Method of electrochemically processing a substrate and integrated circuit device

Patent metadata

Field	Value
Publication number	US-11538689-B2
Application number	US-201916980117-A
Country	US
Kind code	B2
Filing date	Mar 22, 2019
Priority date	Mar 23, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A substrate has a front side including an electrical circuit and a rear side including an exposed zone that faces the electrical circuit. In an electrochemical treatment step, an electrical potential is laterally applied at least to the exposed zone of the rear side of the substrate, while the exposed zone is in contact with a chemically reactive substance. The electrical potential causes a lateral flow of electrical current at least in the exposed zone of the substrate. The lateral flow of current and the chemically reactive substance alter the substrate in at least the exposed zone.

First claim

The invention claimed is:

1. A method of processing a substrate having a front side comprising an electrical circuit and a rear side comprising an exposed zone that faces the electrical circuit, the method comprising:
electrochemically treating the substrate by laterally applying an electrical potential at least to the exposed zone on the rear side of the substrate, while the exposed zone is in contact with a chemically reactive substance, the electrical potential causing an electrical current that flows laterally in the exposed zone and passes through the chemically reactive substance, so that the electrical current and the chemically reactive substance alter the substrate starting from the exposed zone on the rear side inwardly toward the front side.

2. The method of processing a substrate according to claim 1 , wherein the electrical potential is laterally applied at least to the exposed zone on the rear side of the substrate by means of:
an electrode arrangement disposed on the rear side of the substrate; and
an electrode arrangement within the chemically reactive substance that faces the exposed zone on the rear side of the substrate.

3. The method of processing a substrate according to claim 2 , wherein the electrode arrangement within the chemically reactive substance has a shape that causes the electrical potential to be applied to the exposed zone in a non-homogenous fashion.

4. The method of processing a substrate according to claim 2 , wherein the electrode arrangement within the chemically reactive substance has a shape that changes at least one time during the electrochemically treating.

5. The method of processing a substrate according to claim 2 , wherein the electrode arrangement within the chemically reactive substance comprises an array of electrodes, whereby, during the electrochemically treating, at least a part of respective voltages applied to respective electrodes in the array of electrodes changes at least one time during the electrochemically treating.

6. The method of processing a substrate according to claim 2 , wherein the exposed zone on the rear side of the substrate comprises at least one electrochemical treatment cell, an electrochemical treatment cell comprising a set of cavities disposed around an electrode that forms part of the electrode arrangement on the rear side of the substrate, wherein, during the electrochemically treating, the chemically reactive substance enters the set of cavities.

7. The method of processing a substrate according to claim 1 , wherein, during the electrochemically treating, the electrical potential is laterally applied to the exposed zone in a non-homogenous fashion in at least one of the following dimensions: space and time, so as to define at least one of the following characteristics: a volume within the substrate where the substrate is altered, a varying degree of alteration throughout the volume, and a varying form of alteration throughout the volume.

8. The method of processing a substrate according to claim 1 , wherein the substrate comprises, at least in the exposed zone, a material that, when in contact with the chemically reactive substance while an electrical current flows through the material, alters depending on radiation applied to the material, wherein, during the electrochemically treating, radiation is non-homogenously applied to the exposed zone.

9. The method of processing a substrate according to claim 1 , wherein the substrate comprises an alteration stop layer at least disposed between the electrical circuit at the front side and the exposed zone on the rear side, the alteration stop layer comprising a material that is relatively resistant to the chemically reactive substance.

10. The method of processing a substrate according to claim 9 , wherein the alteration stop layer comprises a semiconductor material.

11. The method of processing a substrate according to claim 1 , wherein the substrate comprises an electrically insulating layer disposed between the electrical circuit at the front side and the rear side.

12. The method of processing a substrate according to claim 11 , wherein the electrically insulating layer is disposed between the electrical circuit at the front side and alteration stop layer.

13. The method of processing a substrate according to claim 1 , wherein the lateral flow of current and the chemically reactive substance cause pores to be formed in the substrate inwardly from at least the exposed zone.

14. An integrated circuit device that includes a substrate having a front side comprising an electrical circuit and a rear side in which a zone faces the electrical circuit, whereby the substrate has been altered by applying a method in accordance with claim 1 at least in a volume comprised between the electrical circuit and the zone in the rear side that faces the electrical circuit.

15. The integrated circuit device according to claim 14 , wherein the volume comprises pores.

Assignees

• Univ Catholique Louvain

Inventors

• Scheen Gilles
• Raskin Jean-Pierre
• Rasson Jonathan

Classifications

• C25F3/12 Primary

  of semiconducting materials · CPC title

• C25F7/00

  Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating · CPC title

• H10P95/80

  Electrical treatments, e.g. for electroforming · CPC title

• H10P90/124

  by processing the backside of the wafers · CPC title

• H10P90/15

  by making porous regions on the surface · CPC title