.

9. The support-attached resin film for an interlayer insulating layer according to claim 8 , wherein the resin composition (2) further contains at least one selected from an inorganic filler having a specific surface area of 20 m 2 /g or more (k), a polyamide resin containing a polybutadiene skeleton (m), and a phenoxy resin (n).

10. The support-attached resin film for an interlayer insulating layer according to claim 7 , wherein a thickness of the support is from 10 to 150 μm, a thickness of the resin composition layer for the interlayer insulating layer is from 5 to 50 μm, and a thickness of the adhesive auxiliary layer is from 1 to 10 μm.

11. The support-attached resin film for an interlayer insulating layer according to claim 1 , which is used when the resin composition layer is cured to form the interlayer insulating layer while the support is not peeled off.

12. A multilayer printed wiring board comprising an interlayer insulating layer formed by using the support-attached resin film for an interlayer insulating layer according to claim 1 .

13. The multilayer printed wiring board according to claim 12 , wherein an arithmetic mean roughness Ra of the interlayer insulating layer is 300 nm or less.

14. A method of manufacturing a multilayer printed-wiring board, the method comprising forming an interlayer insulating layer by using the support-attached resin film for an interlayer insulating layer according to claim 1 .

15. The method of manufacturing the multilayer printed wiring board according to claim 14 , wherein the step of forming of the interlayer insulating layer is a step of heating the support-attached resin film for an interlayer insulating layer in a state where the support is not peeled off, so as to thermally cure the resin composition layer.

16. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the resin composition layer does not contain a fiber base material.

17. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the average maximum height of exposed portions of the particles is 0.8 μm or less.

18. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the average maximum height of exposed portions of the particles is 0.5 μm or less.

19. The support-attached resin film for an interlayer insulating layer according to claim 1 , wherein the average maximum height of exposed portions of the particles is 0.3 μm or less.

20. The support-attached resin film for an interlayer insulating layer according to claim 1 , the particles exposed on the one side surface comprise particles used as a lubricant during production of the support.

Assignees

• Showa Denko Materials Co Ltd

Inventors

• Suzukawa Takayuki
• Sugawara Ikuo
• Irino Tetsurou
• Tezuka Yuuki
• Matsuura Masaharu

Classifications

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• C08G59/4021

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

• C08G59/42

  Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title

• C08G59/46

  together with other curing agents · CPC title

• C08L71/12

  Polyphenylene oxides · CPC title