Epoxy resin composition for use as structural adhesive
US-12509561-B2 · Dec 30, 2025 · US
together with other curing agents
together with other curing agents · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/46 |
| Official title | together with other curing agents |
| Display label | together with other curing agents |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 2 |
| 2017 | 3 |
| 2018 | 5 |
| 2019 | 7 |
| 2020 | 7 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 4 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Novel curing agent having ester and amide groups, method for preparing the same, epoxy composition, cured product, and article comprising the same
US-2025388719-A1 · Dec 25, 2025 · US
Toughened Two Component Epoxy Structural Adhesive
US-2025320391-A1 · Oct 16, 2025 · US
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
US-12278117-B2 · Apr 15, 2025 · US
New epoxy resin composition for use as structural adhesive
US-2025101188-A1 · Mar 27, 2025 · US
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
US-2024186153-A1 · Jun 6, 2024 · US
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
US-11942336-B2 · Mar 26, 2024 · US
Thermosetting epoxy resin composition having low curing temperature and good storage stability
US-11891507-B2 · Feb 6, 2024 · US
Curable composition, cured product, and adhesive
US-2024010782-A1 · Jan 11, 2024 · US
Epoxy compound, composition, cured product and laminate
US-11760711-B2 · Sep 19, 2023 · US
Epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material
US-11661484-B2 · May 30, 2023 · US
Curing agents for epoxy resin coatings
US-2023103342-A1 · Apr 6, 2023 · US
Curing agent for water-based epoxy resin, water-based epoxy resin composition, and cured product thereof
US-11572436-B2 · Feb 7, 2023 · US
Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board
US-11553593-B2 · Jan 10, 2023 · US
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
US-2022199430-A1 · Jun 23, 2022 · US
Epoxy resin composition, prepreg, and fiber-reinforced composite material
US-11345808-B2 · May 31, 2022 · US
Resin composition for fiber-reinforced composite material, and fiber-reinforced composite material using same
US-2022025140-A1 · Jan 27, 2022 · US
Thermosetting epoxy resin composition having low curing temperature and good storage stability
US-2021355316-A1 · Nov 18, 2021 · US
Epoxy composite formulation
US-2021301074-A1 · Sep 30, 2021 · US
Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board
US-2021235582-A1 · Jul 29, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/46?
- CPC C08G59/46 is the Cooperative Patent Classification code for “together with other curing agents.”
- How many patents are filed under CPC C08G59/46 (together with other curing agents)?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/46 growing?
- Publication counts under this code: 4 in 2024 vs 5 in 2025 (latest complete years).