Heatsink structures for heat-assisted magnetic recording heads

Patent metadata

Field	Value
Publication number	US-11538496-B2
Application number	US-202117319444-A
Country	US
Kind code	B2
Filing date	May 13, 2021
Priority date	Jul 24, 2019
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

First claim

What is claimed is:

1. A recording head, comprising:
a write pole extending to an air-bearing surface;
a near-field transducer positioned proximate a first side of the write pole in a down-track direction, the near-field transducer comprising a peg coupled with a bottom portion having a first shape; and
a heatsink structure adjacent and coupled to the bottom portion and positioned between the near-field transducer and the write pole, the heatsink structure having a first surface having a second shape corresponding to the first shape and an opposing surface that is sloped toward the first surface;
wherein the heatsink structure comprises a back surface positioned distal the air-bearing surface, wherein the back surface is disposed at an angle with respect to the near-field transducer in a down-track direction and extends away from the air-bearing surface.

2. The recording head of claim 1 , wherein the opposing surface extends at a slope in a direction normal to the air-bearing surface and beyond the first shape of the bottom portion.

3. The recording head of claim 1 , further comprising a middle disc having a third shape corresponding to the second shape and positioned between the bottom portion and the first surface of the heatsink structure.

4. The recording head of claim 1 , wherein the heatsink structure has a first thickness proximate the air-bearing surface and a second thickness, greater than the first thickness, distal the air-bearing surface.

5. The recording head of claim 1 , further comprising first and second mirror portions forming a mirror and surrounding the near-field transducer in a cross-track direction with a gap therebetween, the mirror extending in the direction normal to the air-bearing surface a first distance that is less than a second distance that the near-field transducer extends in the direction normal to the air-bearing surface, wherein the heatsink structure is coupled to the mirror.

6. The recording head of claim 1 , wherein the heatsink structure and the bottom portion comprise the same material.

7. The recording head of claim 1 , wherein the heatsink structure comprises gold.

8. The recording head of claim 1 , wherein the heatsink structure is coupled to at least one other heatsink structure.

9. The recording head of claim 1 , wherein the heatsink structure comprises a front surface parallel to the air-bearing surface.

10. A recording head, comprising:
a write pole extending to an air-bearing surface;
a near-field transducer positioned proximate a first side of the write pole in a down-track direction, the near-field transducer comprising a peg coupled with a bottom portion having a first shape; and
a heatsink structure adjacent and coupled to the bottom portion and positioned between the near-field transducer and the write pole, the heatsink structure having a first surface having a second shape corresponding to the first shape and forming a wedge shape with a second surface that is sloped toward the first surface in a direction toward the air-bearing surface;
wherein the heatsink structure comprises a back surface positioned distal the air-bearing surface, wherein the back surface is disposed at an angle with respect to the near-field transducer in a down-track direction and extends away from the air-bearing surface.

11. The recording head of claim 10 , wherein the second surface extends into the head distal the air-bearing surface at a slope normal to the air-bearing surface and beyond the first shape of the bottom portion.

12. The recording head of claim 10 , further comprising a middle disc having a third shape corresponding to the second shape and positioned between the bottom portion and the first surface of the heatsink structure.

13. The recording head of claim 10 , further comprising first and second mirror portions forming a mirror and surrounding the near-field transducer in a cross-track direction with a gap therebetween, the mirror extending in the direction normal to the air-bearing surface a first distance that is less than a second distance that the near-field transducer extends in the direction normal to the air-bearing surface, wherein the heatsink structure is coupled to the mirror.

14. The recording head of claim 10 , wherein the heatsink structure and the bottom portion comprise the same material.

15. The recording head of claim 10 , wherein the heatsink structure comprises gold.

16. The recording head of claim 10 , wherein the heatsink structure is coupled to at least one other heatsink structure.

17. The recording head of claim 10 , wherein the heatsink structure comprises a front surface parallel to the air-bearing surface.

Assignees

• Seagate Technology Llc

Inventors

• Habibi Helene Parwana
• Bance Simon
• Mcgarry Martin Liam
• Andruet Raul Horacio
• Blaber Martin Giles
• Chen Weibin
• Duda John Charles
• Gubbins Mark Anthony
• Hutchinson Erik Jon
• Krishnamurthy Vivek
• Seigler Michael Allen
• Wang Chen

Classifications

• G11B5/3136

  for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials · CPC title

• G11B5/3133

  including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title

• G11B5/3116

  Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks (G11B5/3113, G11B5/245 take precedence) · CPC title

• G11B11/24

  using recording by near-field interactions · CPC title

• G11B5/3106

  where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination (G11B5/3133 takes precedence) · CPC title