Photosensor package, photosensor device, and electronic module
US-2019305170-A1 · Oct 3, 2019 · US
US11538968B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11538968-B2 |
| Application number | US-202016839932-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 3, 2020 |
| Priority date | Apr 9, 2019 |
| Publication date | Dec 27, 2022 |
| Grant date | Dec 27, 2022 |
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A display device and a manufacturing method of a display device are provided. A display device includes a base substrate; an electrode on the base substrate, a light emitting element on the base substrate and electrically connected to the electrode, and a solution layer between the base substrate and the light emitting element, the solution layer including a light blocking material.
Opening claim text (preview).
What is claimed is: 1. A display device comprising: a base substrate; an electrode on the base substrate; a light emitting element on the base substrate and electrically connected to the electrode, the light emitting element comprising a main body part and a contact part, the contact part being in contact with the electrode so as to be electrically connected to the electrode; and a solution layer between the base substrate and the light emitting element and in direct contact with the contact part, wherein the solution layer comprises a solvent and a light blocking material dispersed or decomposed in the solvent. 2. The display device of claim 1 , wherein the solution layer surrounds the contact part. 3. The display device of claim 2 , wherein the electrode comprises a first electrode and a second electrode spaced apart from the first electrode, and the contact part comprises: a first contact part connected to the first electrode; and a second contact part connected to the second electrode. 4. The display device of claim 3 , wherein the light emitting element further comprises: a base layer; a first semiconductor layer on the base layer; a second semiconductor layer on the first semiconductor layer; a first element electrode on the second semiconductor layer and connected to the first contact part; and a second element electrode on the first semiconductor layer and connected to the second contact part. 5. The display device of claim 4 , wherein the light emitting element further comprises an element insulation layer covering at least a part of the first element electrode and the second element electrode, and the solution layer is in contact with the first contact part, the second contact part, and the element insulation layer. 6. The display device of claim 1 , wherein the electrode comprises gold or copper. 7. The display device of claim 1 , wherein the solution layer comprises a water-soluble solvent and a sodium salt dissolved in the water-soluble solvent, wherein the sodium salt has a black color. 8. The display device of claim 1 , wherein the solution layer comprises an organic solvent and a black organic pigment dispersed in the organic solvent. 9. The display device of claim 1 , further comprising: a pixel definition layer on the base substrate and covering a part of the electrode, wherein an opening which exposes a portion other than the part of the electrode is defined in the pixel definition layer, and the light emitting element and the solution layer are located in the opening. 10. The display device of claim 1 , wherein the light emitting element is a micro LED element. 11. The display device of claim 1 , further comprising a planarization layer on the light emitting element and the solution layer. 12. The display device of claim 2 , wherein the contact part comprises tin, and further comprises at least one of copper, silver, or gold. 13. A manufacturing method of a display device, the manufacturing method comprising: forming an electrode on a base substrate; forming a solution layer by providing a solution comprising a solvent and a light blocking material dispersed or decomposed in the solvent on the electrode; transferring a light emitting element into the solution layer such that the solution layer is in direct contact with a contact part of the light emitting element and the contact part is in contact with the electrode so as to be electrically connected to the electrode; and bonding the light emitting element with the electrode by applying light or heat to a part at which the light emitting element is connected to the electrode. 14. The manufacturing method of claim 13 , wherein the electrode comprises copper or gold, the contact part comprises tin, and during the applying the light or the heat, the contact part is bonded with the electrode. 15. The manufacturing method of claim 13 , wherein, during the forming of the electrode, a first electrode and a second electrode spaced apart from the first electrode are formed, the contact part comprises a first contact part, and a second contact part spaced apart from the first contact part, and during the transferring of the light emitting element, the transferring is performed such that the first contact part is connected to the first electrode, and the second contact part is connected to the second electrode. 16. The manufacturing method of claim 13 , wherein, during the transferring of the light emitting element, the transferring is performed such that the contact part and the electrode are entirely covered with the solution layer. 17. The manufacturing method of claim 13 , further comprising removing the solution layer, after the bonding of the light emitting element and the electrode. 18. The manufacturing method of claim 13 , further comprising: forming, on the base substrate, a pixel definition layer covering a part of the electrode, wherein, during the transferring of the light emitting element, the light emitting element is transferred into an opening of the pixel definition layer, the opening being defined to expose a portion other than the part of the electrode. 19. The manufacturing method of claim 13 , wherein, during the bonding of the light emitting element and the electrode, the part at which the light emitting element is connected to the electrode is irradiated with light through an infrared laser, or is applied with heat through at least one of an IR reflow oven, a convection oven, or a hot plate. 20. The display device of claim 1 , wherein the solution layer is in direct contact with the main body part and covers a bottom surface and a part of a side surface of the main body part.
Package configurations · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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