Thermally robust near-field transducer peg

US9728209B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9728209-B2
Application numberUS-201615163035-A
CountryUS
Kind codeB2
Filing dateMay 24, 2016
Priority dateMay 27, 2015
Publication dateAug 8, 2017
Grant dateAug 8, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A near-field transducer includes first and second stacked base portions having a common outline shape. The second base portion is proximate alight delivery structure. A peg extends from the first base portion towards a media-facing surface. The peg includes a material that is more thermally robust than a plasmonic material of the base portion. The peg has a peg thickness that is less than a thickness of the first base portion. The first base portion has a first recess proximate the peg. The first recess separates the first base portion from the media-facing surface and exposes at least a top side of the peg.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a near-field transducer comprising: first and second stacked base portions comprising a common outline shape, the second base portion being proximate a light delivery structure, the first and second base portions formed of a plasmonic material; a peg extending from the first base portion towards a media-facing surface, the peg comprising a peg material that is more thermally robust than the plasmonic material, the peg having a peg thickness that is less than a thickness of the first base portion, the first base portion comprising a first recess proximate the peg, the first recess separating the first base portion from the media-facing surface and exposing at least a top side of the peg; and a heat sink proximate the first base portion, the heat sink comprising an angled surface that is proximate to a write pole. 2. The apparatus of claim 1 , wherein the peg comprises a taper such that a first cross-section of the peg proximate the media surface is smaller than a second cross-section of the peg proximate the first base portion. 3. The apparatus of claim 1 , wherein the heat sink is formed of the plasmonic material. 4. The apparatus of claim 1 , wherein an end of the second base portion is separated from the media-facing surface by a second recess, the first recess being larger than the second recess. 5. The apparatus of claim 1 , wherein the first recess extends through a full thickness of the first base portion such that sides of the peg are exposed. 6. The apparatus of claim 1 , wherein the same outline shape comprises a stadium shape. 7. The apparatus of claim 1 , wherein the peg material comprises a refractory material. 8. The apparatus of claim 1 , wherein the peg material comprises at least one of Rh, Ir, Pt, Pd, W, Ru, ZrN, and TiN. 9. The apparatus of claim 1 , further comprising: a waveguide core proximate the second base portion of the near-field transducer; and a plasmonic disc proximate a surface of the waveguide core that faces away from the near-field transducer, wherein a first projection of the plasmonic disc onto a substrate-parallel plane overlaps a second projection of the near-field transducer onto the substrate parallel plane. 10. The apparatus of claim 1 , wherein the peg extends from a center of the first base portion towards the media-facing surface. 11. The apparatus of claim 10 , wherein the peg has a flared end near the center of the base portion, the flared end improving at least one of adhesion and plasmonic coupling between the peg and base portion. 12. An apparatus comprising: a near-field transducer comprising: a base portion formed of a plasmonic material; a peg embedded within the base portion and extending from a center of the base portion towards a media-facing surface, the peg comprising a peg material that is more thermally robust than the plasmonic material, the peg having a flared end near the center of the base portion, the flared end improving at least one of adhesion and plasmonic coupling between the peg and base portion; and a heat sink on a major surface of the base portion, the heat sink comprising an angled surface that is proximate to a write pole. 13. The apparatus of claim 12 , wherein the peg has thickness that is less than that of the base portion, the base portion comprising a recess proximate the peg, the recess separating the base portion from the media-facing surface and exposing at least a top side of the peg. 14. The apparatus of claim 12 , further comprising: a waveguide core proximate the base portion of the near-field transducer; and a plasmonic disc proximate a surface of the waveguide core that faces away from the near-field transducer, wherein a first projection of the plasmonic disc onto a substrate-parallel plane overlaps a second projection of the near-field transducer onto the substrate parallel plane. 15. An apparatus comprising: a near-field transducer comprising: a base portion having first and second concentric sections that are formed of first and second materials, at least one of the first and second materials comprising a plasmonic material; a peg extending from the base portion towards a media-facing surface, the peg comprising a peg material that is more thermally robust than the plasmonic material; and a heat sink on a major surface of the base portion, the heat sink comprising an angled surface that is proximate to a write pole. 16. The apparatus of claim 15 , wherein the peg has thickness that is less than that of the base portion, the base portion comprising a recess proximate the peg, the recess separating the base portion from the media-facing surface and exposing at least a top side of the peg. 17. The apparatus of claim 15 , wherein the peg extends from a center of the first base portion towards the media-facing surface. 18. The apparatus of claim 17 , wherein the peg has a flared end near the center of the base portion, the flared end improving at least one of adhesion and plasmonic coupling between the peg and base portion. 19. The apparatus of claim 15 , further comprising: a waveguide core proximate the base portion of the near-field transducer; and a plasmonic disc proximate a surface of the waveguide core that faces away from the near-field transducer, wherein a first projection of the plasmonic disc onto a substrate-parallel plane overlaps a second projection of the near-field transducer onto the substrate parallel plane.

Assignees

Inventors

Classifications

  • Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks (G11B5/3113, G11B5/245 take precedence) · CPC title

  • including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title

  • Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

  • G11B5/314Primary

    where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

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What does patent US9728209B2 cover?
A near-field transducer includes first and second stacked base portions having a common outline shape. The second base portion is proximate alight delivery structure. A peg extends from the first base portion towards a media-facing surface. The peg includes a material that is more thermally robust than a plasmonic material of the base portion. The peg has a peg thickness that is less than a thi…
Who is the assignee on this patent?
Seagate Technology Llc
What technology area does this patent fall under?
Primary CPC classification G11B5/314. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).