MEMS apparatus with anti-stiction layer

Patent metadata

Field	Value
Publication number	US-11542151-B2
Application number	US-202016934236-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Jun 30, 2017
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

The present disclosure relates to a microelectromechanical systems (MEMS) apparatus. The MEMS apparatus includes a base substrate and a conductive routing layer disposed over the base substrate. A bump feature is disposed directly over the conductive routing layer. Opposing outermost sidewalls of the bump feature are laterally between outermost sidewalls of the conductive routing layer. A MEMS substrate is bonded to the base substrate and includes a MEMS device directly over the bump feature. An anti-stiction layer is arranged on one or more of the bump feature and the MEMS device.

First claim

What is claimed is:

1. A microelectromechanical systems (MEMS) apparatus, comprising:
a base substrate;
a conductive routing layer disposed over the base substrate;
a bump feature disposed directly over the conductive routing layer, wherein opposing outermost sidewalls of the bump feature are laterally between outermost sidewalls of the conductive routing layer;
a MEMS substrate bonded to the base substrate and comprising a MEMS device directly over the bump feature;
an anti-stiction layer arranged on one or more of the bump feature and the MEMS device; and
wherein the anti-stiction layer comprises a topmost surface that continuously extends between opposing outermost sidewalls of the anti-stiction layer, an entirety of the topmost surface being vertically above a top of the bump feature.

2. The MEMS apparatus of claim 1 , wherein the bump feature directly contacts an upper surface of the conductive routing layer.

3. The MEMS apparatus of claim 1 , wherein the opposing outermost sidewalls of the anti-stiction layer extend from a bottom of the anti-stiction layer to the topmost surface of the anti-stiction layer.

4. The MEMS apparatus of claim 1 , wherein the anti-stiction layer comprises a rough upper surface that faces the MEMS device.

5. The MEMS apparatus of claim 1 , further comprising:
a conductive layer disposed directly between the bump feature and the anti-stiction layer.

6. The MEMS apparatus of claim 5 , wherein the conductive layer comprises a vertical segment extending along an outermost sidewall of the bump feature and a lateral segment extending outward from a sidewall of the vertical segment and away from the bump feature.

7. The MEMS apparatus of claim 5 , wherein the anti-stiction layer laterally extends past opposing outermost sidewalls of the conductive layer.

8. The MEMS apparatus of claim 5 , wherein the conductive layer laterally extends past opposing sides of the anti-stiction layer.

9. A microelectromechanical systems (MEMS) apparatus, comprising:
a conductive routing layer over a base substrate;
a bump feature disposed directly over an upper surface of the conductive routing layer;
a dielectric material disposed over the base substrate on opposing sides of the bump feature;
a MEMS substrate bonded to the base substrate by way of the dielectric material;
an anti-stiction layer arranged directly over the bump feature, wherein the anti-stiction layer has outermost sidewalls that are disposed laterally between sidewalls of the dielectric material facing the bump feature; and
a conductive layer disposed laterally and vertically directly between the bump feature and the anti-stiction layer.

10. The MEMS apparatus of claim 9 , wherein the outermost sidewalls of the anti-stiction layer are separated from the dielectric material by one or more non-zero distances that are directly over the conductive routing layer.

11. The MEMS apparatus of claim 9 , further comprising:
one or more conductive vias extending vertically through the bump feature, wherein the anti-stiction layer continuously extends over topmost surfaces of the bump feature and the one or more conductive vias.

12. The MEMS apparatus of claim 9 , further comprising: a second anti-stiction layer directly contacting a lower surface of the MEMS substrate that is directly over the bump feature.

13. The MEMS apparatus of claim 12 , wherein the anti-stiction layer physically contacts the bump feature directly below the second anti-stiction layer.

14. The MEMS apparatus of claim 9 , wherein the outermost sidewalls of the anti-stiction layer are directly over a topmost surface of the conductive routing layer.

15. A microelectromechanical systems (MEMS) apparatus, comprising:
a base substrate;
a bump feature over the base substrate;
a second bump feature over the base substrate, wherein the second bump feature is a closest neighboring bump feature of the bump feature;
a bonding structure disposed over the base substrate, wherein the bonding structure laterally surrounds the bump feature;
a MEMS substrate bonded to the base substrate by way of the bonding structure, wherein the MEMS substrate comprises a moveable MEMS device over the bump feature; and
an anti-stiction layer arranged directly over and along one or more sidewalls of the bump feature and the second bump feature, wherein the anti-stiction layer is discontinuous between the bump feature and the second bump feature.

16. The MEMS apparatus of claim 15 ,
wherein the anti-stiction layer continuously extends from directly over the bump feature to an outer sidewall that is coupled to a bottom of the anti-stiction layer; and
wherein the outer sidewall is laterally between the bump feature and the second bump feature and laterally separated from the bump feature by a non-zero lateral distance.

17. The MEMS apparatus of claim 15 , wherein the anti-stiction layer extends along a first sidewall, but not an opposing second sidewall, of the bump feature.

18. The MEMS apparatus of claim 15 , wherein the anti-stiction layer is asymmetrically disposed over the bump feature.

19. The MEMS apparatus of claim 15 , wherein the anti-stiction layer has opposing outermost sidewalls that both vertically extend to above a top of the bump feature.

20. The MEMS apparatus of claim 15 , further comprising:
a conductive routing layer having a top surface that continuously extends from directly below the bump feature to directly below the second bump feature.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chang Kuei-Sung
• Lai Fei-Lung
• Tsai Shang-Ying
• Hsieh Cheng Yu

Classifications

• B81B2201/0242

  Gyroscopes · CPC title

• B81C1/00349

  Creating layers of material on a substrate · CPC title

• B81C1/00984

  Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976 · CPC title

• B81C1/0096

  For avoiding stiction when the device is in use, i.e. after manufacture has been completed · CPC title

• B81C2203/036

  Fusion bonding · CPC title